00197295-01_UM_D4i_SR605_EN.pdf - 第86页

2 Operational safety User manual SIPLACE D4i 2.11 ESD guidelines From software version SR.605.03 SP2 10/2012 EN edition 86 Always place the modules on a conductive surfac e ( table with an ESD coating, conductive ESD foa…

User manual SIPLACE D4i 2 Operational safety

From software version SR.605.03 SP2 10/2012 EN edition 2.11 ESD guidelines

2.11 ESD guidelines

2.11.1 What does ESD mean?

Almost all of the modules in use today are equipped with highly integrated MOS blocks and com-

ponents. The manufacturing techniques used mean that these electronic components are ex-

tremely sensitive to overvoltage and thus to electrostatic discharge.

The abbreviation for such modules is 'ESD' (Electrostatic Sensitive Device). ’ESD’ is used inter-

nationally. The following symbol on cabinet rating plates, racks or packaging indicates that com-

ponents which are sensitive to electrostatic discharge have been used and thus that the modules

concerned are also touch-sensitive.

ESDs can be destroyed by voltages and power levels that are far below the level

that can be perceived by humans. Such voltages occur if a person touches a com-

ponent or module without earthing themselves. Components that are exposed to

such overvoltages do not generally appear to be defective immediately - incorrect

behavior starts after the component or module has been in operation for some time.

2.11.2 Important measures to protect against static charging

→ Most plastics can easily become charged and must therefore be kept away from at-risk com-

ponents.

→ Always ensure that people, the workplace and packaging are safely earthed when handling

electrostatic sensitive components.

2.11.3 Handling ESD modules

Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other

work. If it is necessary, make sure that you do not touch the pins or printed conductors when you

pick up flat modules.

Do not touch components unless

→ you are constantly earthed by an ESD wrist strap or

→ you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.

Always discharge yourself before you touch an electronic module. To do this, simply touch a con-

ductive and earthed object immediately before you touch the module (such as unpainted parts of

a switch cabinet, a water pipe, etc.).

Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.

plastic films, insulating table surfaces or items of clothing made from synthetic fibers.

2 Operational safety User manual SIPLACE D4i

2.11 ESD guidelines From software version SR.605.03 SP2 10/2012 EN edition

Always place the modules on a conductive surface (table with an ESD coating, conductive ESD

foam, ESD bag or container).

Do not bring modules near visual display units, monitors or televisions. Keep them at least 10 cm

away from the screen.

2.11.4 Measurements and modifications to ESD modules

Do not take measurements on the modules unless the following conditions are fulfilled:

– the measuring device is earthed (e.g. via PE conductors) or

– you discharge the measuring head just before taking measurements with a potential-free

measuring device (e.g. by touching an unpainted metal part of the controller casing).

→ Always use an earthed soldering iron if you carry out any soldering work.

2.11.5 Dispatching ESD modules

→ Always store modules and components in conductive packaging (e.g. metallized plastic bags

or metal sleeves) and dispatch them in conductive packaging.

If the packaging is not conductive, place the modules in a conductive envelope before pack-

aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-

ample. NEVER use plastic bags or film. 2

→ If the module has integral batteries, ensure that the conductive packaging does not touch or

short-circuit the battery terminals and, if necessary, first cover the terminals with insulating

tape or material.

User manual SIPLACE D4i 3 Technical data for the machine

From software version SR.605.03 SP2 10/2012 EN edition 3.1 Performance data

3 Technical data for the machine

3.1 Performance data

Types of placement

head

12-nozzle Collect&Place head (C&P12)

PLEASE NOTE IPC value [comp./h]

According to the vendor-neutral conditions of the IPC 9850 standard

published by the Association of Connecting Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine

acceptance tests. It corresponds to the conditions set out in the

SIPLACE scope of service and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most

favorable conditions for each machine type and setting, and corre-

sponds to the theoretical conditions normally used in the industry.

Number of gantries

IPC value Benchmark value Theoretical value

Placement head con-

figuration and place-

ment head rate

[comp./h]

4 x C&P12 57,000 66,000 81,500

Range of components 0.4 x 0.2 mm² (01005)

; 0.6 x 0.3 mm (0201)

to 18.7 x 18.7 mm²

Component height 6 mm

Placement accuracy CO camera type 28 (18x18): ± 50 m (3), ± 67 m (4)

CO camera type 30 (27x27): ± 50 m (3), ± 67 m (4)

Angular accuracy CO camera type 28 (18x18): ± 0.53° (3), ± 0.71° (4)

CO camera type 30 (27x27): ± 0.53° (3), ± 0.71° (4)

Component feeding 4 component trolleys with tape reel container and integral waste

container (12 x 30 mm wide locations per component trolley )

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM feeder

modules, surftape feeder modules (8, 12, 16 mm)