Specification_SIPLACE_S23HM_eng.pdf - 第20页

19 Description In cluster technology, each sub- panel is as signed an in k spot. If this is present when the PCB vi- sion module conducts the meas- urement, the pertinent subpanel is not populated. Naturally, it is also …

Description

Different reference mark shapes

prove to be optimal depending on

the condition of the surface.

Particularly advisable for bare cop-

per surfaces with little oxidation is

the single cross. Maximum recog-

nition reliability is achieved due to

the high information content. Rec-

tangle, square and circle are less

”informative” but save space, are

rugged, and can even be used

when oxidation is at an advanced

stage.

Advisable for tinned structures are

circle or square because in this

case the ratio of the mark dimen-

sions to the presolder thickness is

particularly favorable.

Vision Sensor Technology:

PCB Position Recognition

Template

Window

PCB Camera

Field of View

Area

Fiducial to

Be Located

Reference

Fiducal

Reference Mark Criteria

Locate 2 marks

Locate 3 marks in addition

X-/Y-position, rotation angle, mean dis-

tortion

Shear, distortion in X- and Y-direction

Mark shapes Freely definable via teaching, e.g.,

single cross, rectangle, square, circle

Mark surface

Copper

Tin

Without oxidation and solder resist

Warp ≤ 1/10 of structure width,

good contrast to environment

Mark dimensions

single cross

rectangle/square

circle

Length and width: 0.9 - 2 mm

Line thickness: 0.3 - 1.0 mm

Edge length: 0.5 - 2 mm

Diameter: 0.5 - 2 mm

Mark environment Clearance around reference mark not

necessary if there is no similar mark

structure in the search area

(5.7 x 5.7 mm)

Description

In cluster technology, each sub-

panel is assigned an ink spot. If

this is present when the PCB vi-

sion module conducts the meas-

urement, the pertinent subpanel is

not populated.

Naturally, it is also possible to pre-

vent the population of the sub-

panel when the ink spot is miss-

ing.

This function can be used to pre-

vent costs incurred by unneces-

sarily populating faulty subpanels.

n n

n R

n n

n o

f f

f F

Fee

eeee

eed

The pick-up position of the com-

ponents can be determined pre-

cisely with the aid of the position

recognition of the feeder. It is acti-

vated each time after a change of

feeder or component table. The

offset in position relative to the

stored ideal position is determined

on the basis of fiducials on the

feeder modules using the PCB vi-

sion module. This provides a very

high pick-up reliability even for the

very first component. This is par-

ticularly important with small com-

ponents.

Vision Sensor Technology:

Recognition of Faulty PCBs via Ink Spots

Position Recognition of Feeder

Ink Spot Criteria

Mark shapes Single cross (recommended because

of lowest susceptibility to problems),

rectangle, square, circle, etc.

Masking material Mat dark (light-absorbent)

Not advisable: white or glossy

Size of mark masking

Circular: Diameter ≥ 8.1 mm

Square: Edge length ≥ 5.7 mm

Mark recognition time

(Travel > 100 mm)

Mark masked: 1.2 s

Mark not masked: 0.4 s

Description

The component vision module is

directly integrated into the revolver

head and it takes a picture of the

pertinent component. This image

is analyzed by the central vision

system while the component is

cycling into the next station, where

the position of the component is

corrected in accordance with the

offsets in position discovered.

Vision Sensor Technology:

Component Vision Module on the 12-Nozzle Revolver Head

Technical Data

Maximum component size 18.7 x 18.7 mm

Recognizable spectrum

of components

0402 to PLCC44

incl. BGA, µBGA, Flip Chip, TSOP,

QFP, PLCC, SO to SO32, DRAM

Lead pitch

min. ≥ 0.5 mm

Camera’s field of view 24 x 24 mm

Type of lighting Front lighting

(3 freely programmable planes)