GXH_1.pdf - 第6页

4 SS-1153 Other Functions Standard Function • Com ponent Pick- Up Error Automatic Recov ery Function • Pick -up Location Teaching Function • Pick -up Priority Function • Alternate Function at Com ponent Supply Section • …

SS-1153

Realization of High Reliability

• Each head is equipped with a linear measure that is used to detect picked

components (including missing ones) and vertical components and measure

the thickness of components. This system realized the high-quality

mounting of minute chips (components).

• Each nozzle is provided with an electromagnetic valve to realize the

optimum control of vacuum ON/OFF actions.

High Flexibility Function

• The optional multi-functional heads (under development) for head modules

will make it possible to mount larger varieties of components.

Technology of High Precision Component Placement

• Both X and Y axes are provided with linear motors and scales to realize the

highly accurate component placement.

Adoption of Linear Motors for X/Y Beam Driving

• Servomotors are used to drive the head, making it possible to control the

head position with the encoder.

• A highly accurate mounting is always maintained by the automatic offset

teaching function, the self-calibration system, etc.

Comfortable Operation Environment

• A new operation environment is constructed and the self-diagnosis

function is enhanced, realizing the comfortable operation environment.

• When the machine was designed, the setup and maintenance work was

taken into consideration.

• The enhanced production support software realizes high productivity.

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SS-1153

Other Functions

Standard Function

• Component Pick-Up Error Automatic Recovery Function

• Pick-up Location Teaching Function

• Pick-up Priority Function

• Alternate Function at Component Supply Section

• Programming Sorting Function

• Pick-Up and Placement Up/Down-Axis (L-Axis) Control Function

• Pick-Up Position (X/Y) Correction Control Function

Options

• Dual Transfer Function (under development)

• Unit PCB B.B.R. Function

• Placement Coordinates Teaching Function

• Component Library Teaching Function

• Application for BGA/CSP

• Splicing Kit

• Advance Notice and Instruction of Splicing

• Multiple Languages (Mandarin Chinese)

• Network Terminal

Programming Software

Pattern Program Optimization Software

Pattern Program Conversion Software (Our Products and Machines of

Other Brands)

CAD Conversion Software

Multi-Pattern Program Line Balance Software

Production Manager Software

• ACV System

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SS-1153

3. Specifications

3.1 Mechanical Specifications

3.1.1 Mechanical Construction

Fig. 1.1

3.1.2 Mechanical Specifications

1. Model Name GXH-1

2. Throughput 62,000 CPH

Note : The placement time can be adjusted in the increments of 0.001 second,

avoiding loss time.

3. PCB Transfer

Time

Approx. 2.5 seconds (PCB Length: 155 mm or less) (under optimum condition)

4. PCB Flow

Direction and

Transfer Reference

PCB Flow Direction : From Left to Right ("From Right to Left" is optional.)

Transfer Reference : Front Side of Machine or Rear Side of Machine

5. Applicable PCB

Size: 50 × 50 to 460 × 460 mm (Four Corners : R1 to R1.5 mm)

Thickness : 0.5 to 5.0 mm

Warpage : 0.2 mm or less per 50 mm Max. ± 1 mm

Mass : Max. 1.5 kg (mass weighed when PCB is completed)

Material : Glass Epoxy

Ceramic (Option)

Note : A test is required for greater warpage, depending on the material, shape,

and mass of the PCB being used.

6. PCB Positional

Correction Method

P.E.C. Recognition

7. Conditions of PCB

before Placement

(Regulation of

Component Height)

Upper Level : Max. 12.7 mm

Lower Level : Max. 30 mm

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P.E.C Camera

PCB Transfer

Conveyor

Component

Recognition Camera

Feeder

X-axis

Y-axis

Head

Head Nozzle Position

Nomber of Nozzle : Max.12