SYSTEMS-8020665-REV_K.pdf - 第4页

Intuitive, Easy-to -u se Sof t ware The multi-award winning SQ3 00 0 A OI sof t ware is a more powerful yet ex tremely simple sof tware designed w ith an in tuitive in ter face. Inc luding multi-touch cont rols, 3D image…

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QX150i™
|
2D AOI
High-Value, Flexible for All Applications
• Strobed Inspection Module (SIM)
• Ideally suited for pre-reow and selective solder
joint inspection
QX150i™ B, QX150™ Tabletop, Large Board and Dual Lane options available
SIM (Strobe Inspection Module)
01005 component size inspection capability
Active Pixel Marking Selective Soldering Inspection
Floating Pin
Missing Pin
Pre-Reow Inspection
OK
NG
Intelligent Ranking of Examples Components Inspected / Detected
AOI SYSTEMS
Automated Optical Inspection (AOI)
High Value - Flexible Inspection 2D AOI Technology
MX600™
|
2D AOI for FVI
Best Performance + Lower Cost of Ownership
• 2 Strobed Inspection Modules (SIM)
• Automated Final Vision Inspection (FVI) for singulated
memory modules
QX250i™
|
2D AOI
Fast, Flexible, High-Performance
• 2 Strobed Inspection Modules (SIM)
• Shortens production line and delivers ~50%
productivity improvement vs. single SIM
• Ideally suited for pre-reow
QX600™
|
2D AOI
Ultra-Fast, Ultra-Versatile
• Strobed Inspection Module (SIM)
• Best-in-Class 01005 and solder joint
inspection
2D AOI Sensor Technology - High-speed,
On-the-y Inspection
The SIM (Strobed Inspection Module) is at the core of every CyberOptics’ 2D AOI
system. Designed and manufactured exclusively by CyberOptics, the SIM delivers
high performance inspection at 200cm/sec on the QX600.
The SIM is designed with enhanced illumination using LED lighting - delivering the
best 01005 and solder joint performance ever. With an 80/150 Megapixel sensor and
higher resolution (12µm), you get crisp, perfect quality images for more accurate
defect review. The capabilities shown below are achieved with CyberOptics’ 2D and
3D AOI systems.
Memory Module Post-Test
Defect Types, Pre-Shipping
Inspection
Inspection Capability includes:
- Components Edge
- Damage PCB Corner
- Goldnger Discolored / Burnt / Badly Scratched
- Gold tab inspection - Lifted tie bar, burnt, contamination
- Physically Damaged Components
Intuitive, Easy-to-use Software
The multi-award winning SQ3000 AOI software is a more powerful yet
extremely simple software designed with an intuitive interface. Including
multi-touch controls, 3D image visualization tools and ultra-fast programming
capabilities that brings ease-of-use to a completely new level, which reduces
training eorts and minimizes operator interaction - saving time and cost.
AI
2
- Superior in Programming &
Performance
CyberOptics AI
2
(Autonomous Image Interpretation) technology is all about
keeping it simple - no parameters to adjust or algorithms to tune. And, you do
not need to anticipate defects or pre-dene variance either - AI
2
does it all for
you. With AI
2
, you have the power to inspect the most comprehensive list of
features and identify the widest variety of defect types - including those that
you least expect.
Perfect for those high-mix or low volume applications. With its unique ability
to ‘ignore’ bad examples in a model, AI
2
oers precise discrimination even with
excessive variance and minimizes eects of outlier examples. The pixel marking
feature highlights defective spots, so you can identify genuine defects instantly.
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
AOI SYSTEMS
Award-Winning AOI Software
Faster, Simpler and Smarter
CyberReport™ - Fast, Scaleable SPC Solution
CyberReport oers full-edged machine-level to factory-level SPC capability with powerful historical analysis and reporting tools
delivering complete traceability for process verication and yield improvement. CyberReport is easy to setup and simple to use while
providing fast charting with a compact database size.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
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PRINTOPTIMIZER
Faster, Highly Accurate Coordinate
Measurement (CMM) Suite
CyberCMM™, a comprehensive software suite of coordinate measurement tools provides highly accurate, 100% metrology-
grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and
datum X, Y to name a few.
A fast and easy set-up can be performed with the world’s rst in-line CMM system for programming complex applications
as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional
coordinate measurement machines (CMMs).
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Enable Smarter, Faster Inspection
Speed programming and tuning with new capabilities including AutoTeach,
AutoTune and AutoDene for faster set-up and to simplify process.
• New body inspection settings and lead inspection settings; automatically
teaches from the height map what parts are loaded based upon CAD data.
Lead inspection settings include 3D area measurement.
• New gap inspection settings; blob analysis - looks at height in between leads
beyond using an image
• New AutoDene Feature; automatically detects and adds inspection features
including leads and gaps by drawing a box around the package or component
• New AutoFeatureSet and AutoTune; adds body, leads and gaps inspection
features to training set data. AutoTune sets nominals for the specic package.
Sample Report
Failed Model
Passed Model
AutoDene Example
SE600™
|
High Precision
• Dual illumination sensor
• Inspection speed up to 108cm
2
/sec.
• SE600-X available with Large Board capability
SE500™ULTRA
|
High Speed
• High-speed single illumination sensor
• All-in-one scan
• On the y measurement at 210cm
2
/sec.
3D SPI Sensor Technology - Fast, Accurate Performance
Designed and built by CyberOptics, the sensor is manufactured as an integrated unit with no moving parts – which means no machine-
to-machine variation either. Plus, there is no drift over time, no parts to wear and absolutely no recalibration needed. The Dual
Illumination Sensor comes standard with the SE600.
For improved repeatability on smallest paste deposits, you can choose from the ULTRA and Dual Illumination sensor options on the
SE500ULTRA. Pads as small as 100 microns (4 mils) can be accurately measured with the MicroPad sensor. And, it is easy to swap with the
standard sensor too – so you can plug-and-play whenever you need to.
Dual Illumination SensorULTRA Sensor
Solder Paste Inspection (SPI)
Ultimate Precision Accuracy with World-Class Usability
SE3000™
|
3D SPI
A Leap Forward in Solder Paste Inspection
• MRS Sensor for metrology grade accuracy at production
speed
• Enables unrivaled GR&R
• SE3000™ X available for Large Board capability
SE3000™ DD
|
3D SPI
Dual Lane - Dual Sensor
• Dual MRS sensors delivers metrology grade
accuracy at production speed
• Flexibility to switch from dual to single lane
for large boards
• SE3000™ D Dual Lane option available
MRS Technology for 3D SPI
The SE3000 SPI System brings the revolutionary MRS technology to solder paste
inspection delivering higher performance in accuracy and precision. Eective
suppression of multiple reections is critical for highly accurate measurements,
making MRS an ideal technology solution for a wide range of applications
including those with very high quality requirements.
CyberOptics MRS Sensor architecture, extended from the award-winning SQ3000
AOI platform, has been designed for use in solder paste inspection applications.
The unique sensor architecture with multi-view 3D sensors and a parallel
projector, simultaneously captures and transmits multiple images in parallel
while proprietary 3D fusing algorithms merge the images together, delivering
metrology grade accuracy at production speed.
SPI SYSTEMS