A10011-ASM-T46-EN-Spec-SX-V2_DMS.pdf - 第13页

13 Placement heads General Head modularity The SIPLACE placement machines are disting uished by maximum flexibility in the production proce ss. This flexibility is in part due to the head modularity of the place - ment m…

Machine performance

Placement head types SIPLACE SpeedStar (C&P20 P)

SIPLACE MultiStar (CPP)

SIPLACE TwinStar (TH)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus the con-

veyor configurations. Individual options and customized applications also influence the placement performance.

On request, ASM can calculate the actual performance of your product on your machine configuration.

IPC value [components/h]

According to the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting

Electronics Industries.

SIPLACE benchmark value [components/h]

The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-

tions set out in the ASM scope of service and supply.

Theoretical maximum output value [components/h]

The theoretical maximum output value is calculated from the most favorable conditions for each machine type

and setting, and corresponds to the theoretical conditions normally used in the industry.

SIPLACE SX2 placement

machine

Placement area IPC value Benchmark value

C&P20 P/C&P20 P 59,000 74,000

C&P20 P / CPP

a) MultiStar CPP: low installation position

48,000 60,000

CPP

/ CPP

38,000 46,000

CPP / TH

b) MultiStar CPP: high installation position

23,100 27,000

TH / TH 10,200 11,000

SIPLACE SX1 placement

machine

Placement area IPC value Benchmark value

C&P20 P 29,500 37,000

CPP

19,000 23,000

TH 5,100 5,500

Placement heads

General

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

The SIPLACE SpeedStar

and the SIPLACE MultiStar

operate according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 or 12 com-

ponents, their optical center-

ing on the board and their

rotation into the required

placement angle and posi-

tion. They are then placed

gently and accurately onto

the PCB. This principle is

particularly suitable for high-

speed placement of standard

components.

The SIPLACE MultiStar also

functions according to the

Pick&Place principle. Two

components are picked up

by the SIPLACE MultiStar,

optically centered on the way

to the placement position

and rotated into the required

placement angle. This princi-

ple is particularly suitable for

fast and precise placement

of large components.

The SIPLACE MultiStar uses

both the Collect&Place and

the Pick&Place principle.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Pick&Place mode (Twin

Head)

The high-precision SIPLACE

TwinStar functions according

to the Pick&Place principle.

Two components are picked

up by the SIPLACE Twin-

Star, optically centered on

the way to the placement

position and rotated into the

required placement angle.

This principle is particularly

suitable for fast and precise

placement of special compo-

nents, such as those

required for grippers etc..

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Collect&Place mode

Pick&Place mode

(SIPLACE MultiStar)

Mixed mode

Placement heads

SIPLACE SpeedStar (C&P20 P)

With component camera

type 23

With component camera

type 41

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-spe-

cific standards, the component packaging tolerances and the component tolerances.

01005 to 2220, Melf, SOT,

SOD

0201 (metric) to 2220, Melf,

SOT, SOD, Bare-Die, Flip-

Chip

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

4 mm

250 µm

100 µm

400 µm

200 µm

0.18 mm x 0.18 mm

6 mm x 6 mm

1 g

4 mm

80 µm

30 µm

100 µm

50 µm

0.12 mm x 0.12 mm

6 mm x 6 mm

1 g

Set-down force 1.3 N ± 0.5 N (default value)

0.5 N - 4.5 N

Touchless Placement

Nozzle types 40xx 40xx

X/Y accuracy

b) The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.

± 41µm / 3 ± 41µm / 3

Angular accuracy ± 0.5° / 3 ± 0.5° / 3

Illumination levels 5 5