Specification_SIPLACE_S23HM_eng.pdf - 第4页

3 Technical Data Procedure Collect & Place Component spect rum 0402 (0201*) to 18.7 x 18.7 mm Benchmark placement rate 12-nozzle revolver heads Cycle time at revolver head 23,000 cph (25,000 cph option) 140 ms regard…

Component Forms 35

Nozzle Types 39

Possible Machine Configuration 42

SMD High Speed Placement System

SIPLACE S-23 HM

12-Nozzle Revolver Head

X-/Y- Portal System

Fixed Component Supply

Fixed PCB

Placement Principle SIPLACE S-23 HM

Technical Data

Procedure Collect & Place

Component spectrum 0402 (0201*) to 18.7 x 18.7 mm

Benchmark placement rate

12-nozzle revolver heads

Cycle time at revolver head

23,000 cph (25,000 cph option)

140 ms regardless of component type

Angle accuracy

Placement accuracy

± 0.525° / 3 σ, 0.70° / 4 σ, 1.05° / 6 σ

± 67.5 µm/ 3 σ, 90 µm/ 4 σ, 135 µm/ 6 σ

PCB dimensions 50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

Feeding capacity 40 feeder locations

Feeder module types Tapes, stick magazines, Bulk Cases

Operating system Microsoft Windows / RMOS

Connection In line or stand alone

Space required 4 m² / module

* SIPLACE S-23 HM is capable of handling 0201, if optional set up for it (Please contact Siemens).

Description

The high-speed SMD placement

system SIPLACE S-23 HM com-

bines high placement speed with

flexibility and accuracy. In contrast

to classic chipshooters, a Collect &

Place procedure is applied here.

SIPLACE S-23 HM placement ma-

chines are equipped with two X-Y-

main gantries. Each gantry fea-

tures a star-shaped 12-nozzle

revolver placement head. The

placement heads alternately pick

up components from the station-

ary component feeder and place

components on the PCB which is

also motionless. This has distinct

advantages:

Components are refilled and

tapes are spliced with no idle

times during the placement run.

The feeding of components with

no vibrating enables a reliable

pick-up of even the smallest

components (e.g., 0402 chips).

Thanks to the flexible 12-nozzle

revolver heads - whose ideal

nozzle set-up is automatically

specified - the travel can be

minimized and the sequence of

placement optimally adjusted.

As the PCB is motionless, the

components cannot shift posi-

tions.

Speed coupled with economic ef-

ficiency and set-up reliability is the

SIPLACE S-23 HM recipe for suc-

cess. The first components are al-

ready being picked up while the

PCB is being moved in. Path-

optimized teamwork then ensures

high performance: While one re-

volver head is placing components,

the other one is picking compo-

nents up.

The product range is rounded off

by optional add-on products such

as component bar code scanner,

automatic nozzle changer or

changeover tables which can be

set up outside the machine and

exchanged in a matter of minutes.

Machine Description

d d

d m

In the future it will be possible to

configure placement heads flexibly

to adapt the production line more

exactly to your requirement profile.

All SIPLACE S-23 HM machines

have been prepared for this modi-

fication.

Input Station

Screen Printer

Oven

SIPLACE S-23 HM

SIPLACE HS-50

SIPLACE 80 F

with Waffle Pack Changer

Output

Station

Example of a SIPLACE Placement Line

Description

Flexibility and adaptability are the

outstanding characteristics of the

modular SIPLACE concept. It en-

ables a production line with an in-

dividual combination of identical

and different types of modules.

When the performance require-

ments change, the individual ma-

chines ca be recombined quickly

and easily, because of their rela-

tively small size for example.

The SIPLACE family offers the

right product for each purpose -

from the super high-speed place-

ment system SIPLACE HS-50 to

the high-speed SMD placement

system SIPLACE S-23 HM and the

flexible Fine Pitch placement sys-

tem SIPLACE F

Line Design

Technical Data

System SIPLACE SMD placement lines

Modules SIPLACE HS-50 / SIPLACE S-23 HM /

SIPLACE F

Peripherals Input/output station, screen printer,

solder oven, inspection conveyor etc.,

available from Siemens

Component range 0201* to 55 x 55 mm**

Placement speed depends on layout of modules

Space required 4 m² / SIPLACE S & F modules

7.5 m² / SIPLACE HS module

* Collect & Place

** Pick & Place