IPC-A-610国际标准中英文对照.pdf - 第6页

IPC-A-610 国际标准中英文对照

Table of Contents(cont.)目录(续)

5.7 Conductor..........................142 6.3.5 Coated Wire Insulation

导体 in Solder..................162

5.7.1 Deformation....................142 焊接中涂层导线的绝缘

变形 6.3.6 Interfacial Connection Without

5.7.2 Damage.........................143 Lead–Vias..................164

损坏无需引脚的接口焊接-通路

6 Soldering............................145 6.4 Unsupported Holes................165

焊接非支撑孔

6.1Soldering Acceptability Requirements148 6.5 Other...........................168

焊接可接受要求其它

6.2 Lead Protrusion....................151 6.5.1 Lead Cutting After

引脚突出 Soldering...................168

6.3 Plated-Through Holes (PTH) 焊接后的引脚剪切

(Supported Holes)..................153 6.5.2 Exposed Basis Metal..........169

镀通孔（PTH）（支撑孔）裸露基材金属

6.3.1 Vertical Fill of Hole..........154 6.5.3 Excess Solder................170

焊孔的垂直填充多锡

6.3.2 Circumferential Wetting- 6.5.3.1 Solder Balls/Splashes........170

Primary Side....................156 锡珠/溅锡

周边润锡—主焊接面 6.5.3.2 Solder Bridging..............172

6.3.2.1 Lead and Barrel.................156 桥接

引脚和焊接柱 6.5.3.3 Solder Webbing...............172

6.3.2.2 LAND Area Coverage-Primary side.157 锡网

焊盘覆盖区域—主焊接面 6.5.4 Pin Holes/Blowholes...........173

6.3.3 Circumferential Wetting-Secondary Side 针孔/气泡

(PTH and Unsupported Holes).....157 6.5.5 Solder Projections...........173

周边润锡—辅焊接面（PTH 和非支撑孔）焊锡锡尖

6.3.4 PTH Mounted Components..........158 6.5.6 Nonwetting...................174

PTH 安装组件未润锡

6.3.4.1 Solder Conditions...............158 6.6 Terminals .......................174

焊接状态接线端

6.3.4.2 Solder in Lead Bend.............160 6.6.1 Bifurcated...................175

弯曲引脚的焊接分叉状

6.3.4.3 Meniscus in Solder..............161 6.6.2 Turret.......................176

焊料凹陷塔状

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IPC-A-610 国际标准中英文对照

Table of Contents(cont.)目录(续)

6.6.3 Hook/Pin.........................177 6.8.4 Through-Hole Connections.....191

钩状／销状通孔连接

6.6.4 Pierced Tab......................178 6.8.5 Flared Flange Terminals......192

圆环片翻边凸轮状接线端

6.6.5 Solder Cups......................179 6.9 Connector Pins-Press Fit pins...193

焊帽压式安装针脚

6.6.6 Flared Flange Hardware...........180 6.10 Gold fingers...................196

翻边凸轮金手指

6.7 Insulation...........................182 7 Cleanliness........................198

绝缘清洁度

6.7.1 In Solder........................182 7.1 Flux Residues....................199

焊锡内部助焊剂残留物

6.7.2 Damage...........................183 7.2 Particulate Matter...............200

损坏

特殊物质

6.7.3 Clearance........................184 7.3 Chlorides, Carbonates and White

间隙 Residues........................201

6.8 High Voltage.........................185 氯化物、碳酸盐和白色残留物

高压 7.4 Flux Residues--No-Clean Process

6.8.1 Terminals..........................185 –Appearance....................202

接线端助焊剂残留物－非清洁制程－外观

6.8.1.1 Wires/Leads......................185 7.5 Surface Appearance..............204

导线/引脚表面外观

6.8.1.2 Bottom Terminations..............187 8 Marking...........................205

底部接线端标识

6.8.1.3 Unused...........................188 8.1 Etched Marking (Including Hand

闲置 Printing)....................208

6.8.2 Solder Cups......................189 蚀刻标识（包括人工印刷）

焊帽 8.2 Screened Marking................210

6.8.2.1 Wires/Leads......................189 屏蔽标识

导线/引脚 8.3 Stamped Marking.................213

6.8.2.2 Unused...........................189 压印标记

闲置 8.4 Laser Marking...................216

6.8.3 Insulation........................190 激光标识

绝缘

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IPC-A-610 国际标准中英文对照

Table of Contents(cont.)目录(续)

8.5 Labels................................219 10.2.1 Measling and Crazing........235

标签白点和龟裂

8.5.1 Bar Coding..........................219 10.2.2 Blistering and Delamination237

条形码气泡和分层

8.5.2 Readability.........................219

可读性 10.2.3 Weave Texture / Weave

8.5.3 Adhesion and Damage.................220 Exposure.................239

粘贴和损伤纤织纹理/纤织暴露

9 Coatings................................222 10.2.4 Haloing and Edge

覆层 Delamination................241

9.1 Conformal Coating.....................223 光晕和边缘分层

印丝层 10.2.5 Pink Ring...................242

9.1.1 General.............................223 粉红圏

概述 10.3 Flexible and Rigid-Flex Printed

9.1.2 Coverage............................223 Wiring.......................242

覆盖范围柔性和刚柔性印刷线路板

9.1.3 Thickness...........................226 10.4 Solder Resist Discoloration....244

厚度阻焊层变色

9.2 Solder Resist Coating.................227 10.5 Burns..........................245

阻焊层灼伤

9.2.1 Wrinkling/Cracking..................228 10.6 Bow and Twist..................246

褶皱/裂缝弯曲和扭曲

9.2.2 Voids and Blisters..................230 10.7 Conductor/Land Damage..........246

空白和气泡导线/焊盘损伤

9.2.3 Breakdown...........................232 10.7.1 Reduction in Cross-Sectional

损坏 Area......................246

10 Laminate Conditions....................233 横截面区域的减少

基材状况 10.7.2 Lifted Pads/Lands..........247

10.1 Introduction.........................234 翘起的焊垫/焊盘

概述 11 Discrete Wiring..................250

10.1.1 Identification of Defects........234 离散布线

缺陷识别 11.1 Solderless Wrap................252

10.2 Laminate Damage......................235 无锡缠绕

基材损伤

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