ANSI ESD-S20.20-2021-EN.pdf - 第5页

ANSI/ESD S20. 20- 2021 i (This foreword is not part of ESD Association Standard ANSI/ ESD S20.20- 2021 ) FOREWORD This standard covers the r equirements neces sary to establish, implement, and maintain an electrostatic d…

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ANSI/ESD S20.20-2021
Electrostatic Discharge Association (ESDA) standards and publications are designed to serve the
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the interchangeability and improvement of products, and assisting the purchaser in selecting and
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shall not in any respect preclude any member or non-member of the Association from manufacturing
or selling products not conforming to such standards and publications. Nor shall the fact that a standard
or publication that is published by the Association preclude its voluntary use by non-members of the
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standards and publications are adopted by the ESDA in accordance with the ANSI Patent policy.
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product or manufacturer is a proper matter for the individual company concerned and cannot be
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Published by:
Electrostatic Discharge Association
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Copyright © 2021 by EOS/ESD Association, Inc.
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ISBN: 1-58537-332-X
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ANSI/ESD S20.20-2021
i
(This foreword is not part of ESD Association Standard ANSI/ESD S20.20-2021)
FOREWORD
This standard covers the requirements necessary to establish, implement, and maintain an
electrostatic discharge (ESD) control program for activities that manufacture, process, assemble,
install, transport, package, label, service, test, inspect, or otherwise handle electrical or electronic
parts, assemblies, and equipment susceptible to damage by electrostatic discharges greater than
or equal to 100 volts human body model (HBM) and 200 volts charged device model (CDM). The
CDM voltage level used in this document is based on managing process essential insulators to
mitigate field-induced voltages on devices that could lead to damage.
This standard also defines the requirements for isolated conductors. The reference to machine
model (MM) is retained in this standard for the historical association to the MM robustness of
devices to isolated conductors.
HBM and CDM fully characterize the ESD robustness of devices. Therefore, MM testing is no longer
required to qualify devices, and test data may not be available.
This document covers the ESD control program requirements for establishing a program to handle
ESD sensitive (ESDS) items based on the historical experience of both military and commercial
organizations. References include EOS/ESD Association, U.S. Military, and ANSI approved
standards for material properties and test methods. The fundamental ESD control principles that
form the basis of this document are:
A. All conductors in the environment, including personnel, shall be bonded or electrically
connected and attached to a known ground or contrived ground (as on shipboard or aircraft).
This attachment creates an equipotential balance between all items and personnel.
Electrostatic protection can be maintained at a potential above a "zero" voltage ground potential
if all items in the system are at the same potential.
B. Process essential insulators in the environment cannot lose their electrostatic charge by
attachment to ground. Ionization systems provide neutralization of charge on these process
essential insulators (circuit board materials and some device packages are examples of
necessary insulators). Assessment of the ESD hazard created by electrostatic charge on the
process essential insulators in the workplace is required to ensure that appropriate actions are
implemented, commensurate with the risk to ESDS items.
C. Transportation of ESDS items necessitates enclosures in protective materials, although the
type of material depends on the situation and destination. While these materials are not
discussed in the document, it is important to recognize the differences in applications. For more
clarification, see ANSI/ESD S541.
Any relative motion and physical separation of materials or flow of solids, liquids, or particle-laden
gases can generate an electrostatic charge. Common sources of electrostatic charge include
personnel, items made from common polymeric materials, and processing equipment. ESD
damage can occur in several ways, including:
i. A charged object (including a person) coming into contact with an ESDS item.
ii. A charged ESDS item making contact with ground or another conductive object at a different
potential.
iii. An ESDS item making contact with ground or another conductive object while exposed to an
electrostatic field.
Examples of ESDS items include, but are not limited to, microcircuits, discrete semiconductors,
thick and thin film resistors, hybrid devices, printed circuit boards, and piezoelectric crystals. It is
possible to determine device and item susceptibility by exposing the item to simulated ESD events.
The level of sensitivity, determined by testing using simulated ESD events, may not necessarily
relate to the level of sensitivity in a real-life situation. However, the sensitivity levels are used to
establish a baseline of susceptibility data to compare devices with equivalent part numbers from
different manufacturers. Two different models are used for the characterization of electronic items:
HBM and CDM.
ANSI/ESD S20.20-2021
ii
For more information on the requirements in this standard, there is a technical report, ESD TR20.20
ESD Association Technical Report Handbook for the Development of an Electrostatic Discharge
Control Program for the Protection of Electronic Parts, Assemblies, and Equipment.
Compliance with this standard can be demonstrated through third-party certification. The
certification process is like any quality management system certification such as ISO 9001.
Information on the certification process can be obtained by contacting an EOS/ESD Association,
Inc. approved certification body. For a list of EOS/ESD Association, Inc. approved certification
bodies, see www.esda.org.
This standard
1
was originally designated ANSI/ESD S20.20-1999 and was approved on August 4,
1999. ANSI/ESD S20.20-2007 was a revision of ANSI/ESD S20.20-1999 and was approved on
February 11, 2007. ANSI/ESD S20.20-2014 is a revision of ANSI/ESD S20.20-2007 and was
approved on March 25, 2016. ANSI/ESD S20.20-2021 is a revision of ANSI/ESD S20.20-2014 and
was approved on October 28, 2021.
At the time, the ANSI/ESD S20.20-2021 was prepared, the 20.20 ESD control program
Subcommittee had the following members:
John T. Kinnear, Jr., Chair
IBM
Christopher Almeras
Raytheon
Kevin Duncan
Seagate Technology
Reinhold Gaertner
Infineon Technologies AG
Steven Gerken
Ron Gibson
Advanced Static Control
Consulting
David Girard
Staticon Support Services,
Inc.
Fatjon (Toni) Gurga
Reliant ESD
Ginger Hansel
Dangelmayer Associates
Shane Heinle
Digi-Key Corporation
Matt Jane
Tesla
Gary Latta
SAIC
Michael Manders
The United States Air Force
Chuck McClain
Micron Semiconductor
Robert "Hank" Mead
BAE Systems, Inc.
Ronnie Millsaps
Carl Newberg
Simco-Ion
Andrew Nold
Teradyne, Inc.
Daniel O'Brien
University of Dayton
Research Institute
Dale Parkin
Seagate Technology
Nathaniel Peachey
Qorvo
Keith Peterson
Missile Defense Agency
Wolfgang Stadler
Intel Deutschland GmbH
Matt Strickland
The Boeing Company
David E. Swenson
Affinity Static Control
Consulting, LLC
Terry Welsher
Dangelmayer Associates
Craig Zander
Transforming Technologies
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ESD Association Standard (S): A precise statement of a set of requirements to be satisfied by a material,
product, system, or process that also specifies the procedures for determining whether each of the
requirements is satisfied.