SYSTEMS-8020665-REV_K.pdf - 第8页
Indust r y 4. 0 Intelligent Se lf- Learning , S elf-Adjusting Zero De fe c t Line Smar t F ac tor y S olution 3 C yberOpt ics oe rs a ran ge of u niq ue va lue-add s oft war e solutions th at enable aut omation, reduc e…
Faster, Highly Accurate Coordinate
Measurement (CMM) Suite
CyberCMM™, a comprehensive software suite of coordinate
measurement tools provides highly accurate, 100% metrology-grade
measurement on all critical points much faster than a traditional CMM,
including coplanarity, distance, height and datum X, Y to name a few.
A fast and easy set-up can be performed with the world’s rst in-line
CMM system for programming complex applications as compared
to slow, engineering resource-intensive set-up that typically requires
multiple adjustments with traditional coordinate measurement
machines (CMMs).
Fast and highly accurate with repeatable and reproducible coordinate
measurements for SMT, semiconductor, microelectronics and metrology
applications.
SQ3000 oers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reections caused
by shiny components. Eective suppression of multiple reections is critical for true height measurement making MRS an ideal technology
solution for a wide range of applications including those with very high quality requirements.
CyberOptics has advanced the proprietary Multi-Reection Suppression (MRS) sensor to an even ner resolution. The Ultra-High Resolution
MRS sensor enhances the SQ3000 3D CMM platform, delivering superior inspection performance, ideally suited for socket metrology,
machined parts inspection, microelectronics and SMT applications where an even greater degree of accuracy and inspection reliability is
critical.
Fastest - Seconds, not Hours
• Signicantly speeds attaining coordinate
measurements vs. traditional CMMs
• Reduces engineering resource time
Easy-to-use Interface
• Simplies process with award-winning, intuitive, touch
screen experience
• Quick programming for complex applications
• Multi-process capable - AOI, SPI, AOM, CMM
Metrology Grade Accuracy
• Achieve metrology-grade accuracy with MRS-enabled
technology
• Repeatable and reproducible measurements for SMT,
semiconductor, microelectronics and metrology
applications
Coordinate Measurement (CMM)
The World’s First In-Line CMM - Ultimate in Speed and Accuracy for
SMT, Semiconductor, Microelectronics and Metrology Applications
CMM SYSTEMS
SQ3000™
|
3D CMM
• World’s rst in-line CMM system
• Delivering metrology grade accuracy at
production speed, powered by MRS Technology
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CMM Capabilities
SQ3000 3D CMM provides measurement capabilities across
a wide variety of applications.
• Line / Distance / X,Y / Mid Line
• Inter Point / Regression Shifted
• Datum X,Y / LSF X,Y Oset
• X,Y Oset / Value / Location / List of X,Y Values
• Height / Local Height / Regression / Radius
• Coplanarity / Distance to Plane / 2nd Order Fitting
• Dierence / Absolute / 2sqrt / VC
• Max / Min / Ave / Sigma / Plus / Minus / Multiply
Solder Ball and Bump
Industrial/ Machined PartsSocket Metrology
Industry 4.0
Intelligent Self-Learning, Self-Adjusting Zero Defect Line
Smart Factory Solution
3
CyberOptics oers a range of unique value-add software
solutions that enable automation, reduce rework costs,
minimize scrap and optimize print process.
CyberOptics Software Solutions provides our customers and
partners the best added-value possible for inspection and
measurement in electronics manufacturing.
Save Time, Save Expense and Improve Yields with
CyberOptics’ Powerful Value-Add Solutions
SPI Pre Reow AOI Post Reow AOI
Enables smarter and faster inspection
• Reduce training eorts and minimize operator interaction saving time and cost with the
powerful yet simple software with intuitive multi-touch interface and 3D visualization tools.
• Optimize printing process, establish stencil cleaning cycles and ne-tune printer set-up.
• Gain the power to do more with SPI results with closed loop feedback.
• Improve the solderability of smaller components by using the printing oset data for
compensating parts placement with forward capability.
Automatically optimizes the print process by proactively analyzing
current trend data.
• Improve yields and reduce downtime with its predictive process improvement capability.
• Get started quickly with pre-dened templates
• Customize with customizable rules for specic product needs.
Enables smarter and faster inspection
• Ultra-fast programming capabilities, auto tuning and enhancements that signicantly
speed setup, simplify the process, reduce training eorts and minimize operator
interaction.
• Speed programming and performance with AI (Autonomous Image Interpretation)
technology for set-up in <13 minutes with a data-rich, pre-loaded library and
automated scripts that collect and update models all on their own.
A complete Statistical Process Control (SPC), oers full-edged
machine-level to factory-level SPC capability to improves yields
• Attain eective process verication and control with traceability.
• Identify trends and enhance line yields with real-time monitoring tools for historical analysis
and reporting.
• Reduce training with easy-to-set-up intuitive interface that facilitates quick learning.
• Achieve fast parsing and charting speed with the robust and scalable software, while enabling
an extremely compact database size.
Enables smarter and faster coordinate measurement (Add-on)
• Extensive suite of CMM tools for precise measurement of critical features
• Signicantly speed measurements compared to traditional CMM systems, with high accuracy
and repeatability
• Multi-process capable – 3D AOI, 3D AOM, 3D CMM
As members and participants in the IPC-Connected
Factory Initiative and The Hermes Standard, CyberOptics
is committed to advancing machine-to-machine
communication in SMT assembly and maximize line
throughput and traceability in an open protocol.
INDUSTRY 4.0
Packaging SMT
Through Hole
Mobile Phone SMT
Memory SMT
Medical SMT
Automotive SMT - Pins
Application Examples
Expanding Capabilities for Multiple Industries
Powered by
MRS™ Technology
APPLICATIONS
Mini/ MicroLED Inspection
BGA/ Solder Ball and Bump
Industrial/ Machined Parts
Inspection and Metrology
Capabilities
Component Types Inspected
• Standard SMT (chips, J-lead, gull-wing, BGA, etc.),
through-hole, odd-form, clips, connectors, header pins,
and more
Component Defects
• Missing, polarity, tombstone, billboard, ipped, wrong
part, gross body and lead damage, and more
Solder Joint and Other Defects
• Gold nger contamination, excess solder, insucient
solder, bridging, through-hole pins
3D Measurement Inspection
• Lifted Lead, package coplanarity, polarity dimple and
chamfer identication
Solder Paste Inspection
• Height, area, volume, registration and bridge detection
Coordinate Measurement Capability
• Line / Distance / X,Y / Mid Line, Inter Point / Regression
Shifted, Datum X,Y / LSF X,Y Oset, X,Y Oset / Value
/ Location / List of X,Y Values, Height / Local Height /
Regression / Radius, Coplanarity/ Distance to plane / 2nd
Order tting, Dierence / Absolute / 2sqrt / VC, Max /
Min / Ave / Sigma / Plus / Minus / Multiple
Automated Optical Inspection
Solder Paste Inspection
Coordinate Measurement - Socket Metrology
Semiconductor Applications
Copper Pillar Micro Bumps Flip Chip (c4)