Specification SIPLACE CF-Medium.pdf - 第22页

21 Desc ription Standard Compo nent V ision Standard Compo nent V ision Standard Compo nent V ision Standard Compo nent V ision Mod ul e for th e 6- Nozzl e Mod ul e for th e 6- Nozzl e Mod ul e for th e 6- Nozzl e Mod u…

Description

In the cluster technology each

subpanel is assigned an ink spot.

If this is present during the meas-

urement via the PCB vision mod-

ule, the corresponding subpanel is

populated. It is also possible to ac-

complish the population of the

subpanel when the ink spot is

missing. With this function it is

possible to eliminate costs due to

unnecessary population of faulty

subpanels.

Global Ink Spot

Global Ink SpotGlobal Ink Spot

Global Ink Spot

Each bad board evaluation needs

time, so naturally the consumed

time increases with the number of

subpanels per PCB. Using a global

ink spot can result in a significant

reduction of these secondary

times.

The PCB vision module searches

at positions taught before for the

defined fiducial. In case of recogni-

tion there is no following evalua-

tion of subpanels. The system al-

lows the customer to choose also

the opposite interpretation.

Position Recognition of Feeder

Position Recognition of FeederPosition Recognition of Feeder

Position Recognition of Feeder

The pick-up position of the com-

ponents can be determined pre-

cisely with the aid of the position

recognition of the feeder. It is acti-

vated each time after a change of

feeder or component table. The

offset in position relative to the

stored ideal position is determined

on the basis of fiducials on the

feeder modules using the PCB vi-

sion module. This provides a very

high pick-up reliability even for the

very first component. This is par-

ticularly important with small com-

ponents.

Vision Sensor Technology:

Bad Board Recognition

Position Recognition of Feeder

Ink Spot Criteria

Evaluation method

for fiducials

for structures

brightness method

contrast method

Shapes and sizes of

fiducials/structures for

brightness method

contrast method

square or circular forms

edge length/diameter 0.3 - 5 mm

rectangular forms

edge length 0.3 - 5 mm

Masking material

mat dark (light-absorbing)

not recommended: white or shiny

Ink spot recognition time 0.3 s for each method

Description

Standard Component Vision

Standard Component VisionStandard Component Vision

Standard Component Vision

Module for the 6-Nozzle

Module for the 6-NozzleModule for the 6-Nozzle

Module for the 6-Nozzle

Collect & Place Head

Collect & Place HeadCollect & Place Head

Collect & Place Head

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is

evaluated by the central vision sys-

tem. The component rotation is

then corrected by the appropriate

angle based on the position off-

sets determined with vision in-

spection.

Standard Component

Standard ComponentStandard Component

Standard Component

Vision Module for the

Vision Module for theVision Module for the

Vision Module for the

Pick & Place Head

Pick & Place HeadPick & Place Head

Pick & Place Head

The Standard Component Vision

Module operates according to a

sophisticated lighting technology

and utilizes diverse analysis algo-

rithms. Despite the great diversity

of components it boasts very high

recognition reliability with all SMD

modules. Like all other vision

modules, this one is also con-

nected to the station’s central

vision system.

The components are illuminated

from four lighting planes whose in-

tensity can be adjusted in 256 in-

crements. This enables an optimal

illumination of each component.

The gray-scale picture recorded is

analyzed using the algorithm best

suited for the package form.

ICs, CSPs and IC-sockets are cen-

tered using leads or bumps. In the

case of chips and odd-shaped

components, centering is based

on outline measurement.

A special inspection mode for the

critical IC lead ends (HALE) pre-

cisely determines the lateral lead

bend as well as pitch error and

lead offset. This greatly reduces

the risk of short circuit soldering

defects.

The rotational angle deviation and

the X-/Y-offset of the component

relative to the nozzle center is as-

certained and factored in during

placement. The X-/Y-offset also

results in the correction of the

pick-up position.

In order to have the vision module

center a component, it must first

be described geometrically in the

package form (GF) file.

The component test software

makes it possible to check the

component definition at the station

to determine whether adjustments,

in lighting for example, are neces-

sary. These adjustments are auto-

matically assigned as a file to the

pertinent package form which

represents a component type.

Hence they are valid for all of

the machines in a line. As the

final step, the GF number of

the component type is entered

in the component file.

Vision Sensor Technology:

Standard Component Vision Modules for the 6-Nozzle

Collect & Place Head

Standard Component Vision Module for the Pick & Place Head

Standard Component Vision Module for the 6-Nozzle Collect & Place Head

Component size

minimum

maximum

0.6 x 0.3 mm

(0201)

18.7 x 18.7 mm

Component range See table on page 7

Camera’s field of view 24 x 24 mm

Illumination

Front light

(3 freely programmable planes)

Pixel size 50 µm

Standard Component Vision Module for the Pick & Place Head

Component size

minimum

maximum

1.6 x 0.9 mm

(0603)

32 x 32 mm

(single measurement)

55 x 55 mm

(multiple measurement)

92 mm edge length

Component range See table on page 7

Camera’s field of view 38 x 38 mm

Illumination Front light

(4 freely programmable planes)

Pixel size 80 µm

Description

Despite the highly stable machine

frame, slight distortions of the

gentry axes cannot always be

avoided. With the aid of the

mapping process the high place-

ment accuracy of the machine is

preserved throughout its entire

service life.

With this calibrating procedure,

which can be conducted quickly

and easily, the PCB camera recog-

nizes the fiducials on a mapping

calibration plate placed in its oper-

ating area. Any distortions are re-

vealed by comparing the nominal

grid on the glass plate with the

actual grid “drawn” by placement

head. These distortions are taken

into account during all further

positioning of X-/Y-axes and

thus compensated for.

Machine Criteria:

Mapping (Option)

Technical Data

Dimensions of the mapping test plate 520 x 460 mm

Number of measurement points

13 x 11 (standard resolution)

26 x 21 (high resolution)

Ambient temperature during calibration

+ 20° ± 3°C

Components of the option

Test plate (special glass)

Calculation data (disk)

Case for secure storage

Nominal Grid of Mapping Plate and Actual Grid with

Deviations Due to Gantry

Corrected

Position