西门子SIPLACE HS 60-设备参数_EN.pdf - 第26页

24 Vision Sensor Technology: Algorithms to Determine the X-/Y-Position and the Placement Angle Description The component vision module in- tegrated into the placement head significantly contributes to place- ment precisi…

Vision Sensor Technology:

Multicolor PCB Camera (Option)

Description

At present, the most commonly

used PCBs are made of FR3

(Epoxy Paper) or FR4 (Epoxy

Glass Fiber Laminate) board

materials. However, the use of

special materials such as ceramics

(Al

), flexible material (Capton)

or Paper Phenolic Core (CEM1) are

becoming increasingly widespread

for special applications. In general

optical techniques with a fixed

light spectrum (frequency range)

and just one direction of illumina-

tion are inadequate for these spe-

cial applications. The new

SIPLACE Multicolor Fiducial Cam-

era however is designed to work

with new materials and special

applications just as fast and relia-

bly as with conventional ones.

Technical Data

PCB

material

Fiducial

material

Used light source

Blue light Infra red White light

FR 4 Tin X

Ceramic NiAu; Cu; AgPi X

Ceramic AgPt X

CEM 1 Bright copper, tin X

CEM 1 Fiducials

covered by

solder resist

(X)

Flex on

Aluminium

carrier

The new SIPLACE Multicolor

Fiducial Camera detects almost

all fiducials and ink spots on all

known PCB materials even under

very difficult environmental con-

ditions. The associated illumination

system developed by SIPLACE

allows the individual selection of

suitable illumination colors and

angles on to the object.

Vision Sensor Technology:

Algorithms to Determine the X-/Y-Position and the

Placement Angle

Description

The component vision module in-

tegrated into the placement head

significantly contributes to place-

ment precision and reliability. It

dependably recognizes all package

forms (= geometric dimensions of

the component) which are illumi-

nated at various angles from three

planes in the case of the 12-Nozzle

Collect & Place Head. For optimal

illumination of each component,

the brightness of the lighting of

the planes can be adjusted indi-

vidually in 256 increments.

Aside from the dimension of the

SMD module, the vision system

determines the number of leads

and their pitch (lateral IC lead

bend) as well as the offset of the

placement angle and the X-/Y-axis.

Unsuitable components are re-

jected and automatically added

later in a repair cycle. Offsets in

placement angle and X-/Y-axis are

corrected at the turning station of

the Collect & Place Head or via the

gantry axes. From the positions of

a number of components in one

track a relevant offset in the pick-

up position on the X-/Y-axis is cal-

culated. This offset is taken into

account during subsequent com-

ponent pick-up steps due to the

self-learning principle.

Algorithm Component Analysis based on

Size Driven Chip the component contour (pro-

file/gradient)

Row Driven IC Several component leads (correla-

tion method)

Corner Driven IC all component leads

(correlation method)

Lead Driven Complex IC

Each component lead (High-

Accuracy-Lead-Extraction method)

Grid/Ball

BGA, µBGA,

Flip Chip

all defined balls

(gradients/ball centering)

Prior to placement, the required

geometric dimensions of a com-

ponent type are entered into the

GF editor, creating a synthetic

model of the SMD chip. This task

is facilitated by the extensive on-

line information and help system.

The central SIPLACE vision sys-

tem, to which the other vision

modules are also connected, sub-

sequently analyzes the gray-scale

value of the component vision

module. Algorithms suitable for

the specific package form are

used for this purpose. Due to the

combination of algorithms, the vi-

sion system also functions reliably

under the most difficult conditions,

e.g., in case of different reflection

behavior on the part of the leads

or interference from outside.

Vision Sensor Technology:

Standard Component Vision Modules for 12-Nozzle

Collect & Place Head

DCA-Vision Module for 12-Nozzle Collect & Place Head

(Option)

Standard Component Vision Module for the 12-Nozzle C & P Head

Component size minimum 0.6 x 0.3 mm

(0201) /

maximum 18.7 x 18.7 mm

Component range See table on page 6

Camera’s field of view 24 x 24 mm

Illumination Front lighting

(3 freely programmable planes)

Pixel size 50 µm

DCA-Vision Module for the 12-Nozzle C & P Head

Component size: minimum 0.6 x 0.3 mm

(0201) /

maximum 13 x 13 mm

Component range Flip Chips, Bare Dies, Standard SMDs

Camera’s field of view 15.6 x 15.6 mm

Illumination Front light

(4 freely programmable planes)

Pixel size 27.5 µm

Description

Standard Component Vision

Module for 12-Nozzle

Collect & Place Head

The standard component vision

module is directly integrated into

the Collect & Place Head. While

the component is cycling into the

next station of the Collect & Place

Head, the recorded image is evalu-

ated by the central vision system.

The component rotation is then

corrected by the appropriate angle

based on the position offsets de-

termined with vision inspection.

DCA Vision Module for 12-

Nozzle Collect & Place Head

The DCA vision module was de-

veloped specifically for secure,

fast and reliable recognition of Flip

Chips and Bare Dies. But also

standard SMDs can be handled

with this vision module including

0201 capacitors and resistors.

The DCA vision module option of-

fers the possibility to process with

one machine SMDs, Flip Chips

and Bare Dies without problems,

thus achieving a maximum of

flexibility.

The DCA-Vision Module option re-

places the Standard Component

Vision Module.