IPC-A-610国际标准中英文对照.pdf - 第8页
IPC-A-610 国际标准中英文对照 Table of Contents(cont.) 目录 ( 续 ) 1 1 . 1 . 1 N u m b e r o f T u r n s ...............253 1 1 . 2 . 4 . 1 L e a d i n H o l e . . . ................272 圈数 孔中的引线 1 1 . 1 . 2 T u r n S p a c i n g . . …
IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
8.5 Labels................................219 10.2.1 Measling and Crazing........235
标签 白点和龟裂
8.5.1 Bar Coding..........................219 10.2.2 Blistering and Delamination237
条形码 气泡和分层
8.5.2 Readability.........................219
可读性 10.2.3 Weave Texture / Weave
8.5.3 Adhesion and Damage.................220 Exposure.................239
粘贴和损伤 纤织纹理/纤织暴露
9 Coatings................................222 10.2.4 Haloing and Edge
覆层 Delamination................241
9.1 Conformal Coating.....................223 光晕和边缘分层
印丝层 10.2.5 Pink Ring...................242
9.1.1 General.............................223 粉红圏
概述 10.3 Flexible and Rigid-Flex Printed
9.1.2 Coverage............................223 Wiring.......................242
覆盖范围 柔性和刚柔性印刷线路板
9.1.3 Thickness...........................226 10.4 Solder Resist Discoloration....244
厚度 阻焊层变色
9.2 Solder Resist Coating.................227 10.5 Burns..........................245
阻焊层 灼伤
9.2.1 Wrinkling/Cracking..................228 10.6 Bow and Twist..................246
褶皱/裂缝 弯曲和扭曲
9.2.2 Voids and Blisters..................230 10.7 Conductor/Land Damage..........246
空白和气泡 导线/焊盘损伤
9.2.3 Breakdown...........................232 10.7.1 Reduction in Cross-Sectional
损坏 Area......................246
10 Laminate Conditions....................233 横截面区域的减少
基材状况 10.7.2 Lifted Pads/Lands..........247
10.1 Introduction.........................234 翘起的焊垫/焊盘
概述 11 Discrete Wiring..................250
10.1.1 Identification of Defects........234 离散布线
缺陷识别 11.1 Solderless Wrap................252
10.2 Laminate Damage......................235 无锡缠绕
基材损伤
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IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
11.1.1 Number of Turns...............253 11.2.4.1 Lead in Hole...................272
圈数 孔中的引线
11.1.2 Turn Spacing..................254 11.2.4.2 Wrapped Attachment.............273
圏距 缠绕附着
11.1.3 End Tails, Insulation Wrap....255 11.2.4.3 Lap Soldered...................274
端尾，绝缘缠绕 重叠焊接
11.1.4 Raised Turns Overlap..........257 11.2.5 SMT............................275
隆起交叠 表面粘贴技术
11.1.5 Connection Position...........259 11.2.5.1 Chip and Cylindrical End Cap
连接位置 Components.....................276
11.1.6 Wire Dress....................260 芯片以及柱形末端帽形组件
线包层 11.2.5.2 Gull Wing......................276
11.1.7 Wire Slack....................261 鸥翼
线的松弛 11.2.5.3 J Lead.........................278
11.1.8 Plating.......................262 J型引脚
电镀 11.2.5.4 Vacant Land/Pad................278
11.1.9 Damaged Insulation & Terminals263 缺少焊盘∕焊垫
绝缘和终端的损坏 12 Surface Mount Assemblies.............279
11.1.10 Conductor Damage..............264 表面贴装组装
导体损坏 12.1 staking Adhesive...................285
11.2 Jumper Wires......................265 支撑粘合剂
跳线 12.2 Solder Joints......................286
11.2.1 Wire Selection................266 焊接
线的选择 12.2.1 Chip Components-Bottom Only
11.2.2 Wire Routing..................267 Terminations.................286
走线 芯片组件—底部端边
11.2.2.1 Component Side................268 12.2.1.1 Side Overhang (A)..............287
组件面 边缘悬垂（A）
11.2.2.2 PTH Termination Side..........269 12.2.1.2 End Overhang (B)...............287
PTH 终端面 底面悬垂（B）
11.2.3 Wire Staking..................269 12.2.1.3 End Joint Width(C).............288
线的固定 底面连接宽度（C）
11.2.4 Plated-Through Holes..........271 12.2.1.4 Side Joint Length (D)..........289
镀通孔 边缘连接长度（D）
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IPC-A-610 国际标准中英文对照
Table of Contents(cont.)目录(续)
12.2.1.5 Maximum Fillet Height(E)........289 12.2.3.4 Side Joint Length(D)........302
最大焊接轮廓高度（E） 边缘连接长度（D）
12.2.1.6 Minimum Fillet Height(F)........289 12.2.3.5 Maximum Fillet Height(E) ...303
最小焊接轮廓高度（F） 最大焊接轮廓高度（E）
12.2.1.7 Solder Thickness(G).............289 12.2.3.6 Minimum Fillet Height(F)....304
焊接厚度（G） 最小焊接轮廓高度（F）
12.2.2 Chip Components-Rectangular or Square 12.2.3.7 Solder Thickness(G).........305
End Components -1,3 or 5 Side 焊接厚度（G）
Termination........................290 12.2.3.8 End Overlap(J)..............305
芯片组件—矩形或正方形终端组件—1,3 或5 面端边
底部交叠（J）
12.2.2.1 Side Overhang(A).................291 12.2.4 Leadless Chip Carriers with
边缘悬垂（A） Castellated Terminations. ...306
12.2.2.2 End Overhang(B)..................293 方形的无引脚芯片载体端边
底面悬垂（B） 12.2.4.1 Side Overhang (A)...........307
12.2.2.3 End Joint Width(C)...............293 边缘悬垂（A）
底面连接宽度（C） 12.2.4.2 End Overhang (B)............308
12.2.2.4 Side Joint Length(D).............295 底面悬垂（B）
边缘连接长度（D） 12.2.4.3 Minimum End Joint
12.2.2.5 Maximum Fillet Height(E).........295 Width (C)...................308
最大焊接轮廓高度（E） 最小底面连接宽度（C）
12.2.2.6 Minimum Fillet Height(F).........296 12.2.4.4 Minimum Side Joint Length
最小焊接轮廓高度（F） (D)..........................309
12.2.2.7 Solder Thickness(G)..............297 最小边缘连接长度（D）
焊接厚度（G） 12.2.4.5 Maximum Fillet Height
12.2.2.8 End Overlap(J)...................298 (E).....................309
底部交叠（J） 最大焊接轮廓高度（E）
12.2.3 Cylindrical End Cap Termination..299 12.2.4.6 Minimum Fillet Height
圆柱形末端帽形端边 (F).....................310
12.2.3.1 Side Overhang(A).................299 最小焊接轮廓高度（F）
边缘悬垂（A） 12.2.4.7 Solder Thickness (G)........310
12.2.3.2 Side Overhang(B).................300 焊接厚度（G）
边缘悬垂（B） 12.2.5 Flat Ribbon, L, and Gull Wing
12.2.3.3 End Joint Width(G)...............301 Leads.....................311
底面连接宽度（G） 扁带，L 和翼型引脚
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