IPC-A-610国际标准中英文对照.pdf - 第7页
IPC-A-610 国际标准中英文对照 Table of Contents(cont.) 目录 ( 续 ) 8.5 Labels................................219 1 0 . 2 . 1 M e a s l i n g a n d C r a z i n g . .......235 标签 白点和龟裂 8.5.1 Bar Coding..........................219 1 0 …
IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
6.6.3 Hook/Pin.........................177 6.8.4 Through-Hole Connections.....191
钩状／销状 通孔连接
6.6.4 Pierced Tab......................178 6.8.5 Flared Flange Terminals......192
圆环片 翻边凸轮状接线端
6.6.5 Solder Cups......................179 6.9 Connector Pins-Press Fit pins...193
焊帽 压式安装针脚
6.6.6 Flared Flange Hardware...........180 6.10 Gold fingers...................196
翻边凸轮 金手指
6.7 Insulation...........................182 7 Cleanliness........................198
绝缘 清洁度
6.7.1 In Solder........................182 7.1 Flux Residues....................199
焊锡内部 助焊剂残留物
6.7.2 Damage...........................183 7.2 Particulate Matter...............200
损坏
特殊物质
6.7.3 Clearance........................184 7.3 Chlorides, Carbonates and White
间隙 Residues........................201
6.8 High Voltage.........................185 氯化物、碳酸盐和白色残留物
高压 7.4 Flux Residues--No-Clean Process
6.8.1 Terminals..........................185 –Appearance....................202
接线端 助焊剂残留物－非清洁制程－外观
6.8.1.1 Wires/Leads......................185 7.5 Surface Appearance..............204
导线/引脚 表面外观
6.8.1.2 Bottom Terminations..............187 8 Marking...........................205
底部接线端 标识
6.8.1.3 Unused...........................188 8.1 Etched Marking (Including Hand
闲置 Printing)....................208
6.8.2 Solder Cups......................189 蚀刻标识（包括人工印刷）
焊帽 8.2 Screened Marking................210
6.8.2.1 Wires/Leads......................189 屏蔽标识
导线/引脚 8.3 Stamped Marking.................213
6.8.2.2 Unused...........................189 压印标记
闲置 8.4 Laser Marking...................216
6.8.3 Insulation........................190 激光标识
绝缘
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IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
8.5 Labels................................219 10.2.1 Measling and Crazing........235
标签 白点和龟裂
8.5.1 Bar Coding..........................219 10.2.2 Blistering and Delamination237
条形码 气泡和分层
8.5.2 Readability.........................219
可读性 10.2.3 Weave Texture / Weave
8.5.3 Adhesion and Damage.................220 Exposure.................239
粘贴和损伤 纤织纹理/纤织暴露
9 Coatings................................222 10.2.4 Haloing and Edge
覆层 Delamination................241
9.1 Conformal Coating.....................223 光晕和边缘分层
印丝层 10.2.5 Pink Ring...................242
9.1.1 General.............................223 粉红圏
概述 10.3 Flexible and Rigid-Flex Printed
9.1.2 Coverage............................223 Wiring.......................242
覆盖范围 柔性和刚柔性印刷线路板
9.1.3 Thickness...........................226 10.4 Solder Resist Discoloration....244
厚度 阻焊层变色
9.2 Solder Resist Coating.................227 10.5 Burns..........................245
阻焊层 灼伤
9.2.1 Wrinkling/Cracking..................228 10.6 Bow and Twist..................246
褶皱/裂缝 弯曲和扭曲
9.2.2 Voids and Blisters..................230 10.7 Conductor/Land Damage..........246
空白和气泡 导线/焊盘损伤
9.2.3 Breakdown...........................232 10.7.1 Reduction in Cross-Sectional
损坏 Area......................246
10 Laminate Conditions....................233 横截面区域的减少
基材状况 10.7.2 Lifted Pads/Lands..........247
10.1 Introduction.........................234 翘起的焊垫/焊盘
概述 11 Discrete Wiring..................250
10.1.1 Identification of Defects........234 离散布线
缺陷识别 11.1 Solderless Wrap................252
10.2 Laminate Damage......................235 无锡缠绕
基材损伤
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IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
11.1.1 Number of Turns...............253 11.2.4.1 Lead in Hole...................272
圈数 孔中的引线
11.1.2 Turn Spacing..................254 11.2.4.2 Wrapped Attachment.............273
圏距 缠绕附着
11.1.3 End Tails, Insulation Wrap....255 11.2.4.3 Lap Soldered...................274
端尾，绝缘缠绕 重叠焊接
11.1.4 Raised Turns Overlap..........257 11.2.5 SMT............................275
隆起交叠 表面粘贴技术
11.1.5 Connection Position...........259 11.2.5.1 Chip and Cylindrical End Cap
连接位置 Components.....................276
11.1.6 Wire Dress....................260 芯片以及柱形末端帽形组件
线包层 11.2.5.2 Gull Wing......................276
11.1.7 Wire Slack....................261 鸥翼
线的松弛 11.2.5.3 J Lead.........................278
11.1.8 Plating.......................262 J型引脚
电镀 11.2.5.4 Vacant Land/Pad................278
11.1.9 Damaged Insulation & Terminals263 缺少焊盘∕焊垫
绝缘和终端的损坏 12 Surface Mount Assemblies.............279
11.1.10 Conductor Damage..............264 表面贴装组装
导体损坏 12.1 staking Adhesive...................285
11.2 Jumper Wires......................265 支撑粘合剂
跳线 12.2 Solder Joints......................286
11.2.1 Wire Selection................266 焊接
线的选择 12.2.1 Chip Components-Bottom Only
11.2.2 Wire Routing..................267 Terminations.................286
走线 芯片组件—底部端边
11.2.2.1 Component Side................268 12.2.1.1 Side Overhang (A)..............287
组件面 边缘悬垂（A）
11.2.2.2 PTH Termination Side..........269 12.2.1.2 End Overhang (B)...............287
PTH 终端面 底面悬垂（B）
11.2.3 Wire Staking..................269 12.2.1.3 End Joint Width(C).............288
线的固定 底面连接宽度（C）
11.2.4 Plated-Through Holes..........271 12.2.1.4 Side Joint Length (D)..........289
镀通孔 边缘连接长度（D）
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