Specification_SIPLACE_S23HM_eng.pdf - 第9页

8 PCB Transpor t Direction Asynchronous Synchronous Description Thanks to the reduced non- productive times, the dual PCB conveyor can effect a c onsiderable increase in the throughput, de- pending on the program. It ena…

PCB Transport

Direction

Description

On SIPLACE S-23 HM placement

machines the in-line conveyor sys-

tem ensures a speedy adjustment

to new PCB widths. The changeo-

ver is made either at the station via

menu function or from the line

computer via the automatic width

adjustment. Ceramic substrates

are also transported or fixed in

place by means of the optional ce-

ramic substrate centering feature.

As standard the SIPLACE place-

ment system are available with a

single conveyor system.

PCB Conveyor:

Single Conveyor

PCB Conveyor

Technical Data

PCB dimensions 50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

PCB thickness 0.5 to 4.5 mm

Max. PCB warp Top: 4.5 mm - PCB thickness

Bottom: 0.5 mm + PCB thickness

PCB underside clearance Standard: 25 mm,

Option: max. 40 mm

PCB conveyor height

830 ± 15 mm (Standard)

900 ± 15 mm (Option)

930 ± 15 mm (Option)

950 ± 15 mm (Option) SMEMA

Fixed conveyor edge On right (standard); on left (option)

Type of interface Siemens (standard); SMEMA (option)

Component-free handling edge 3 mm

PCB changing time 2.5 s

PCB Transport

Direction

Asynchronous

Synchronous

Description

Thanks to the reduced non-

productive times, the dual PCB

conveyor can effect a considerable

increase in the throughput, de-

pending on the program. It enables

the simultaneous (synchronous) or

alternating (asynchronous) trans-

port of two PCBs through the

placement machine.

In the case of the synchronous

type of transport it is possible, for

example, to process the top and

bottom of the PCB without using

the cluster technique.

In the case of the asynchronous

type of transport one PCB can be

moved into the placement ma-

chine during slack time while an-

other one of the same type is be-

ing populated. The portion of non-

productive time caused by the

transport of the PCB is therefore

completely eliminated. The in-

crease in placement speed to be

expected is between 10% and

30%, depending on component

load of the PCB.

Insofar as the customer is con-

cerned, switching between asyn-

chronous and synchronous dual

conveyor entails relatively little ex-

penditure. The optional ceramic

substrate centering is possible, the

PCB bar code mode is not.

PCB Conveyor:

Dual Conveyor

Asynchronous Dual PCB Conveyor

Technical Data

PCB dimensions 50 x 50 mm to 460 x 216.5 mm

Fixed conveyor edge On right (standard); on left (option)

Placement program per conveyor Synchronous: same or different

Asynchronous: same

PCB width per conveyor Synchronous: same or different

Asynchronous: same

Ink spot recognition Synchronous: not possible

Asynchronous: possible

Automatic width adjustment Synchronous: not possible

Asynchronous: possible

Description

The demands for a precise sub-

strate centering are becoming

more stringent due to the increas-

ing use of ceramic substrates in

the Flip Chip technology. This

challenge is met by the optical and

mechanical ceramic substrate cen-

tering on the SIPLACE S-23 HM

and SIPLACE 80 F

As with the PCB vision module,

the optical centering is conducted

with the aid of reference marks.

Depending on the contrast ratio

the machine activates the standard

lighting or the oblique lighting con-

tained in option:

On ceramic and CM blue light

(Item No 116172).

On flexible PCBs using vision

module without IF-filter infrared

light (Item No 116173).

In specific case a mechanical cen-

tering is required, e.g., when

placement is to be to the edge of

the substrate, handling of the sub-

strate edges is to be particularly

gentle or substrates are scribed.

With this gentle, bounce-free ap-

proach the substrate is fixed in the

Y-direction between a stop bar and

a rocking lever. In the X-direction it

is centered pneumatically.

PCB Conveyor:

Ceramic Substrate Centering (Option)

Technical Data

Substrate dimensions 2" x 2" to 4" x 7"

Substrate thickness 0.5 to 1.5 mm

Substrate model Unscribed (no problems)

Scribed (after test)

Contact in conveyor 2.5 mm

Optical centering:

Field of view of PCB

vision module

Type of light:

with light pastes

with dark pastes and little

distance to neighboring struc-

tures (> 1 mm)

5.7 mm x 5.7 mm

PCB vision module (standard)

Oblique lighting (option)

Reference mark criteria See PCB Vision Module Position

Recognition

Mechanical centering:

X-/Y-axis centering accuracy

± 0.07 mm / 4 s

Clearance under substrate 12 mm

Compressed air connection 5.5 bar

Optical Centering via Mechanical Centering

PCB Camera

Movable

Transport Side

Y-Fixation

Fixed

Transport

Side

Stopper

Ceramic Substrate

Movable

Transport Side

X-Center-

ing

Fixed

Transport

Side