Specification_SIPLACE_F5_eng.pdf - 第2页

1 Subject to change without notice Edition 3 1199-F 5 -300-e Machine Description 3 Line Design 4 Placement Heads 5 6-Nozzle Revolver H ead for High-Speed IC Placement Pick & Pl ace Head for H igh End / High A ccuracy…

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Edition 3
1199-F
5
-300-e
High Speed Placement of Large
ICs, Flip Chips and Bare Dies
SIPLACE F
5
S
SS
SI
II
IP
PP
PL
LL
LA
AA
AC
CC
CE
EE
E
S
SS
Sp
pp
pe
ee
ec
cc
ci
ii
if
ff
fi
ii
ic
cc
ca
aa
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1
Subject to change
without notice
Edition 3
1199-F
5
-300-e
Machine Description 3
Line Design 4
Placement Heads 5
6-Nozzle Revolver Head for High-Speed IC Placement
Pick & Place Head for High End / High Accuracy IC Placement
Nozzle Changer
Flux Dispenser for Full Flip Chip Capability (Option)
PCB Conveyor 10
Single Conveyor
Dual Conveyor
Ceramic Substrate Centering (Option)
PCB Bar Code for Production-Controlled Manufacturing (Option)
Component Supply 14
Changeover Table
Tape Feeder
Bulk Case Feeders, Stick Magazine Feeders
Dummy Feeder
Manual Trays
Surf Tape Feeder for Bare Dies
Waffle Pack Changer (Option)
Component Bar Code Scanner for Set-Up and Refill Check (Option)
SIPLACE External Set-Up Station (Option)
Vision Sensor Technology 23
PCB Vision Module
PCB Position Recognition
Recognition of Faulty PCBs via Ink Spots
Position Recognition of Feeder
Component Vision Module for the 6-Nozzle Revolver Head
DCA-Vision Module for the 6-Nozzle Revolver Head (Option)
Algorithms to determine the X-/Y-Position and the Rotation Angle
Fine Pitch Component Vision Module for the Pick & Place Head
Flip Chip Component Vision Module for the Pick & Place Head (Option)
Coplanarity Module for the Pick & Place Head (Option)
Machine Criteria 32
Placement Accuracy
Placement Reliability and Placement Speed
Mapping (Option)
SIPLACE Software Architecture 35
System Architecture
Line Computer / Station Computer
Creation of Placement Programs
Machine Data Management System
Data Interface SECS II / GEM (Option)
Remote Support (Option)
Diagnostic Tools (Option)
High Speed Placement of Large ICs, Flip Chips and Bare Dies
SIPLACE F
5
2
SIPLACE F
5
with Waffle Pack Changer
Technical Data 42
Signal Interfaces
Connections
Dimensions and Set-Up Conditions
Component Forms 46
Nozzle Types: 51
Standard Range of Nozzle Types for 6-Nozzle Revolver Head
Standard Range of Nozzle Types for Pick & Place Head
Possible Machine Configuration 56
High Speed Placement of Large ICs, Flip Chips and Bare Dies
SIPLACE F
5