X service技术参数.pdf - 第15页
15 Placement Heads TwinHead for High-Pre cision IC Placement Description This sophisti cated plac ement head consists of t wo place- ment heads of the same type coupled toge ther (twin head). Both hea ds work using the P…
14
Placement Heads
Collect & Place Heads
Technical Data for the C&P Heads
*) For components < 18 x 18 mm²
**) For components ≥ 18 x 18 mm²
***) Smaller components such as the 01005 available on request
Please note that the component range that can be placed is also affected by the pad geometry and
customer-specific standards.
20-nozzle
Collect&Place head
12-nozzle
Collect & Place head
(standard-
component camera)
12-nozzle
Collect & Place head
(high-resolution
component camera)
6-nozzle
Collect&Place head
Component range
0201
***)
to 2220,
Melf, SOT, SOD
0402 to PLCC44, BGA,
µBGA, flip-chip, TSOP,
QFP, SO to SO32,
DRAM
0201 to flip-chip, bare
die, PLCC44, BGA,
µBGA, TSOP, QFP, SO
to SO32, DRAM
0201 to 27 x 27 mm²
Component specifica-
tions
max. height
min. lead pitch
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
4 mm
0.3 mm
0.4 mm
0.2 mm
0.2 x 0.2 mm²
6 x 6 mm²
1 g
6 mm
0.5 mm
0.45 mm
0.25 mm
0.5 x 0.5 mm²
18.7 x 18.7 mm²
2 g
6 mm
0.3 mm
0.25 mm
0.14 mm
0.3 x 0.3 mm²
18.7 x 18.7 mm²
2 g
8.5 mm
0.3 mm
0.25 mm
*)
0.35 mm
**)
0.14 mm
*)
0.2 mm
**)
0.3 x 0.3 mm²
27 x 27 mm²
5 g
Programmable place-
ment force
2.0 N - 4.5 N 2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N
Nozzle types 10xx, 11xx, 12xx 9 xx 9 xx 8 xx, 9 xx
X/Y accuracy ± 41 µm/3 σ
± 55 µm/4 σ
± 45 µm/3 σ
± 60 µm/4 σ
± 41 µm/3 σ
± 55 µm/4 σ
± 45 µm/3 σ
± 60 µm/4 σ
Angular accuracy ± 0.5°/3 σ
± 0.7°/4 σ
± 0.5°/3 σ
± 0.7°/4 σ
± 0.5°/3 σ
± 0.7°/4 σ
± 0.2°/3 σ
± 0.3°/4 σ
15
Placement Heads
TwinHead for High-Precision IC Placement
Description
This sophisticated placement
head consists of two place-
ment heads of the same type
coupled together (twin
head). Both heads work
using the Pick&Place princi-
ple. The TwinHead is suitable
for processing particularly
difficult or large compo-
nents. Two components are
picked up by the placement
head, optically centered on
the way to the placement
position and rotated into the
necessary placement angle.
The components are then
placed gently and accurately
on the board.
The placement head can also
use the nozzles for the Pick &
Place head (used on the F5
HM) in addition to the noz-
zles recently developed for
the TwinHead. Collect &
Place head nozzles can also
be used.
Checking and self-learning
functions
The TwinHead's reliability
can be further increased with
various checking and self-
learning functions.
• For example, vacuum
checks at the nozzles indi-
cate whether the compo-
nent was picked up or set
down correctly.
• High-resolution, digital
component vision camer-
as such as the Fine-pitch
and Flip-chip vision camer-
as (optional) identify the
smallest deviations in the
component position. The
digital vision system cor-
rects such deviations, thus
guaranteeing a correct
placement position. The
digital component camer-
as are permanently fixed
to the machine frame.
• The component package
form is also checked, and
the component is not
placed if the geometric
data thus determined dif-
fers from the programmed
data.
• A force sensor measures
and monitors the specified
component placement
forces.
Z axis
DP axis
How the TwinHead works
16
Placement Heads
TwinHead for High-Precision IC Placement
Technical Data for the TwinHead
*) If standard nozzles are used
Please note that the component range that can be placed is also affected by the pad geometry and
customer-specific standards.
Optical centering with
digital
Fine-Pitch Camera Flip-Chip Camera (Option)
Component range 0603 to SO, PLCC, QFP, BGA, spe-
cial components, bare dies, flip-
chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components,
bare dies, flip-chips, shields
Component specifica-
tions
max. height
min. lead pitch
min. ball pitch
min. ball diameter
min. dimensions
max. dimensions
max. weight
25 mm (larger heights on request)
0.3 mm
0.45 mm
0.25 mm
0.5 x 0.5 mm²
55 x 45 mm²
(single measurement)
For use with two nozzles
50 x 50 mm² or
69 x 10 mm²
For use with one nozzle:
85 x 85 mm² or
125 x 10 mm²
max. 200 x 125 mm² (with restric-
tions)
100 g
*)
25 mm (larger heights on request)
0.25 mm
0.14 mm
0.08 mm
0.2 x 0.2 mm²
16 x 16 mm²
(single measurement)
100 g
*)
Programmable
placement force
1.0 N - 15 N 1.0 N - 15 N
Nozzle types 5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
5 xx (standard)
4 xx + adapter
8 xx + adapter
9 xx + adapter
Nozzle spacing on the
two Pick&Place heads
70.8 mm 70.8 mm
X/Y accuracy ± 26 µm/3 σ
± 35 µm/4 σ
± 22 µm/3 σ
± 30 µm/4 σ
Angular accuracy ± 0.05°/3 σ
± 0.07°/4 σ
± 0.05°/3 σ
± 0.07°/4 σ