Specification_SIPLACE_F5_eng.pdf - 第27页

26 Description The standard component v ision module is integrated dir ectly into the revolver head and im ages the component in question. Wh ile the component is cycling o nward into the next station of the revolver hea…

Description

In the cluster technology each

subpanel is assigned an ink spot.

If this is present during the meas-

urement via the PCB vision mod-

ule, the corresponding subpanel is

not populated. Naturally it is also

possible to prevent the population

of the subpanel when the ink spot

is missing.

With this function it is possible to

prevent costs arising due to un-

necessary population of faulty

subpanels.

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eed

The pick-up position of the com-

ponent can be determined pre-

cisely with the aid of the position

recognition of the feeder. It is acti-

vated each time after a change of

feeder or component table. The

offset in position relative to the

stored ideal position is determined

on the basis of fiducials on the

feeder modules using the PCB vi-

sion module. This provides a very

high pick-up reliability even for the

very first component. This is par-

ticularly important with small com-

ponents.

Vision Sensor Technology:

Recognition of Faulty PCBs via Ink Spots

Position Recognition of Feeder

Ink Spot Criteria

Fiducial shapes

Single cross (recommended because

susceptibility to disruption lowest)

rectangle, square, circle, etc.

Masking material

Mat dark (light-absorbing)

Not recommended: white or shiny

Size or fiducial masking

Circular: Diameter ≥ 8.1 mm

Square: Edge length ≥ 5.7 mm

Fiducial recognition time

(travel > 100 mm)

Mark masked: 1.2 s

Mark not masked: 0.4 s

Description

The standard component vision

module is integrated directly into

the revolver head and images the

component in question. While the

component is cycling onward into

the next station of the revolver

head, the recorded image is being

evaluated by the central vision sys-

tem. The component is then cor-

rected by the appropriate angle in

this station on the basis of the po-

sition offsets determined.

Vision Sensor Technology:

Component Vision Module for the 6-Nozzle Revolver Head

Technical Data

Maximum component size 32 x 32 mm

Recognizable spectrum

of components

0603 to QFP 208 including BGA,

TSOP, QFP, PLCC, SO, SOJ, DRAM

Lead pitch

≥ 0.5 mm

Camera’s field of view 39 x 39 mm

Illumination

Front light

(2 freely programmable planes)

Technical Data

Component spectrum Flip Chips, Bare Dies, Standard SMDs

Component dimensions:

maximum 13 x 13 mm

minimum 0.5 x 0.25 mm

Min. Bump diameter 110 µm

Min. Bump pitch 200 µm

Field of view 15.6 mm x 15.6 mm

Illumination

Front light

(4 freely programmable planes)

Description

The DCA vision module was de-

veloped specifically for secure,

fast and reliable recognition of Flip

Chips and Bare Dies. But also

standard SMDs can be recognized

without problems.

The DCA vision module is inte-

grated into the DCA package

which is one of the options avail-

able for SIPLACE F

. This option

offers the possibility to process on

at one machine both SMDs, Flip

Chips and also Bare Dies without

problems and therefore to achieve

a maximum of flexibility.

Precondition for using this vision

module is the central vision sys-

tem MVS 340 which has improved

strongly to enable a faster compo-

nent recognition time. It is stan-

dard in the SIPLACE F

Vision Sensor Technology:

DCA-Vision Module for the 6-Nozzle Revolver Head (Option)