SIPLACE TX V2 micron 设备性能参数_DMS.pdf - 第23页

23 SIPLACE Vision Cracked Die Detection Crack Die Detection The Cracked Die Detec- tion can det ect breaks before remov al from the tape, if the crack runs b e t w e e n t w o o u t e r e d g e s o f the die. Inspection …

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the PCB, speci-

fied by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before any

placement begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.

SIPLACE Vision

Cracked Die Detection

Crack Die Detection

The Cracked Die Detec-

tion can detect breaks

before removal from the

tape, if the crack runs

between two outer edges of

the die. Inspection is per-

formed with the PCB cam-

era. A prerequisite for

detection is that the two

parts of the die are slightly

inclined towards one

another. Detection is possi-

ble via the differing reflec-

tion angles of the two

surfaces which are inclined

towards one another.

Good

Bad

SIPLACE Vision

Board position recognition

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X-/Y-position, rotation angle, mean PCB distortion

Additional: shearing, distortion separately in X and Y direc-

tion

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-

mond, circular, square and rectangular contours, double

cross, pattern: any

Dimensions of patterns

Min. size

Max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there

is no similar fiducial structure in the search area

Dimensions of synthetic fiducials

Min. X/Y size for circle

and rectangle 0.25 mm

Min. X/Y size for annulus and rectangle 0.3 mm

Min. X/Y size for cross 0.3 mm

Min. X/Y size for double cross 0.5 mm

Min. X/Y size for diamond 0.35 mm

Min. frame width for annulus and rectangle 0.1 mm

Min. bar width / bar distance for cross, double-cross 0.1 mm

Max. X/Y size for all fiducial shapes 3 mm

Max. bar width for cross/double-cross 1.5 mm

Minimum tolerances generally 2% of nominal dimension

Max. tolerances generally 20% of nominal dimension

a) To ensure high production quality of printed circuit boards, a minimum x/y size of 0.075 mm is permitted

for circular fiducials under the following conditions:

There are no other objects with a size of + 0.2 mm which are visible in the rectangular fiducial search

area. Example: Circular fiducials with an x/y size of 0.075 mm need a search area without visible objects

of: 0.075 mm + 0.2 mm = 0.275 mm.