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7 Station extensions User Manual SIPLACE HS-60 7.5 Ceramic substrate centering Software version SR.503.x x 07/2003 US Edition 168 Fig. 7.5 - 1 Structure of the ceramic substrate centering unit (1) Mechanic al cer amic su…
User Manual SIPLACE HS-60 7 Station extensions
Software version SR.503.xx 07/2003 US Edition 7.5 Ceramic substrate centering
167
7.5 Ceramic substrate centering
7.5.1 General
The ceramic substrate can be centered either mechanically or optically.
The position of the fiducials on the ceramic substrates can be detected either with
– the sub-gantry PCB camera with normal lighting that is fitted as standard, or
– using the multi-color PCB camera (option).
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7.5.2 Mechanical centering
7.5.2.1 General
Mechanical substrate centering is used to lock ceramic substrates firmly in position in the X and
Y directions in such a way that the material is not damaged. Ceramic substrates can be placed
right up to the edge.
7.5.2.2 Assembling and dismantling the ceramic substrate centering unit
PLEASE NOTE
The ceramic substrate centering unit must only be assembled and dismantled by service engi-
neers. 7
7 Station extensions User Manual SIPLACE HS-60
7.5 Ceramic substrate centering Software version SR.503.xx 07/2003 US Edition
168
Fig. 7.5 - 1 Structure of the ceramic substrate centering unit
(1) Mechanical ceramic substrate centering
(2) Centering slide
(3) Ball bearing
(4) Stop
(5) Compressed air connection
(6) Proximity switch connecting cable
(7) Lifting table
7.5.2.3 Maintenance
– Make sure to clean and grease the ball bearings in the X axis centering unit.
– If necessary, check that the pneumatic driving mechanism is running smoothly.
– The conveyor should be maintained as described in the maintenance instructions.
User Manual SIPLACE HS-60 7 Station extensions
Software version SR.503.xx 07/2003 US Edition 7.5 Ceramic substrate centering
169
7.5.3 Technical data
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7.5.4 Fiducial shape recommendation for ceramic substrates
The contrast between the carrier package material and the circuit-board conductor layer is gener-
ally very small with ceramic substrates. The fiducials must therefore be selected with regard to
certain criteria concerning the fiducial shape and structure. Recommended fiducial shapes and
structures are given below.
7.5.4.1 Fiducial shape
We recommend a rectangle or square with an edge length of > 1 mm, and a clearance of
> 0.5 mm.
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Fig. 7.5 - 2 Recommended fiducial shape
Substrate format 50 mm x 50 mm to 100 mm x 180 mm
Substrate thickness 0.5 mm to 1.5 mm
Substrate model Unscribed (without problems)
Scribed (requires testing)
Support on the conveyor 2.5 mm
Optical centering with the PCB vision module:
Type of illumination for light pastes:
Type of illumination for dark pastes and close
spacing to adjacent structures (> 1 mm):
PCB vision module (standard)
Multicolor camera (optional)
4 illumination levels to be selected
Fiducial criteria See PCB vision module position detection
PCB underside clearance 12 mm
Compressed air connection 0.55 MPa (5.5 bar)
0.5 mm
1.0 mm
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PLEASE NOTE
Single crosses are also suitable, but
they take up more space. 7