2019-BTU-web-Vacuum-reflow-Dimock.pdf - 第17页
Assembly Process • Scree n print solder pas te • 100 mi cr on thick st enc ils • P ast e inspection • K oh-Y oun g 8030 -3 & Optical • Placemen t & Inspection • R eflo w solderi ng • B TU Pyrama x 125N (con trol …
Trials at the Universal Instruments Advanced Process Lab
Air & Nitrogen
Numerous pastes
SAC 305
Innolot
Tin Lead
Three paste suppliers
Two board finishes
Two pad designs some with vias
Varied Vacuum level
Hold time
We ran
over 200
boards
Assembly Process
• Screen print solder paste
• 100 micron thick stencils
• Paste inspection
• Koh-Young 8030-3 & Optical
• Placement & Inspection
• Reflow soldering
• BTU Pyramax 125N (control – no vacuum)
• BTU Pyramax Vacuum Oven
• KIC SPS Profiler
• Post-Reflow Inspection
• Visual
• X-ray analysis (Dage XD7600)
Atmosphere Nitrogen
Solder paste SAC 305
Board finish ENIG
Profile RTS - 240 peak
Pad Design Window pane
Pump down rate Fixed
Refill rate Fixed
Multiple
Vacuum levels
Hold Times
Preliminary results from 3 MLFs 100, 52, & 16
MLF 16 no vac vs vac
MLF 100 no vac vs vac