Specification_SIPLACE_F5_eng.pdf - 第28页

27 Technical Data Component spectrum Flip Chips, Bare D ies, Standard SMDs Component dimensions: maximu m 13 x 13 mm minimum 0.5 x 0.25 mm Min. Bump d iameter 110 µm Min. Bump p itch 200 µm Field of vie w 15.6 mm x 15.6 …

Description

The standard component vision

module is integrated directly into

the revolver head and images the

component in question. While the

component is cycling onward into

the next station of the revolver

head, the recorded image is being

evaluated by the central vision sys-

tem. The component is then cor-

rected by the appropriate angle in

this station on the basis of the po-

sition offsets determined.

Vision Sensor Technology:

Component Vision Module for the 6-Nozzle Revolver Head

Technical Data

Maximum component size 32 x 32 mm

Recognizable spectrum

of components

0603 to QFP 208 including BGA,

TSOP, QFP, PLCC, SO, SOJ, DRAM

Lead pitch

≥ 0.5 mm

Camera’s field of view 39 x 39 mm

Illumination

Front light

(2 freely programmable planes)

Technical Data

Component spectrum Flip Chips, Bare Dies, Standard SMDs

Component dimensions:

maximum 13 x 13 mm

minimum 0.5 x 0.25 mm

Min. Bump diameter 110 µm

Min. Bump pitch 200 µm

Field of view 15.6 mm x 15.6 mm

Illumination

Front light

(4 freely programmable planes)

Description

The DCA vision module was de-

veloped specifically for secure,

fast and reliable recognition of Flip

Chips and Bare Dies. But also

standard SMDs can be recognized

without problems.

The DCA vision module is inte-

grated into the DCA package

which is one of the options avail-

able for SIPLACE F

. This option

offers the possibility to process on

at one machine both SMDs, Flip

Chips and also Bare Dies without

problems and therefore to achieve

a maximum of flexibility.

Precondition for using this vision

module is the central vision sys-

tem MVS 340 which has improved

strongly to enable a faster compo-

nent recognition time. It is stan-

dard in the SIPLACE F

Vision Sensor Technology:

DCA-Vision Module for the 6-Nozzle Revolver Head (Option)

Description

The component vision module in-

tegrated into the placement head

performs a critical contribution to

placement accuracy and reliability.

It dependably recognizes all pack-

age forms (= geometric dimen-

sions of the component) illumi-

nated at various angles from a

number of planes (two with the

standard vision module and four

with the DCA vision module). To

illuminate each component opti-

mally, the luminosity of the indi-

vidual planes can be adjusted indi-

vidually in 256 levels.

Aside from the dimension of the

SMD component, the vision sys-

tem determines the lead number

and pitch (lateral IC lead bend) as

well as the rotation angle and X-/Y-

offset. Components which are not

suitable are rejected and automati-

cally corrected in a repair cycle.

Rotational and X-/Y-offsets are cor-

rected at the turning station of the

revolver head or via the gantry

axes. A relevant X-/Y-pick-up offset

is calculated from the positions of

a number of components from one

track. This is factored in accor-

dance with the self-learning princi-

ple during the subsequent pick-up

of components.

Prior to placement the required

geometrical dimensions of one

component type are entered into

the package form (GF) editor, cre-

ating a synthetic model of the

SMD module. This task is simpli-

fied by the comprehensive on-line

information and Help system.

Later the central SIPLACE vision

system, to which all other vision

modules are connected, analyzes

the gray-scale picture of the com-

ponent vision module. To this end,

suitable algorithms are used for

the pertinent package type. Due to

the combination of algorithms, the

vision system also functions relia-

bly under the most difficult condi-

tions, e.g., in the case of different

reflection behavior by the leads or

disruptive influences from the out-

side.

Vision Sensor Technology:

Algorithms to determine the X-/Y-Position and the

Rotation Angle

Algorithm Component Determined on the basis of

Size Driven Chip

the component’s out line

(profile/gradients)

Row Driven IC

several component leads

(correlation method)

Corner Driven IC

all component leads

(correlation method)

Lead Driven Complex IC

each component connection

(High-Accuracy-Lead-Extraction method)

Grid/Ball/Bump

BGA, µBGA,

Flip Chip

all defined balls and bumps

(gradients/ball or bump centering)