A10011-ASM-T53-EN-Spec-TX-micron-DMS.pdf - 第16页

16 Virtual Inkspot Handler (VIH) The virtual inks pot hand ler (VIH) allows you to scan in inkspots from an external system. This option can be use d for external systems to define which panels are to be produced and whi…

PCB warpage

PCB warpage during placement

To avoid impairing the placement quality and

speed, we recommend using a PCB support, so

that the PCB warpage downwards does not

exceed 0.5 mm.

PCB warpage up, max. 2 mm

PCB support

PCB warpage down, max. 2 mm

Changes in the surface position are automatically applied by the functions for learning the height.

Virtual Inkspot Handler (VIH)

The virtual inkspot handler

(VIH) allows you to scan in

inkspots from an external

system.

This option can be used for

external systems to define

which panels are to be

produced and which to be

omitted. A panel is a specific

part of a printed circuit

board. This concept is much

more flexible than the

physical inkspot concept.

It can be integrated into the

ongoing production process,

if external systems

individually decide whether

each panel it is in a good or

bad state and whether

additional processing steps

are to be omitted or not.

The boards are typically

measured by the external

system and the information

about which panels are good

or bad is then available.

The use of this information

via VIH offers the benefit that

no physical inkspots need to

be read by the PCB camera.

This improves performance,

particularly for boards with a

large number of panels.

This option can also be used

if the panels do not have

room for a physical inkspot.

Workflow VIH with XML file

Workflow VIH with MES and BoardGateKeeper (BGK)

Process Data Interfaces (PDI)

The process data interface (PDI), which can be addressed via

the OIB interface, enables you to access not only the trace-

ability data of the components placed but also various process

parameters for the component placement. The PDI makes

over 40 process attributes per placement position available,

such as:

• Pickup (actual pick position, pickup location ID)

• Dipping (result, timestamp)

• Vision measuring (result plus camera ID)

• Placement (actual place position, ref. desig., vacuum val-

ues)

The data packages contain the data for each board and stop-

per position.

Each individual data package contains a maximum of 200

placement positions.

Component feeding

Component trolley

SIPLACE TX micron

The TX micron component

trolleys are independent and

easily maneuverable mod-

ules. Two SIPLACE TX com-

ponent trolleys, each with 40

tracks, can be docked onto

SIPLACE TX machines. The

tape reels are taken up into

the tape container of the

component trolley. A cutting

device on the machine auto-

matically cuts up the used

tape material. The compo-

nent trolleys can be set up

directly on the machine or at

an external setup area with

feeder modules. The benefits

of offline setup are that the

configurations can be pre-

pared without stopping the

line.

This allows the setup change

to be realized very quickly,

using the changeover table

principle, to rapidly change

the component trolleys.

The SIPLACE TX micron

component trolleys also sup-

port fast setting up and tear-

ing down of feeder modules

even during the ongoing

placement process.

Tapes can be spliced without

stopping the machine.

For safety reasons, unoccu-

pied locations are fitted with

so-called dummy feeder

modules.

Component trolleys for SIPLACE TX micron

Tape container

Waste container for remaining

empty tape

Changeover table

Component supply Tracks occupied

SIPLACE TX micron

With C&P20 M2

With CPP M

With CPP M and JTF-ML 2 at location 1

With C&P20 M2 and TF-ML 2 at location 1

38 feeder modules, each with 8mm X

40 feeder modules, each with 8 mm X

28 feeder modules, each with 8 mm X

Tape reel diameter to 330.2 mm (13")

Changeover time for component trolley < 1 minute

Feeder module types Tape feeder modules, LDU 2 X,

SIPLACE Glue Feeder