OM-1076-001.pdf - 第154页
3.2 ICs 01 11-002 3-15 Tg0502-PM-CL (2) T aping Specifications 14th, 15th, and 16th cells are added in the component ID, repre- senting the taping specifications. Each character in the cells rep- resents the following. C…
3.2.3 Abbreviated Name of Component Makers
The pre-determined abbreviated maker names are used for clear iden-
tification.
Refer to "3.1.3 Abbreviated Name of Component Makers" for details.
3.2.4 Taping Specifications
(1) Applicable Packaging Types and Components
• Applicable Packaging Types
Paper, Embossed, Adhesive, Tray and Stick
• Applicable Components
See the table below.
Component Type Abbreviations Part Name
IC SOP Small Outline Package IC
VSOP SOP whose lead pitch is
1 mm or less
VHSOP VSOP with Heat Sink
QFP Quad Flat Package IC
VQFP QFP whose lead pitch is less
than 0.65 mm
PLCC Plastic Leaded Chip Carrier IC
BGA Ball Grid Array-Type IC
3.2 ICs
0111-002 3-14 Tg0502-PM-CL
Table C5
3.2 ICs
0111-002 3-15 Tg0502-PM-CL
(2) Taping Specifications
14th, 15th, and 16th cells are added in the component ID, repre-
senting the taping specifications. Each character in the cells rep-
resents the following.
Component ID: 14 15 16
14th Cell : The specified character represents the width of a tape.
2: 8 mm B: 44 mm
3: 12 mm E: 56 mm
4: 16 mm J: 72 mm
6: 24 mm -: None
8: 32 mm
15th Cell : The specified character represents a component feed
pitch.
2: 8 mm 8: 32 mm
3: 12 mm 9: 36 mm
4: 16 mm A: 40 mm
5: 20 mm B: 44 mm
6: 24 mm -: None
7: 28 mm
16th Cell : The specified character represents a carrier type of
components.
P: Paper
E: Embossed
A: Adhesive
T: Tr a y
S: Stick
Example:(a)
SOP008-B01TOS 6 3 E
Tape Width: 24 mm, Component Feed Pitch: 12
mm, and Embossed Tape
(b)
SOP008-B01TOS 8 3 A
Tape Width: 32 mm, Component Feed Pitch: 12
mm, and Adhesive Tape
0107-001 3-16 Tg0502-PM-CL