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User Manual SIPLACE X-Series 1 Introduction From software version SR.605.xx 07/2008 EN Edition 1.1 Description of the machine 23 1 Fig. 1.1 - 1 Placement principl e using the Collect&Place method 1 1 1 1.1.5 New opti…

1 Introduction User Manual SIPLACE X-Series

1.1 Description of the machine From software version SR.605.xx 07/2008 EN Edition

1.1.3 SIPLACE X2

The X2 placement machine has one gantry per placement area. The following placement head

configurations are possible:

a) Placement area 1

b) Placement area 2

The performance data can be found in Section 3.1 on page 103.

1.1.4 The SIPLACE principle

The placement heads fetch the components from the fixed feeder modules on the component trol-

ley or from the trays in the matrix tray changer, and place the PCBs, which are also stationary. The

placement machines from the X-series have two placement areas:

– on the single conveyor, one or two PCBs can be placed concurrently.

– on the dual conveyor, up to four PCBs can be placed concurrently.

The principle of the "stationary component supply" and "stationary PCB", which has proved most

suitable for all SIPLACE placement machines, has a number of significant advantages:

– There are no downtimes for topping up components or splicing tapes.

– The vibration-free component feeder means that even the smallest components (e.g. 01005)

are picked up reliably.

– The PCB, which does not move during the placement process, prevents the components slip-

ping.

– The combination of placement heads with nozzle changers always guarantees an optimum

nozzle configuration for every placement process, thus minimizing traversing paths and opti-

mizing the placement sequence.

High flexibility, cost-effectiveness and set-up reliability combine to ensure that the SIPLACE X-se-

ries provides high productivity. Minimum down times increase utilization and thus help to increase

productivity.

Placement

heads

Placement heads PA1

PA2

C&P20A C&P12 C&P6 TH

C&P20A yes no no no

C&P12 yes yes no no

C&P6 yes yes yes no

TH yes yes yes yes

User Manual SIPLACE X-Series 1 Introduction

From software version SR.605.xx 07/2008 EN Edition 1.1 Description of the machine

Fig. 1.1 - 1 Placement principle using the Collect&Place method

1.1.5 New options and performance features

The following new options are available to extend the machine's functionality:

– SIPLACE XPL

The "SIPLACE X-series Productivity Lane" option in the middle of the dual PCB conveyor al-

lows PCBs to be overtaken in the placement machine. As with the productivity lift, the place-

ment machine is operated in parallel. This third conveyor track can be viewed from above,

and even works with the protective cover open. This allows the path that the PCB takes

through the machine to be followed for checking purposes.

– SIPLACE XPS

SIPLACE X-series productivity shuttles on the input/output side of the machine or line distrib-

ute the PCBs to be processed to the required track of the dual PCB conveyor or to the

SIPLACE XPL.

1 Introduction User Manual SIPLACE X-Series

1.1 Description of the machine From software version SR.605.xx 07/2008 EN Edition

– 3x8mm SL tape feeder module

SL means shutterless, that is without a component cover. Dispensing with unnecessary me-

chanical parts reduces the acquisition costs and maintenance costs for this feeder module.1

– Splice detection for S tape feeder modules

Splice detection for S tape feeder modules can be retrofitted on the machines.

– Waffle-pack changer

The waffle-pack changer allows the following locations to dock in at X2 and X3 placement

machines:

SIPLACE X2: feeder locations 2 and 4

SIPLACE X3: location 2

– LDU-X

The X linear dipping unit is used to wet flip-chip and CSP components with flux .