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T rials at the Universal Instruments Advanced Process Lab Air & Nitrogen Numerous pastes SAC 305 Innolot T in Lead Three paste supplie rs T w o board finishe s T w o pad designs some w ith vias V aried V acuum level …

Trials at the Universal Instruments Advanced Process Lab

Mike Meilunas Universal Instruments

Arvind Srinivasan Karthikeyan Auburn University

• Two Layer Test Board

• 78x104x1mm

• Immersion Sn and ENIG finishes

• MLF: 4, 8 and 12mm bodies

• WLCSP: 0.4mm pitch

• LGA: 0.4mm pitch

• SMR: 2512 and 1206

• BGA: 1.0mm pitch

• D2PAK

Trials at the Universal Instruments Advanced Process Lab

Air & Nitrogen

Numerous pastes

SAC 305

Innolot

Tin Lead

Three paste suppliers

Two board finishes

Two pad designs some with vias

Varied Vacuum level

Hold time

We ran

over 200

boards

Assembly Process

• Screen print solder paste

• 100 micron thick stencils

• Paste inspection

• Koh-Young 8030-3 & Optical

• Placement & Inspection

• Reflow soldering

• BTU Pyramax 125N (control – no vacuum)

• BTU Pyramax Vacuum Oven

• KIC SPS Profiler

• Post-Reflow Inspection

• Visual

• X-ray analysis (Dage XD7600)