SIPLACE 80 F4_EN.pdf - 第9页

8 Description R R R Re e e ev v v vo o o ol l l lv v v ve e e er r r r H H H He e e ea a a ad d d d A nozzle changer for the revolver head can be instal led to the left of the PCB conveyor w ith no loss of feeder locatio…

Description

The highly developed Pick & Place

or Fine Pitch placement head op-

erates on the Pick & Place princi-

ple. It is suitable for picking up par-

ticularly sophisticated or large

components as well as non-

standard models. High-resolution,

intelligent vision modules (Fine

Pitch and Flip Chip component vi-

sion modules) ensure that the

components are in satisfactory

condition that the placement posi-

tion is correct.

The sleeve with nozzle is the heart

of the Pick & Place head. The

sleeve is mounted such that it is

movable in the longitudinal (Z-axis)

and rotational direction (D-axis).

Each of the two axis are driven by

a DC motor; positioning is done by

incremental encoder. Thanks to a

high-resolution glass incremental

panel on the sleeve, the Pick &

Place head has an outstanding

high rotational position accuracy.

The rotating movement is trans-

mitted directly from D-axis motor

to the driving plate on the sleeve

via frictional wheel.

Placement Heads:

Pick & Place Head for High End / High Accuracy IC Placement

Technical Data

Component range

max. height

min. lead pitch

max. dimensions

max. weight

PCB-height ≤ 13.5 mm (20 mm* opti-

on) – thickness (PCB) – arching (PCB)

0.4 mm (standard), 0.25 mm (option)

32 x 32 mm (single measurement)

55 x 55 mm (multiple measurement)

25 g

Programmable placement force 1 to 10 N

Nozzles types

5 standard nozzles including

Flip Chip nozzle with nozzle changer

Component centering

Fine Pitch component vision module

(standard)

Flip Chip component vision module

(option)

Benchmark placement rate 1,800 cph

Resolution of the D-axis 0.005°

Angle accuracy

± 0.052° / 3 σ

± 0.07° / 4 σ

± 0.105° / 6 σ

Placement accuracy

± 37.5 µm/ 3 σ

± 50 µm/ 4 σ

± 75 µm/ 6 σ

* max. PCB-height is depending on the feeder (please contact Siemens service)

Pick & Place Head

PCB Transport

Direction

Description

r r

r H

A nozzle changer for the revolver

head can be installed to the left of

the PCB conveyor with no loss of

feeder locations. It will change the

set-up of the placement head

quickly and reliably for the specific

nozzle configuration valid for a job.

Damaged or faulty nozzles can be

exchanged via the menu function.

k k

k &

& &

& P

SIPLACE 80 F

is equipped with a

nozzle changer for the Pick & Place

head. As standard, it is fitted with

one magazine. This can simultane-

ously hold 4 standard nozzles and

one special nozzle. The changer is

mounted on the right-hand side of

the PCB conveyor with no loss in

feeder locations. As an option, 3

additional nozzle magazines can be

installed for 5 nozzles each. Noz-

zles are exchanged automatically

during the placement sequence.

Placement Heads:

Nozzle Changer

Technical Data

12-Nozzle Revolver Head

Type of nozzle

All standard nozzles of nozzle series 6xx

and 7xx

(special nozzles must be tested individually)

Capacity

7 magazines for each 12 nozzles of one

nozzle series

Nozzle changing times About 2 s per nozzle

Pick & Place Head

Type of nozzle

All standard nozzles of nozzle series 4xx

(special nozzles must be tested individually)

Capacity

1 to 4 magazines each with 5 nozzles of

one nozzle series

Nozzle changing times About 2 s per nozzle

Position of Nozzle Changers

Waffle Pack Changer (Option)

Component Feeders

for Revolver Head /

Pick & Place Head

Component Feeders

for Revolver Head /

Pick & Place Head

PCB

Nozzle Changer for the

12-Nozzle Revolver Head Nozzle Changer Pick & Place Head for 5 Nozzles

Each with 7 Magazines for 12 Nozzles (Option) (Option: + 3 Nozzle Changers Each for 5 Nozzles

Description

Full Flip Chip handling capability on

the part of the SIPLACE 80 F

ensured by a flux dispenser in-

stalled directly next to the revolver

head. Immediately before the Pick

& Place head places the Flip Chip,

the mounting location on the PCB

is wetted with low-viscosity flux

by means of a dispensing needle.

The flux dispenser option essen-

tially comprises one stepping mo-

tor with piston, injector and valve

to change the operating mode (fill /

dispense injector) plus one storage

tank. The stepping motor positions

the piston over the storage tank to

be filled or over the Flip Chip

mounting location on the PCB for

emptying.

The purpose of a programmable

waiting time until PCB transport is

to allow the low-viscosity flux suf-

ficient time to dry so that the Flip

Chip(s) will not shift position while

the PCB is being moved out. A

new PCB conveyor control with

adjustable acceleration and delay

ramps makes programming the

waiting time largely superfluous.

Placement Heads:

Flux Dispenser for Full Flip Chip Capability (Option)

Technical Data

Programmable amount 2 µl to 100 µl

Smallest application incre-

ment

1 µl

Content of syringe 1 ml

Content of flux reservoir 100 ml

Volume to be applied at the

mounting location

Varies by Flip Chip size as well as wetting

properties of flux and substrate material

Flip Chip down holding time

after placement 0 to 5 s

Increment down holding ti-

0.01 s

Minimum waiting time prior

to PCB transport 0 to 40 s

Increment waiting time 1 s

Dispensing cycle time 1.5 s including positioning

Rinse cycle 1 to 10 x contents of syringe

Filling level 1 Warning

Filling level 2 Empty (causes machine stop)

Accuracy of dispenser

needle positioning

± 0.05 mm