ACF-Bonding.pdf - 第8页
Panel R epair F actory India pvt. Ltd. 8 REMO VE COF FR OM PCB & GLASS SIDE SMD RANGE- TEMPRA TURE-250 T O 300 ° AIR -4 T O 5 COF REM OVING & HO T GUN DIRE CTION
Panel Repair Factory India pvt. Ltd. 7
ACF Bonding Process
Check LCD/LED Panel
LCD/LED Panel fault mark
Remove COF from PCB & ITO side
Cleaning COF, PCB & ITO
Prepare COF for bonding
Use acf bonding machine for bonding
Panel Repair Factory India pvt. Ltd. 8
REMOVE COF FROM PCB & GLASS SIDE
SMD RANGE-
TEMPRATURE-250 TO 300 °
AIR -4 TO 5
COF REMOVING
& HOT GUN
DIRECTION
1. REMOVE SEALING GLUE
2. REMOVE COF FROM :
FIRST ON PCB SIDE
SECOND GLASS SIDE
REMOVE
SEELING
GLUE FROM
PANEL
REMOVE
COF FROM
GLASS SIDE
REMOVE
COF FROM
PCB SIDE
9 Panel Repair Factory India pvt. Ltd.