IPC-A-610国际标准中英文对照.pdf - 第4页

IPC-A-610 国际标准中英文对照

Table of Contents(cont.)目录(续)

4.4.3 Adhesive Bonding-Elevated 5.1.2 Vertical..........................86

Components.....................62 垂直

粘合—悬空组件 5.2 Mounting............................87

4.4.4 Wire Hold Down.................64 安装

压线器 5.2.1 Horizontal-Axial Leaded-

4.4.5 Cable Ties,Tie Wraps,Spot Ties..65 Supported Holes...................87

电缆的捆绑、束线带、点结水平—轴向引脚—有支撑孔

4.4.6 Lacing.........................68 5.2.2 Horizontal-Axial Leaded-

索系 Unsupported Holes...............88

4.4.7 Wire Dress for Terminations to 安装-水平-轴向引脚-无支撑的孔

Connectors Without Strain/Stress 5.2.3 Horizontal-Radial Leaded .......90

Relief.........................69 水平—径向引脚

端子与连接器之间线材外被的张力和应力 5.2.4 Vertical-Axial Leaded-

4.5 Connectors, Handles, Extractors....70 Supported Holes................91

连接器—把手—抽取器垂直—轴向引脚—有支撑的孔

4.6 Heat sink........................71 5.2.5 Vertical-Axial Leaded-

散热片 Unsupported Holes..............93

4.6.1 Insulators and Thermal Compounds.73 垂直-轴对称引脚-无支撑物的孔

绝缘体和热敏混合物 5.2.6 Vertical-Radial Leaded..........94

4.6.2 Contact..........................74 直——径向引脚

接触片 5.2.6.1 Component Mounting Spacers

4.7 Terminals-Edge Clip................75 Spacers.....................95

终端——边缘夹子组件安装隔离器

4.8 Connector Pins.....................76 5.2.6.2 Component Meniscus..............97

连接器针脚凹型组件

4.8.1 Edge Connector Pins..............77 5.2.7 Wire/Lead Termination-

连接器边缘针脚 Printed Board...................98

4.8.2 Fit Pins.........................77 导线/引脚末端—印刷线路板

压针 5.2.7.1 Protrusion-Straight and

5. Component Installation Location/ partially Clinched Leads........98

Orientation.......................81 露出长度-直形和部分弯曲引脚

组件贴装的位置和方向 5.2.7.2 Clinched........................100

5.1 Orientation.......................85 弯曲

方向

5.1.1 Horizontal....................85

水平

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IPC-A-610 国际标准中英文对照

Table of Contents(cont.)目录(续)

5.2.8 Dual-in-Line Pack (DIP)/ Single-in- 5.1.1 Turrets and Straight Pins.....119

Line pack(SIP) Pins and Sockets....103 塔状和直形针脚

双列式（DIP）封装/单列式（SIP）封装 5.1.2 Bifurcated Terminals..........121

针脚和插槽分叉接线端

5.2.9 Connectors........................105 5.5.1.3 Pierced/Perforated Terminals 124

连接器穿孔/穿洞接线端

5.2.10 Leads Crossing Conductors.........107

引脚与线路交叉 5.5.1.4 Hook Terminals..............126

5.3 Lead Forming.........................108 钩型接线端

引脚形状 5.5.1.5 Series Connected Terminals..128

5.3.1 Bends.............................108 并列接线端组

弯曲

5.3.2 Stress Relief.....................110 5.5.1.6 AWG 30 and Smaller Diameter

应力消除 Wires....................130

5.3.2.1 Supported Holes...................110 AWG30和更小直径导线

有支撑物的孔 5.5.1.7 Staked Wires/Components.....131

5.3.2.2 Unsupported Holes.................112 有支撑的导线/组件

无支撑物的孔 5.5.2 Solder Cups.................133

5.3.2.3 Terminals.........................113 焊帽

接线端 5.5.3 Stress Relief Lead/Wire

5.4 Damage................................114 Bend.......................134

损坏引脚/导线弯曲应力的消除

5.4.1 Lead..............................114 5.5.4 Service Loops...............136

引脚捆绑环

5.4.2 DIP and SOIC......................115 5.5.5 Lead/Wire Placement.........137

DIP 和 SOIC 引脚/导线安插

5.4.3 Axial Lead and Glass Body/Seal....117 5.6 Insulation......................138

轴向引脚和玻璃本体/封装绝缘

5.4.4 Radial (Two Lead).................118 5.6.1 Clearance...................138

放射状（双引脚）间隙

5.5 Terminals.............................119 5.6.2 Damage......................139

接线端损坏

5.5.1 Wrap..............................119 5.6.3 Flexible Sleeve.............141

缠绕软套筒

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IPC-A-610 国际标准中英文对照

Table of Contents(cont.)目录(续)

5.7 Conductor..........................142 6.3.5 Coated Wire Insulation

导体 in Solder..................162

5.7.1 Deformation....................142 焊接中涂层导线的绝缘

变形 6.3.6 Interfacial Connection Without

5.7.2 Damage.........................143 Lead–Vias..................164

损坏无需引脚的接口焊接-通路

6 Soldering............................145 6.4 Unsupported Holes................165

焊接非支撑孔

6.1Soldering Acceptability Requirements148 6.5 Other...........................168

焊接可接受要求其它

6.2 Lead Protrusion....................151 6.5.1 Lead Cutting After

引脚突出 Soldering...................168

6.3 Plated-Through Holes (PTH) 焊接后的引脚剪切

(Supported Holes)..................153 6.5.2 Exposed Basis Metal..........169

镀通孔（PTH）（支撑孔）裸露基材金属

6.3.1 Vertical Fill of Hole..........154 6.5.3 Excess Solder................170

焊孔的垂直填充多锡

6.3.2 Circumferential Wetting- 6.5.3.1 Solder Balls/Splashes........170

Primary Side....................156 锡珠/溅锡

周边润锡—主焊接面 6.5.3.2 Solder Bridging..............172

6.3.2.1 Lead and Barrel.................156 桥接

引脚和焊接柱 6.5.3.3 Solder Webbing...............172

6.3.2.2 LAND Area Coverage-Primary side.157 锡网

焊盘覆盖区域—主焊接面 6.5.4 Pin Holes/Blowholes...........173

6.3.3 Circumferential Wetting-Secondary Side 针孔/气泡

(PTH and Unsupported Holes).....157 6.5.5 Solder Projections...........173

周边润锡—辅焊接面（PTH 和非支撑孔）焊锡锡尖

6.3.4 PTH Mounted Components..........158 6.5.6 Nonwetting...................174

PTH 安装组件未润锡

6.3.4.1 Solder Conditions...............158 6.6 Terminals .......................174

焊接状态接线端

6.3.4.2 Solder in Lead Bend.............160 6.6.1 Bifurcated...................175

弯曲引脚的焊接分叉状

6.3.4.3 Meniscus in Solder..............161 6.6.2 Turret.......................176

焊料凹陷塔状

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