2019-BTU-web-Vacuum-reflow-Dimock.pdf - 第3页

Outlin e  V oids  Why inline V acuum Reflow?  The Inline V acuum Reflow Oven.  The V acuum Reflow Cycle?  The V acuum T rial  The test vehicle  Preliminary results from an extended trial at the Universal Advanced …

Vacuum Reflow

The science of using nothing

to remove empty spaces from

something

Outline

 Voids

 Why inline Vacuum Reflow?

 The Inline Vacuum Reflow Oven.

 The Vacuum Reflow Cycle?

 The Vacuum Trial

 The test vehicle

 Preliminary results from an extended trial at the

Universal Advanced Process Lab

 Things to Consider

Voiding is of particular concern for

Thermal management of QFN and other devices

All about keeping the chip cool by eliminating voids in

Thermal Pads because empty spaces don’t transfer heat

Void issues