X-S Speicification.pdf - 第14页
14 Placement Heads Overview Head modularity The SIPLACE placement machines are dis tinguished by maximum flexibility in the production pr ocess. This flexibility is in part due to the head modu larity of the plac e- ment…
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Machine Performance
Placement head types SIPLACE SpeedStar (C&P20)
SIPLACE MultiStar (CPP)
SIPLACE TwinStar (TH)
SIPLACE X4 S
See the note for definition of placement performance values on page 12.
Placement area 1 Placement area 2 IPC value Benchmark
value
Theoretical
value
X4 S-A C&P20 / C&P20 C&P20 / C&P20 85,000 100,000 112,500
C&P20 / C&P20 CPP_L / CPP_L 79,475 93,500 105,188
C&P20 / C&P20 CPP_H / CPP_H 75,650 89,000 100,125
CPP_L / CPP_L CPP_L / CPP_L 74,800 88,000 99,000
CPP_L / CPP_L CPP_H / CPP_H 70,550 83,000 93,375
CPP_H / CPP_H CPP_H / CPP_H 66,300 78,000 87,750
X4 S-B C&P20 / C&P20 CPP_H / TH 62,900 74,000 82,250
CPP_L / CPP_L CPP_H / TH 57,800 68,000 76,500
CPP_H / CPP_H CPP_H / TH 53,550 63,000 70,875
X4 S-C C&P20 / C&P20 TH / TH 50,150 59,000 66,375
CPP_L / CPP_L TH / TH 45,050 53,000 59,625
CPP_H / CPP_H TH / TH 40,800 48,000 54,000
X4 S-D CPP_H / TH TH / TH 28,050 33,000 37,125
X4 S-E TH / TH TH / TH 15,300 18,000 20,250
SIPLACE X4i S
See the note for definition of placement performance values on page 12.
Machine Placement area 1 Placement area 2 IPC value Benchmark
value
Theoretical
value
X4i S-A C&P20 / C&P20 C&P20 / C&P20 102,000 120,000 135,500
C&P20 / C&P20 CPP_L / CPP_L 91,500 103,500 123,750
C&P20 / C&P20 CPP_H / CPP_H 85,000 100,000 112,500
CPP_L / CPP_L CPP_L / CPP_L 79,900 94,000 112,000
CPP_L / CPP_L CPP_H / CPP_H 73,950 87,000 97,800
CPP_H / CPP_H CPP_H / CPP_H 68,000 80,000 90,000
X4i S-B C&P20 / C&P20 CPP_H / TH 72,250 85,000 96,600
CPP_L / CPP_L CPP_H / TH 58,150 68,400 77,500
CPP_H / CPP_H CPP_H / TH 52,190 61,400 69,075
X4i S-C C&P20 / C&P20 TH / TH 60,350 71,000 80,700
CPP_L / CPP_L TH / TH 49,300 58,000 65,900
CPP_H / CPP_H TH / TH 43,350 51,000 57,300
CPP_H = Multistar CPP in high assembly position
CPP_L = Multistar CPP in low assembly position
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Placement Heads
Overview
Head modularity
The SIPLACE placement
machines are distinguished
by maximum flexibility in the
production process. This
flexibility is in part due to the
head modularity of the place-
ment machines, which allows
different placement head
variants to be configured to
suit the production require-
ments.
Collect&Place principle
The SIPLACE SpeedStar
operates according to the
Collect&Place principle i.e.
one cycle includes pickup or
"collection" of 20 compo-
nents, their optical centering
on the board and their rota-
tion into the required place-
ment angle and position.
They are then placed gently
and accurately onto the PCB.
This principle is particularly
suitable for high-speed
placement of standard
components.
Pick&Place principle
The high precision SIPLACE
TwinStar, which consists of
two Pick& Place modules of
identical design, coupled to
one another, functions
according to the Pick&Place
principle. Two components
are picked up by the place-
ment head, optically cen-
tered on the way to the
placement position and
rotated into the necessary
placement angle. This princi-
ple is ideally suitable for fast
and precise placement of
special components in the
fine pitch or super fine pitch
field, plus complex and
heavy components which
may need grippers.
Mixed mode
The new SIPLACE MultiStar
uses both the Collect&Place
and the Pick&Place princi-
ple.
Mixed Mode allows com-
bined use of these two
modes, which were previ-
ously separated from one
another, in one placement
cycle.
Control and self-learning
functions
The reliability of the
SIPLACE placement heads
can be enhanced even fur-
ther with various checking
and self-learning functions.
• Component sensor
Checks the presence of
the components on the
nozzle before the pickup
and placement process
• Digital camera
Checks the position of
each component on the
nozzle. This check is per-
formed in a single step,
with no extra time involved
but with optimum scan-
ning of each individual
component.
• Force sensor
Monitors the prescribed
component set-down
force.
The sensor stop proce-
dure enables compensa-
tion of height differences
during pickup and PCB
warpage during place-
ment.
15
Placement Heads
Standard Functions / Options
SIPLACE SpeedStar (C&P20) SIPLACE MultiStar (CPP)
Standard-
functions
High-resolution camera, vacuum
sensor, force measurement,
component sensor, integrated
turning station per segment,
PCB warpage check, individual
image of each component
Standard-
functions
High-resolution camera, vac-
uum sensor, force measure-
ment, component sensor,
integrated turning station per
segment, PCB warpage check,
individual image of each com-
ponent
Options Nozzle changer, special nozzles Options Nozzle changer, special noz-
zles, stationary fine-pitch cam-
era
SIPLACE TwinStar (TH)
Standard-
functions
Stationary fine pitch camera,
vacuum sensor, force measure-
ment, nozzle changer, PCB war-
page check, individual image of
each component
Options Stationary flip chip camera, spe-
cial nozzles, grippers