X service技术参数.pdf - 第12页

12 Placement Hea ds 12-Nozzle Collect & Place Head for High-Speed Placement Description The 12-nozzle Colle ct & Place head works on the Collect & Place principle. T his means that, within ea ch cycle, twelve…

Placement Heads

20-Nozzle Collect&Place Head for

Very High-Speed Placement

Description

The 20-nozzle Collect & Place

head works on the Collect &

Place principle. This means

that, within each cycle,

twenty components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

component is placed gently

and accurately on the board.

The 20-nozzle Collect & Place

head succeeds in consider-

ably increasing the output of

the placement head and

thus of the overall place-

ment machine. The high-res-

olution component camera

allows the 20-nozzle Collect

& Place head to optically cen-

ter and place component

sizes ranging from 0201 to 6

x 6 mm².

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• A component sensor is in-

stalled on the 20-nozzle

Collect & Place head to in-

crease the placement reli-

ability. It checks for the

presence of a component

at the nozzle at the pick-up

and placement position.

• The digital component

camera on the placement

head determines the pack-

age form and the precise

position of each compo-

nent at the nozzle. Any

deviations from the re-

quired pick-up position are

corrected before place-

ment takes place.

• A sensor registers the rela-

tive movement between

nozzle and segment while

setting down compo-

nents, and sends a signal

to the axis controller to

regulate the position. With

this sensor stop method,

differences in height dur-

ing pick-up and any un-

evenness of the PCB

surface are compensated

during placement.

Star

rotation

Pick up compo-

nent and place it

Turn component

individually

Optically center

component

Check

vacuum

Component

sensor

Component

sensor

Star motor

Star with

20 nozzles

Component

camera

Placement Heads

12-Nozzle Collect & Place Head for

High-Speed Placement

Description

The 12-nozzle Collect & Place

head works on the Collect &

Place principle. This means

that, within each cycle,

twelve components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

air kiss sets down the compo-

nent gently and accurately

on the board.

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up or set

down correctly.

•A digital component cam-

era on the placement head

determines the precise

position of each compo-

nent at the nozzle. Any de-

viations from the required

pick-up position are cor-

rected before placement

takes place.

• The package form is also

checked and the compo-

nent is not placed if the

geometric data thus deter-

mined differs from the

programmed data.

The vertical axis for picking

up and placing the compo-

nent works in sensor stop

mode, in which differences

in height during pick-up and

any unevenness of the PCB

surface are compensated

during placement.

In addition to the vacuum

check, an optional compo-

nent sensor may be used to

check for the presence of a

component at the nozzle.

The use of a component sen-

sor is recommended, particu-

larly when placing small

components, such as 0201.

"High-resolution camera“

option

The high-resolution compo-

nent camera allows the

12-nozzle Collect & Place

head to optically center and

place component sizes rang-

ing from 0201 to 18.7 x

18.7 mm².

Component vision module

DP axis:

Rotate component

to placement angle

Pull off or

insert sleeve

Z axis

Pick up or

place component

DR axis:

Rotate star

Reject

component

Placement Heads

6-Nozzle Collect&Place Head

for High-Speed IC Placement

Description

The 6-nozzle Collect & Place

head also works on the Col-

lect & Place principle. The

high-resolution digital com-

ponent camera allows the

6-nozzle Collect & Place head

to optically center and place

component sizes ranging

from 0201 to 27 x 27 mm².

Checking and self-learning

functions

The checking and self-learn-

ing functions described on

page 12 for the 12-nozzle

Collect & Place head also

apply to the 6-nozzle Collect

& Place head.

Component vision module

DP axis:

Rotate component

to placement angle

Z axis

Pick up or place component

DR axis:

Rotate star

Reject component,

pull off or

insert sleeve