SYSTEMS-8020665-REV_K.pdf - 第6页
C yb erOptics’ sof tware delivers world-class user experience wit h its intuitiv e interface that is ex tremely stable and simple to use, enabling the shor test learning curve. With full multi-touch experience, SPI sof t…
SE600™
|
High Precision
• Dual illumination sensor
• Inspection speed up to 108cm
2
/sec.
• SE600-X available with Large Board capability
SE500™ULTRA
|
High Speed
• High-speed single illumination sensor
• All-in-one scan
• On the y measurement at 210cm
2
/sec.
3D SPI Sensor Technology - Fast, Accurate Performance
Designed and built by CyberOptics, the sensor is manufactured as an integrated unit with no moving parts – which means no machine-
to-machine variation either. Plus, there is no drift over time, no parts to wear and absolutely no recalibration needed. The Dual
Illumination Sensor comes standard with the SE600.
For improved repeatability on smallest paste deposits, you can choose from the ULTRA and Dual Illumination sensor options on the
SE500ULTRA. Pads as small as 100 microns (4 mils) can be accurately measured with the MicroPad sensor. And, it is easy to swap with the
standard sensor too – so you can plug-and-play whenever you need to.
Dual Illumination SensorULTRA Sensor
Solder Paste Inspection (SPI)
Ultimate Precision Accuracy with World-Class Usability
SE3000™
|
3D SPI
A Leap Forward in Solder Paste Inspection
• MRS Sensor for metrology grade accuracy at production
speed
• Enables unrivaled GR&R
• SE3000™ X available for Large Board capability
SE3000™ DD
|
3D SPI
Dual Lane - Dual Sensor
• Dual MRS sensors delivers metrology grade
accuracy at production speed
• Flexibility to switch from dual to single lane
for large boards
• SE3000™ D Dual Lane option available
MRS Technology for 3D SPI
The SE3000 SPI System brings the revolutionary MRS technology to solder paste
inspection delivering higher performance in accuracy and precision. Eective
suppression of multiple reections is critical for highly accurate measurements,
making MRS an ideal technology solution for a wide range of applications
including those with very high quality requirements.
CyberOptics MRS Sensor architecture, extended from the award-winning SQ3000
AOI platform, has been designed for use in solder paste inspection applications.
The unique sensor architecture with multi-view 3D sensors and a parallel
projector, simultaneously captures and transmits multiple images in parallel
while proprietary 3D fusing algorithms merge the images together, delivering
metrology grade accuracy at production speed.
SPI SYSTEMS
CyberOptics’ software delivers world-class user experience with its
intuitive interface that is extremely stable and simple to use, enabling
the shortest learning curve. With full multi-touch experience, SPI
software oers a range of features that enable smarter and faster
inspection:
• Seamless integration of all applications - Teach, Inspection, Defect
Review and Real-time SPC
• Unlimited undo-redo and global search options in Teach
• Loads of smart, informative and relevant charts that provide yield
summary, FPY information, hotspot display, top 10 pad failures,
historical panel and more.
• Easy, hassle-free operation using multi-touch, multi-selection, pinch-zoom
and pan-move options.
Closed Loop/ Feed-forward Ready
Reduce rework costs, increase production throughput and improve quality
CyberOptics’ SPI systems fully support feedback and feed forward capability with leading Solder Paste Printer and SMT
Mounter vendors. Closed loop feedback gives you the power to do more with SPI results – optimize printing process, establish
stencil cleaning cycles and ne-tune printer setup. While feed-forward capability improves the solderability of smaller
components by using the printing oset data for compensating parts placement. All this means reduced rework costs,
increased production throughput and improved quality.
Closed Loop Feedback Feed Forward Ready
Shifted solder
Corrected data of
shifted solder
Gives you the power to do more with SPI results - optimize
printing process, establish stencil cleaning cycles and ne-tune
printer set-up
Improves solderability of smaller components for
reduced rework cost, improved production throughput
and improved quality
All Major Screen
Printers
CyberOptics
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Award-Winning SPI Software
Intuitive Design, Exceptional Usability
CyberPrint OPTIMIZER™
Automatically optimizes the print process by proactively analyzing accurate trend data
– rst-ever in the industry! Pre-dened templates help you get started quickly while
customizable rules support perfect customization for specic product needs. With
its predictive process improvement capability, you can get better yields and reduce
downtime.
SPI SYSTEMS
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Failure analysis drives line optimization and auto tolerance changes
Defect Correlation
SPI AOI AOI
FAIL
FAIL
FAIL
FAIL
FAIL FAIL
PASS PASS
PASS
CyberReport™ - Fast, Scaleable SPC Solution
CyberReport oers full-edged machine-level to factory-level SPC capability with powerful historical analysis and reporting tools
delivering complete traceability for process verication and yield improvement. CyberReport is easy to setup and simple to use while
providing fast charting with a compact database size.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
Sample Report
Faster, Highly Accurate Coordinate
Measurement (CMM) Suite
CyberCMM™, a comprehensive software suite of coordinate
measurement tools provides highly accurate, 100% metrology-grade
measurement on all critical points much faster than a traditional CMM,
including coplanarity, distance, height and datum X, Y to name a few.
A fast and easy set-up can be performed with the world’s rst in-line
CMM system for programming complex applications as compared
to slow, engineering resource-intensive set-up that typically requires
multiple adjustments with traditional coordinate measurement
machines (CMMs).
Fast and highly accurate with repeatable and reproducible coordinate
measurements for SMT, semiconductor, microelectronics and metrology
applications.
SQ3000 oers unmatched accuracy with the revolutionary MRS technology by meticulously identifying and rejecting reections caused
by shiny components. Eective suppression of multiple reections is critical for true height measurement making MRS an ideal technology
solution for a wide range of applications including those with very high quality requirements.
CyberOptics has advanced the proprietary Multi-Reection Suppression (MRS) sensor to an even ner resolution. The Ultra-High Resolution
MRS sensor enhances the SQ3000 3D CMM platform, delivering superior inspection performance, ideally suited for socket metrology,
machined parts inspection, microelectronics and SMT applications where an even greater degree of accuracy and inspection reliability is
critical.
Fastest - Seconds, not Hours
• Signicantly speeds attaining coordinate
measurements vs. traditional CMMs
• Reduces engineering resource time
Easy-to-use Interface
• Simplies process with award-winning, intuitive, touch
screen experience
• Quick programming for complex applications
• Multi-process capable - AOI, SPI, AOM, CMM
Metrology Grade Accuracy
• Achieve metrology-grade accuracy with MRS-enabled
technology
• Repeatable and reproducible measurements for SMT,
semiconductor, microelectronics and metrology
applications
Coordinate Measurement (CMM)
The World’s First In-Line CMM - Ultimate in Speed and Accuracy for
SMT, Semiconductor, Microelectronics and Metrology Applications
CMM SYSTEMS
SQ3000™
|
3D CMM
• World’s rst in-line CMM system
• Delivering metrology grade accuracy at
production speed, powered by MRS Technology
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CMM Capabilities
SQ3000 3D CMM provides measurement capabilities across
a wide variety of applications.
• Line / Distance / X,Y / Mid Line
• Inter Point / Regression Shifted
• Datum X,Y / LSF X,Y Oset
• X,Y Oset / Value / Location / List of X,Y Values
• Height / Local Height / Regression / Radius
• Coplanarity / Distance to Plane / 2nd Order Fitting
• Dierence / Absolute / 2sqrt / VC
• Max / Min / Ave / Sigma / Plus / Minus / Multiply
Solder Ball and Bump
Industrial/ Machined PartsSocket Metrology