Operation BWP Issue 2.pdf - 第17页

Issue 2, Nov 14 17 Objectiv es OP 9 - Identify common print def ect s Reference: Fast track process recovery guide, part no. 158546 Although following the proce dures in the operator ma nual carefully will prevent most p…

Issue 2, Nov 14

Objective OP & BWP 8 – Recover from common error messages

Reference: Machine Operator manual

Fast track error recovery guide, part no. 158184

Although following the procedures in the operator manually carefully will prevent most

errors there will be occasions during production when error messages will be observed on

the printer. It is important to quickly determine a) what may have caused the error b)

whether you have the skills to rectify the problem c) whether the problem should be

escalated. Performing this task efficiently will minimise machine downtime and loss of

production.

Preparation

Tick off each of the following items as you complete them:

 Refer to the error messages listed in the operator manual

 Your instructor will simulate all of the common errors listed below

Demonstration

Having completed the preparation phase, now complete the actions below. Tick off each

item as you complete them:

 Whilst referring to the fast track recovery guide complete the table below providing

the most likely cause of these common error messages and the recovery actions

 Recover from at least one simulated error

Message

Cause

Remedy

Fiducial not found

Screen cleaner out of

position

Rail lifted error

System power down

Board transfer fault

Issue 2, Nov 14

Objectives OP 9 - Identify common print defects

Reference: Fast track process recovery guide, part no. 158546

Although following the procedures in the operator manual carefully will prevent most print

defects there will be occasions during production when print defects occur.

It is important that the operator understands which areas under their control can have a

direct influence over the print quality and how to identify a defect and quickly rectify the

problem.

Preparation

Tick off each of the following items as you complete them:

 Discuss with you instructor the specifications of an acceptable quality print (refer to

your companies guidelines if available)

 Your instructor will discuss a series of common print defects and identify the likely

operational causes as detailed in the recovery guide

The Perfect Solder Print Causes

Good alignment

No gaps between board and stencil

Good board support

Good stencil support (ProFlow)

Good stencil (good design, undamaged, Clean)

Good material (condition, temp etc)

Correct parameter settings (match process design)

Demonstration

 Shown below are some common solder print defects. Suggest some common

operational causes of these defects

Bridging Causes

Comment [JS15]: Solder Paste too

hot

Tooling too high or missing

Board warped

Misalignment

Stencil damaged

Damaged squeegees / ProFlow

Issue 2, Nov 14

Incomplete Causes

Missing Edge Causes

Misalignment Causes

Excess Print height Causes

Comment [JS16]: Not enough paste in front of

squeegee / in ProFlow

Tooling too high or missing

Paste cold or dry

Stencil blocked

Squeegees / ProFlow damaged

Comment [JS17]: Paste cold or dry (paste knead)

Stencil blocked

Tooling too high or missing

Comment [JS18]: Tooling too high or missing

Wrong stencil (check revision)

Fiducial damage on stencil

Poor board quality / different batch of boards

Comment [JS19]: Tooling missing

Paste temperature incorrect

Damaged squeegees / ProFlow blades

Damaged Stencil

Stencil surface not clean