Fast_Firing_System_EN.pdf - 第9页

9 Large process window at 5300 w/h due to modularity of z ones Large process window through higher z one flexibility The modularity of the Speedre zones allows the user to achieve full polymer binder burn off and fast …

Dual chamber design with cross prole

Dual Chamber Design

for precise proling of each lane

Flexible proling

for precice process control

An insulating wall separating the lanes just above

the belt divides the chamber into two separately

controllable process chambers. Each chamber

has its own sets of specially designed IR lamps

and thermocouples providing the possibility to run

completely different proles independently from

each other.

T °C

Lane 1 Lane 2

With the new dual chamber design, the

Speedre can control the temperature of

each lane separately, making tempera-

ture fluctuations due to unevenly loaded

lanes a problem from the past.

Large process window

at 5300 w/h due to modularity of zones

Large process window through higher zone flexibility

The modularity of the Speedre zones allows the

user to achieve full polymer binder burn off and

fast ring at temperatures up to 900 °C while

processing 5300 wafers/hour. Even at belt speeds

of up to 10 m/min the Rehm Fast ring furnace

offers a large process window in the peak zones,

allowing for the most customized temperature

proles.

T °C

850 °C

t (min)

10 m /min

Rehm Fader Function

for optimized front- and backside ring

The Fader function had rst been introduced in 2009. Top

and bottom IR lamps are controlled separately and thus

enhancing the prole flexibility.

By achieving up to 30 °C difference between the top side

and the bottom side of the wafer, the Speedre enables the

user to re the wafer sides at different temperatures. These

temperatures are close loop controlled and easily managed

in the furnace software.

Multi-layer insulation

for stable process temperature

The Rehm Speedre chamber insulation design, based

on 25 years of oven building experience, is the best in the

industry. The well insulated chamber guarantees an ex-

tremely homogenous heat distribution inside the process

chamber, resulting in a stable process temperature at the

wafer.

A lower housing temperature and the better electrical

efciency of the oven are favorable side effects of the

multi-layer Insulation.

Standard ring furnace

insulation

Rehm Speedre ring

furnace insulation

Oven

chamber

Temp °C

fader

function

Comparison of the heat distribution inside the process chamber