Specification_SIPLACE_F5_eng.pdf - 第12页

11 Description Thanks to reduced non-productive times the dual PCB co nveyor can substantially i ncrease the through- put, depending on the progr am. It makes i t possible to transport two PCBs through the pl acer simult…

Description

On SIPLACE F

the in-line con-

veyor system guarantees a quick

adjustment to new PCB widths.

The change is made either at the

station via menu function or from

the line computer via the auto-

matic width adjustment unit. Ce-

ramic substrates are also trans-

ported and, if necessary, fastened

in place via the optional ceramic

substrate centering unit.

As standard, the SIPLACE place-

ment systems are available with a

single conveyor system.

PCB Conveyor:

Single Conveyor

Technical Data

PCB dimensions

50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

PCB thickness 0.5 to 4.5 mm

Max. PCB warpage

Top: 4.5 mm - PCB thickness

Bottom: 0.5 mm + PCB thickness

PCB underside clearance

Standard: 25 mm,

Option: max. 40 mm

PCB conveyor height

830 ± 15 mm (Standard)

900 ± 15 mm (Option)

930 ± 15 mm (Option)

950 ± 15 mm (Option) SMEMA

Fixed conveyor edge On right (standard); on left (option)

Type of interface Siemens (standard); SMEMA (option)

Component-free PCB

handling edge 3 mm

PCB changing time 2.5 s

PCB Conveyor

PCB

Transport Direction

Description

Thanks to reduced non-productive

times the dual PCB conveyor can

substantially increase the through-

put, depending on the program. It

makes it possible to transport two

PCBs through the placer simulta-

neously (synchronous) or alter-

nately (asynchronous).

In the synchronous type of trans-

port it is possible, for example, to

finish the top and bottom of the

PCB in a single line without using

cluster technology.

In the asynchronous type of trans-

port a PCB is moved into the

placer in “slack time” while an-

other of the same type is being

populated. The non-productive

time caused by the PCB transport

is therefore completely eliminated.

The increase in placement speed

to be anticipated is between 10

and 30%, depending on the com-

ponents to be placed on the PCB.

The client can switch between

asynchronous and synchronous

dual conveyor with little effort. The

optional ceramic substrate center-

ing is possible, but the PCB bar

code reading process is not.

PCB Conveyor:

Dual Conveyor

Technical Data

PCB dimensions 50 x 50 mm to 460 x 216.5 mm

Fixed conveyor edge Right (standard), left (option)

Placement program per conveyor

Synchronous: same or different

Asynchronous: same

PCB width

per conveyor

Synchronous: same or different

Asynchronous: same

Ink spot recognition

Synchronous: not possible

Asynchronous: same

Automatic width adjustment

Synchronous: not possible

Asynchronous: possible

Asynchronous Dual Conveyor

Asynchronous Synchronous

Description

Due to the increasing use of ce-

ramic substrates in Flip Chip tech-

nology the demands for precise

substrate centering are growing.

The optical and mechanical ce-

ramic substrate centering units on

SIPLACE 80 S-20, SIPLACE 80 F

and SIPLACE F

placement sys-

tems satisfy these demands.

Like the PCB vision module, opti-

cal centering is conducted with the

aid of reference marks (fiducials).

Depending on the contrast ratio

the machine activates the standard

lighting or the oblique lighting con-

tained in the option:

On ceramic and CM blue light

(Item No 116172).

On flexible PCBs using vision

module without IF-filter infrared

light (Item No 116173).

In certain cases, mechanical cen-

tering is required, e.g., when

placement is to continue to the

substrate edge, when handling of

the edges of the substrate is to be

particularly gentle, or when sub-

strates are scribed. In this gentle,

bounce-free procedure, the sub-

strate is fixed in place in the Y-

direction between a stop rail and a

rocking lever pneumatically cen-

tered in the X-direction.

PCB Conveyor:

Ceramic Substrate Centering (Option)

Technical Data

Substrate dimensions 2" x 2" to 4" x 7"

Substrate thickness 0.5 to 1.5 mm

Substrate model

Unscribed (no difficulty)

Scribed (after test)

Contact in conveyor 2.5 mm

Optical centering:

Field of view of the PCB

vision module

Type of lighting

with light-colored pastes

with dark pastes and short dis-

tance to neighboring struc-

tures (>1 mm)

5.7 x 5.7 mm

PCB vision module (standard)

Oblique lighting (option)

Fiducal mark criteria

See PCB vision module position recog-

nition

Mechanical centering

X-/Y-centering accuracy

± 0.07 mm / 4 σ

PCB underside clearance 12 mm

Compressed air connection 5.5 bar

Optical Centering via Mechanical Centering

PCB Camera

Movable

Transport Side

Y-Fixation

Fixed

Transport

Side

Fixed

Transport

Side

Stopper

Ceramic Substrate

Movable

Transport Side

X-Center-

ing