SIPLACE 80 F4_EN.pdf - 第5页

4 Input S tation Screen Printer Oven SIPLACE 80 S-20 SIPLACE 80 S-20 SIPLACE 80 F 4 with Waffle Pack Changer Output Station Example of a S IPLACE P lacement Line Description The modular SIPLACE des ign is charac terized …

Description

The SMD General Purpose Placer

SIPLACE 80 F

has four outstand-

ing features: Flexibility, Fine Pitch

processing, Flip Chip processing

and Fast-placement. This place-

ment system combines the Fine

Pitch Pick & Place head with the

12-nozzle revolver head (Collect &

Place) to unite high precision with

high speed.

Equipped with the 12-nozzle re-

volver head the SIPLACE 80 F

placement system optimally com-

plements, the SIPLACE 80 S-20

machine. It eases the burden of

high-speed chip placement and

ensures an outstanding product

throughput time. While the PCB is

still being moved, the 12-nozzle

revolver head is already picking up

the first components. As soon as

the PCB is clamped in the con-

veyor, its exact position is deter-

mined with the PCB camera. Af-

terwards the revolver head picks

up the remaining components for

the entire rotation step and places

its 12 components. As soon as it is

finished, the Pick & Place head

begins picking up and placing the

components assigned to it.

The principle of the stationary PCB

and the motionless component ta-

ble has decisive advantages:

Component tapes of all sizes

can be spliced, preventing ma-

chine stoppage due to empty

feeders.

The feeding of components

with no vibrating enables a reli-

able pick-up of even the small-

est components (e.g., 0402

chips).

Thanks to the flexible 12-nozzle

revolver heads - whose ideal

nozzle set-up is automatically

specified - the travel can be

minimized and the sequence of

placement optimally adjusted.

Holding the PCB stationary pre-

vents components from shifting

during placement.

Speed coupled with economic ef-

ficiency and set-up reliability is the

SIPLACE 80 F

recipe for success.

The product range is rounded off

by optional additional products

such as component changeover

tables, tray changers, component

and PCB bar code scanners or

automatic nozzle changer.

Machine Description

Technical Data

Process Pick & Place / Collect & Place

Range of components 0402 to 55 x 55 mm

Benchmark placement rate

12-nozzle revolver head

Pick & Place head

10,000 cph

1,800 cph

12-nozzle-revolver head

Angle accuracy

Placement accuracy

± 0.525° / 3 σ, 0.70° / 4 σ, 1.05° / 6 σ

± 67.5 µm/ 3 σ, 90 µm/ 4 σ, 135 µm/ 6 σ

Pick & Place head

Angle accuracy

Placement accuracy

± 0.052° / 3 σ, 0.07° / 4 σ, 0.105° / 6 σ

± 37.5 µm/ 3 σ, 50 µm/ 4 σ, 75 µm/ 6 σ

PCB dimensions

50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

Feeder capacity 40 feeder locations

Component table

Types of Feeder modules

Changeover table, Waffle Pack Changer,

manual trays

Tapes, stick magazines, Bulk Cases

Operating system Microsoft Windows / RMOS

Connection In line or stand alone

Space required 4 m² / module

Input Station

Screen Printer

Oven

SIPLACE 80 S-20

SIPLACE 80 F

with Waffle Pack Changer

Output

Station

Example of a SIPLACE Placement Line

Description

The modular SIPLACE design is

characterized by flexibility and

adaptability. It permits an individual

production line composition of

similar and different modules.

When performance requirements

change the individual machines

can be recombined quickly and

without complications, one of the

major reasons being their relatively

small size.

The SIPLACE family offers the

right product for each purpose -

from high-speed SMD placement

systems SIPLACE 80 S-20 to the

flexible Fine-Pitch placement

system SIPLACE 80 F

SIPLACE 80 F

is ideally suited for

fixed set-up as well as for family

set-up with optimized changeover

times. When the required capacity

is low, however, it is also suitable

as a standalone placement sys-

tem.

Line Design

Technical Data

System SIPLACE SMD placement lines

Modules

SIPLACE 80 S-20 / SIPLACE 80 F

SIPLACE HS-50 / SIPLACE S-23 HM /

SIPLACE F

Peripherals

Input/output station, screen printer,

solder oven, inspection conveyor etc.,

available from Siemens

Component range 0201* to 55 x 55 mm**

PCB conveyor

PCB dimensions

Ceramic substrate dimensions

Automatic width adjustment

50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

2" x 2" to 4" x 7"

Placement speed depends on layout of modules

Space required

4 m² / SIPLACE S & F modules

7.5 m² / SIPLACE HS module

* Collect & Place

** Pick & Place

Description

The main X-/Y-gantry features two

placement heads, the 12-nozzle

high-speed revolver placement

head and the high-precision Pick &

Place head or Fine Pitch place-

ment head.

With certain overlapping, each

placement head is specialized for a

specific range of components.

Therefore it is possible to option-

ally distribute the components to

be placed between the two heads.

Placement Heads

Technical Data

Placement principle

Pick & Place (Pick & Place head)

Collect & Place (Revolver head)

Components Entire SMD range

Component table:

Pick & Place head

12-nozzle revolver head

Feeder on changeover table

Waffle Pack Changer or manual trays

Feeder on changeover table

Placement Heads SIPLACE 80 F

Pick & Place Head

Collect & Place

Revolver Head

PCB Transport

Direction