Specification SIPLACE CS-Speed.pdf - 第7页
5 6-Nozzle Co llect & Pl ace Head fo r High Spe ed Placem ent Component Pick-Up/ Placement Segment Removal Point Turning to the Placement Position Component Vision Description The 6-Nozzle pla cement head operates on…
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Example of a Placement Line of SIPLACE Compact machines
Description
Flexibility and adaptability cha-
racterize the modular SIPLACE
design. Each production line can
be individually composed of
similar and different modules.
Because of the small size and ro-
bust construction of the SIPLACE
modules, they can be recombined
quickly and easily to accommodate
changes in production requirements.
SIPLACE line-level optimization
tools generate single set-ups for
single products or for several
products. Also, product programs
can be transferred from line to line
even when the machine configura-
tions are different.
The innovative SIPLACE platform,
with its cutting-edge technology,
guarantees maximum productivity,
while compatibility across several
machine generations ensures you
of long-term investment protection.
And with SIPLACE, you benefit
from a global support network with
29 locations in Europe, 32 locations
in the Americas, and 23 locations in
Asia.
Line Design
Technical Data
System SIPLACE SMD placement lines
Modules SIPLACE CS / SIPLACE CF
PCB conveyor Automatic width adjustment
PCB dimensions
(L x W)
50 x 50 mm
2
to 508 x 460 mm
2
/
2" x 2" to 20" x 18"
Placement speed Depends on layout of modules
Space required 4 m² / SIPLACE CS & CF modules
5
6-Nozzle Collect & Place Head for High Speed Placement
Component Pick-Up/
Placement
Segment
Removal
Point
Turning to
the Placement
Position
Component
Vision
Description
The 6-Nozzle placement head
operates on the Collect & Place
principle. In contrast to classic
chip shooters, the 6 vacuum
nozzles of the SIPLACE Collect
& Place head rotate around a
horizontal axis. This does not
only save space:
Due to the small diameter com-
pared to chip shooters, the cen-
trifugal forces are significantly
lower. The results are high-speed,
reliable placement and the same
cycle time for all components.
Components are picked up and
placed reliably with the aid of vac-
uum followed by a gentle air kiss.
A number of vacuum tests moni-
tors if the component has been
picked up and placed accurately.
Various control and self-learning
functions further enhance the de-
pendability of the system:
§ The optical recognition of feeder
positions records the exact posi-
tion of the feeder table.
§ A camera on the placement head
(component vision module) de-
termines the exact position of
each component on the nozzle.
§ For every feeder the pick-up
offsets are averaged over the
last ten pick-ups. This enables
the head to dial-in on the pre-
cise pick point for each compo-
nent.
§ In addition, the package form is
also checked. If the actual geo-
metric dimensions of the com-
ponent do not correspond to
those programmed, the compo-
nent is rejected.
§ Components rejected by the
vision system are dumped into
a bin. Any rejected component
gets automatically placed during
a repair run.
§ Warpage of the PCB is accom-
modated by sensor stop acti-
vated z-axis placement. The sys-
tem also keeps the last ten
positions of the z-axis at com-
ponent placement and uses the
average of these values to im-
prove the drive down and place
speed of the cycle.
Placement Heads:
6-Nozzle Collect & Place Head for High Speed
Component Placement
Technical Data
Benchmark placement rate See table on page 3
Stroke of Z-axis max. 16 mm
Programmable placement force 2.4 to 5.0 N
Accuracy and Component range See table on page 6
6
Placement Heads:
Placement Accuracy
Component Range
Placement Accuracy
a
Placement Head
Placement Accuracy
6-Nozzle
Collect & Place Head
X/Y Accuracy ± 67.5 µm
3
Sigma
Rot.-Accuracy ± 0.525°
X/Y Accuracy ± 90.0 µm
4
Sigma
Rot.-Accuracy ± 0.700°
X/Y Accuracy ± 135.0 µm
6
Sigma
Rot.-Accuracy ± 1.050°
a) As defined in Scope of Service and Delivery SIPLACE.
Component Range
6-Nozzle
Collect & Place Head
Component size
0.6 x 0.3 mm
2
b
to
18.7 x 18.7 mm
2
Max. component height 6 mm
Max. component weight 2 gr
Placement force 2.4 - 5.0 N
Performance See table on page 3
Min. pitch lead / bump 500 / 350 µm
Min. ball / bump diam. 200 µm
b) 0201 (recommended to order the special 0201-kit).