1OM-1625-004_w.pdf - 第198页

1OM-1603 4-21 4. Fiducial Marks : Chap.4 (3) Material Copper Leaf, Ni Plating, Solder Plating, Solder Leveler, Au Plating Note (a) A copper leaf, a resist, a coating, a silk print, and a punched hole should not existin…

1OM-1603

4-20

4. Fiducial Marks : Chap.4

Mark Type D1 [mm] D2 [mm] Remarks

rekcehC

)elgnatceR(

0.5 to 3.0 0.5 to 3.0

• Mark Reference :

Contact of Two

Rectangles

eloH hguorhT

)dnuoR(

0.5 to 3.0 0.5 to 1.5

• Mark Reference :

Center

• D2 :

Size of a punched

hole

• W : Min. 0.25 mm

kraM daP

)ralugnatceR(

0.5 to 3.0 0.5 to 2.0

• Mark Reference :

Center of Gravity

Or Or

(Front Side of Machine)

T1E4-2

Note

(a) The error of the mark size should be within ± 10% by comparison with the

reference pattern.

(b) A through hole or a pad mark should have only one land which is directed

in increments of 45°.

(2) Specications of Line extended from a Pad Mark or a Through Hole.

(See below)

80°

45°

Unit : mm

F1E13

1007-004

1OM-1603

4-21

4. Fiducial Marks : Chap.4

(3) Material

Copper Leaf, Ni Plating, Solder Plating, Solder Leveler, Au Plating

Note

(a) A copper leaf, a resist, a coating, a silk print, and a punched hole should not

existintherangeof1.0mminbothXandYdirectionsfromtheoutermost

edgesofaducialmark.Theymaycausefalserecognition.

(Front Side of Machine)

1.0

1.01.0

1.0

Example:

Unit : mm

F1E14

(b) TheshapeofPCB(acutout,apunchedhole),theexternalelements(light

reectedfromastructure,lightemittedfromanexternaldevice,etc.)may

sometimesinterferewiththerecognitionofducialmarks.

(c) Aducialmarkshouldmakeamplecontrastwiththesurroundings.(To

prevent false recognition)

(d) Anythingresemblingapatternsimilartoaducialmarkshouldnotexistin

thedesignatedwindow.Ifoneexists,itmaycausefalserecognition.

(e) Atestmayberequiredwhentheducialmarkcannotberecognized

becauseoftheextremewarpageofthePCB.

1007-004

1OM-1603

4-22

5. List of Vacuum Nozzle Types : Chap.4

5. List of Vacuum Nozzle Types

Themachineisequippedwithnozzlesdesignatedinthedeliveryspecicationsat

shipment.

Nozzle

Type

NO.

Shape

Note (a)

Component Size

(mm)

Note (b)

Applicable Components

for Reference

Remarks

Part No.

Part Name

HG22C

Stroke

I.D.

1.5

0.4 × 0.2

Thickness

0.2 to 0.3

0402-Type Resistors and

Capacitors

•

Nozzle for

Front Lighting

Recognition

•

Soft Mounting

Nozzle

HG22C---

NOZZLE_HG22C

HG32C

I.D.

0.4 × 0.2

0.7 × 0.4

Stroke

1.6

0.6 × 0.3

Thickness

0.2 to 0.3

0603-Type Resistors and

Capacitors

•

Nozzle for

Front Lighting

Recognition

•

Soft Mounting

Nozzle

HG32C---

NOZZLE_HG32C

HG52C

Stroke

I.D.

1.5

1.0 × 0.5 to

1.6 × 0.8

Thickness

0.2 to 0.3

1005-Type Resistors and

Capacitors

•

Nozzle for

Front Lighting

Recognition

•

Soft Mounting

Nozzle

HG52C---

NOZZLE_HG52C

HG82C

I.D.

1.6 × 0.8 to

2.0 × 1.25

Thickness

0.45 to 0.8

1608-Type Resistors and

Capacitors

•

Nozzle for

Front Lighting

Recognition

•

Soft

Mounting

Nozzle

HG82C---

NOZZLE_HG82C

HV13C

I.D.

O.D.

2.0 × 1.25 to

3.2 × 2.5

Thickness

0.45 to 1.25

2012-Type Resistors,

Capacitors and

Super Mini-Transistors

•

Nozzle for

Front

Lighting

Recognition

HV13C---

NOZZLE_HV13C

T1E5-1

1012-004

( )