IPC-A-610国际标准中英文对照.pdf - 第5页
IPC-A-610 国际标准中英文对照 Table of Contents(cont.) 目录 ( 续 ) 5.7 Conductor..........................142 6 . 3 . 5 C o a t e d W i r e I n s u l a t i o n 导体 i n S o l d e r ..................162 5 . 7 . 1 D e f o r m a t i o n …
IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
5.2.8 Dual-in-Line Pack (DIP)/ Single-in- 5.1.1 Turrets and Straight Pins.....119
Line pack(SIP) Pins and Sockets....103 塔状和直形针脚
双列式（DIP）封装/单列式（SIP）封装 5.1.2 Bifurcated Terminals..........121
针脚和插槽 分叉接线端
5.2.9 Connectors........................105 5.5.1.3 Pierced/Perforated Terminals 124
连接器 穿孔/穿洞接线端
5.2.10 Leads Crossing Conductors.........107
引脚与线路交叉 5.5.1.4 Hook Terminals..............126
5.3 Lead Forming.........................108 钩型接线端
引脚形状 5.5.1.5 Series Connected Terminals..128
5.3.1 Bends.............................108 并列接线端组
弯曲
5.3.2 Stress Relief.....................110 5.5.1.6 AWG 30 and Smaller Diameter
应力消除 Wires....................130
5.3.2.1 Supported Holes...................110 AWG30和更小直径导线
有支撑物的孔 5.5.1.7 Staked Wires/Components.....131
5.3.2.2 Unsupported Holes.................112 有支撑的导线/组件
无支撑物的孔 5.5.2 Solder Cups.................133
5.3.2.3 Terminals.........................113 焊帽
接线端 5.5.3 Stress Relief Lead/Wire
5.4 Damage................................114 Bend.......................134
损坏 引脚/导线弯曲应力的消除
5.4.1 Lead..............................114 5.5.4 Service Loops...............136
引脚 捆绑环
5.4.2 DIP and SOIC......................115 5.5.5 Lead/Wire Placement.........137
DIP 和 SOIC 引脚/导线安插
5.4.3 Axial Lead and Glass Body/Seal....117 5.6 Insulation......................138
轴向引脚和玻璃本体/封装 绝缘
5.4.4 Radial (Two Lead).................118 5.6.1 Clearance...................138
放射状（双引脚） 间隙
5.5 Terminals.............................119 5.6.2 Damage......................139
接线端 损坏
5.5.1 Wrap..............................119 5.6.3 Flexible Sleeve.............141
缠绕 软套筒
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IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
5.7 Conductor..........................142 6.3.5 Coated Wire Insulation
导体 in Solder..................162
5.7.1 Deformation....................142 焊接中涂层导线的绝缘
变形 6.3.6 Interfacial Connection Without
5.7.2 Damage.........................143 Lead–Vias..................164
损坏 无需引脚的接口焊接-通路
6 Soldering............................145 6.4 Unsupported Holes................165
焊接 非支撑孔
6.1Soldering Acceptability Requirements148 6.5 Other...........................168
焊接可接受要求 其它
6.2 Lead Protrusion....................151 6.5.1 Lead Cutting After
引脚突出 Soldering...................168
6.3 Plated-Through Holes (PTH) 焊接后的引脚剪切
(Supported Holes)..................153 6.5.2 Exposed Basis Metal..........169
镀通孔（PTH）（支撑孔） 裸露基材金属
6.3.1 Vertical Fill of Hole..........154 6.5.3 Excess Solder................170
焊孔的垂直填充 多锡
6.3.2 Circumferential Wetting- 6.5.3.1 Solder Balls/Splashes........170
Primary Side....................156 锡珠/溅锡
周边润锡—主焊接面 6.5.3.2 Solder Bridging..............172
6.3.2.1 Lead and Barrel.................156 桥接
引脚和焊接柱 6.5.3.3 Solder Webbing...............172
6.3.2.2 LAND Area Coverage-Primary side.157 锡网
焊盘覆盖区域—主焊接面 6.5.4 Pin Holes/Blowholes...........173
6.3.3 Circumferential Wetting-Secondary Side 针孔/气泡
(PTH and Unsupported Holes).....157 6.5.5 Solder Projections...........173
周边润锡—辅焊接面（PTH 和非支撑孔） 焊锡锡尖
6.3.4 PTH Mounted Components..........158 6.5.6 Nonwetting...................174
PTH 安装组件 未润锡
6.3.4.1 Solder Conditions...............158 6.6 Terminals .......................174
焊接状态 接线端
6.3.4.2 Solder in Lead Bend.............160 6.6.1 Bifurcated...................175
弯曲引脚的焊接 分叉状
6.3.4.3 Meniscus in Solder..............161 6.6.2 Turret.......................176
焊料凹陷 塔状
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IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
6.6.3 Hook/Pin.........................177 6.8.4 Through-Hole Connections.....191
钩状／销状 通孔连接
6.6.4 Pierced Tab......................178 6.8.5 Flared Flange Terminals......192
圆环片 翻边凸轮状接线端
6.6.5 Solder Cups......................179 6.9 Connector Pins-Press Fit pins...193
焊帽 压式安装针脚
6.6.6 Flared Flange Hardware...........180 6.10 Gold fingers...................196
翻边凸轮 金手指
6.7 Insulation...........................182 7 Cleanliness........................198
绝缘 清洁度
6.7.1 In Solder........................182 7.1 Flux Residues....................199
焊锡内部 助焊剂残留物
6.7.2 Damage...........................183 7.2 Particulate Matter...............200
损坏
特殊物质
6.7.3 Clearance........................184 7.3 Chlorides, Carbonates and White
间隙 Residues........................201
6.8 High Voltage.........................185 氯化物、碳酸盐和白色残留物
高压 7.4 Flux Residues--No-Clean Process
6.8.1 Terminals..........................185 –Appearance....................202
接线端 助焊剂残留物－非清洁制程－外观
6.8.1.1 Wires/Leads......................185 7.5 Surface Appearance..............204
导线/引脚 表面外观
6.8.1.2 Bottom Terminations..............187 8 Marking...........................205
底部接线端 标识
6.8.1.3 Unused...........................188 8.1 Etched Marking (Including Hand
闲置 Printing)....................208
6.8.2 Solder Cups......................189 蚀刻标识（包括人工印刷）
焊帽 8.2 Screened Marking................210
6.8.2.1 Wires/Leads......................189 屏蔽标识
导线/引脚 8.3 Stamped Marking.................213
6.8.2.2 Unused...........................189 压印标记
闲置 8.4 Laser Marking...................216
6.8.3 Insulation........................190 激光标识
绝缘
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