Siplace TX-设备参数-EN.pdf - 第22页

22 Component feeding Alternative SIPLACE feeder modules JTF-ML 2 The SIPLACE TX can accommodate a SIPLACE JTF-ML 2 at locat ion 1. The SIPLACE JTF-ML 2 is fitted to the side. Depending on the magazine type, the SIPLACE J…

Component feeding

Alternative SIPLACE modules

SIPLACE Glue Feeder

The SIPLACE Glue Feeder

allows you to position dots of

adhesive on a component,

before it is placed. These

dots of adhesive can then be

checked by the SIPLACE

Vision system. The required

glue dots can be defined in

the Component Shape

Editor in SIPLACE Pro and

you can also define whether

individual dots of adhesive

are to be excluded from

inspection or not.

This adhesive function can

be enabled and disabled in

the Component Editor in

SIPLACE Pro. The SIPLACE

Glue Feeder is a special

feeder module which needs

to be manually configured as

a fixed feature on a certain

table track.

Linear Dipping Unit X

(LDU X)

The LDU X is used for coat-

ing Flip-Chips and CSP com-

ponents with fluxThe flux

container slides with a linear

movement over the dip plate

and coats the cavity in the dip

plate with a layer of flux (pre-

defined layer thickness). The

parameters for coating a

component with flux are pre-

scribed in SIPLACE Pro. The

component is coated and

then the flux layer is

renewed.

This sequence guarantees

consistent processing condi-

tions for the components.

The LDU X is taken into

account as an independent

feeder module type in the

setup. This module can be

set up on the component trol-

leys of the SIPLACE TX-

Series. An implemented

warming function allows the

viscosity of the flux to be

altered.

Linear Dipping Unit (occupies 5 loca-

tions of an 8 mm X feeder module

SIPLACE Glue Feeder (occupies 9 locations of an

8 mm X feeder module, max. 1 per head)

Component feeding

Alternative SIPLACE feeder modules

JTF-ML 2

The SIPLACE TX can

accommodate a SIPLACE

JTF-ML 2 at location 1. The

SIPLACE JTF-ML 2 is fitted

to the side.

Depending on the magazine

type, the SIPLACE JTF-ML

2 stores up to 18 thin or, as

an option, 14 thick JEDEC

waffle pack trays in an

exchangeable cassette and

supplies them as required.

The placement machine can

therefore be supplied with

different component types at

variable changeover times.

An output conveyor

extension is required when

using the JTF-ML 2. This

extends the conveyor by

600 mm.

Technical data

Width x length x height (tower)

374.5 mm x 322.7 mm x 707.0 mm

Width x length x height (conveyor)

356.2 mm x 346.0 mm x 68.2 mm

Weight

Tower (empty): 26.3 kg (58.0 lbs.)

Total: ~36 kg (79.4 lbs.) (depending on application)

Storage capacity

JEDEC waffle pack tray specification JEDEC Standard: 95-1 & IEC 60286-5

Waffle pack tray, thin 18 JEDEC waffle pack trays or

18 magazine trays (cookie trays)

(in two cassettes)

Thick waffle pack tray 14 JEDEC waffle pack trays or

14 magazine trays (cookie trays)

(in two cassettes)

Waffle pack tray changeover time 3.15 to 6.1 seconds (depending on application

)

a) 3.15 seconds to the next waffle pack tray with maximum acceleration, 6.1 seconds from the first to the

ninth waffle pack tray with minimum acceleration

Slot n to n+1 3.15 to 5.4 seconds (maximum/minimum accelera-

tion)

Cassette

Width x length x height 343.7 mm x 136 mm x 137 mm

Max. load weight (per cassette 4.45 kg (incl. weight of cassette)

JTF ML 2

SIPLACE Vision

High Placement Performance and Best Quality

SIPLACE Vision is designed

to recognize and measure

components and boards

(substrates), so that these

can then be placed and con-

nected precisely.

In the placement area,

SIPLACE Vision determines

the position of the compo-

nent on the nozzle and there-

fore facilitates exact

positioning of components

on the printed circuit boards.

There is a large component

library available which

already contains all standard

component shapes. Wizard

assistants, such as the Com-

ponent Shape Wizard, make

it easier to create new com-

ponent shapes.

Component recognition

SIPLACE Vision identifies each individual component by its geometry and color. Even complex com-

ponent shapes are detected with high reliability. This component recognition check is performed in a

single step, with no extra time involved but with optimum scanning of each individual component. The

camera types are adjusted to the various head types and present a range of different resolutions, field

of vision sizes, illumination types and focal areas. See also the technical data for the relevant place-

ment heads from page 9 onwards. With the help of different illumination levels and brightness stages,

almost every component shape can be easily recognized. The system also saves images of the com-

ponents, so-called "Vision dumps". These enable you to analyze rejected components and to further

improve component shape descriptions. This supports the early recognition of faults in new products

and increases process reliability. These vision dumps also serve as evidence in the event of defective

component supplies.

Component recognition is used for:

• Tolerance checks for component dimensions, L x W, (shape)

• Tolerance checks for component features e.g.:

• Lead/ball grids

• Lead/ball length/diameter

• Deformed leads/missing balls

• Damage/discoloration

• Flipped/face down

• Vision dumps in the event of malfunctions

• Pin 1 / polarity recognition

• Pattern matching

• Glue dot inspection

• Reading component barcodes/data matrix codes

• Pickup reliability

• Pocket measurement

• Tray measurement

• Offset of component to nozzle center and dynamic correction of pickup position