M3plus_OperationManual_e.pdf - 第94页

3 - 29 4. Creating the component information 3 Creating the PCB data 4.3 Pick parameters Pick parameter s 27414-5E-20 A: Feeder Set No. Enter the feeder set number of the position on the feeder plate (feeder knockpin pos…

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Creating the PCB data

4. Creating the component information

G: Dump Way

This specifies the location where a component will be dumped if an error such as recognition error

has occurred. Set to "Dump POS" for chip components and small components.

H: Retry Times

This determines how many times the machine will retry the same operation if an error such as a

recognition error has occurred. The number of retries can be set from "NO RETRY" to "14". When

this retry setting is greater than the machine data retry setting, the machine data has priority.

I: Conveyor X Speed

The conveyor X-axis moving speed can be selected. If components tend to move or slide (such as

tall components) just after mounted on the PCB due to the X-axis movement, set this parameter to

a lower speed to prevent it. Select the optimum speed from among "FAST", "MEDIUM", "SLOW"

and "VERY SLOW".

J: Database number

Shows the database number when the parameter values were copied from the database.

When you want to copy the parameter values from the database, press the [Database] button to

open the database list. Then select the copy source data and press the [Set] button to make a copy.

Press this button.

Database set

27413-5E-20

K: Library Name

The name of the component data library is displayed. This data library can be managed in the

machine or on a PC connected to LAN. (When using the data library, see "3. Creating XML

library" in chapter 6.)

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4. Creating the component information

Creating the PCB data

4.3 Pick parameters

Pick parameters

27414-5E-20

A: Feeder Set No.

Enter the feeder set number of the position on the feeder plate (feeder knockpin position) at which

the feeder is installed. This parameter setting is unnecessary when the "Use feeder optimize"

parameter is set to "Yes". When using a tray shuttle feeder (TSF1), refer to section 4.10, "Using

component feeders other than tape feeders".

B: Position Definition

Set to "Automatic" when the Package parameter is set to "Tape" or "Bulk". (The component pickup

position will be calculated automatically.) Set to "Teaching" when using a stick feeder or tray

shuttle feeder (TSF1). (See "4.10 Using component feeders other than tape feeders" in this chap-

ter.)

D: Y (mm)

Enter the position at which the head picks up the component from the feeder. These parameters are

skipped when the Position Definition parameter is set "Automatic".

When stick feeders or tray shuttle feeder (TSF1) are used, enter the pickup position by teaching.

(See "4.10 Using component feeders other than tape feeders" in this chapter.)

E: Pick Angle (deg)

• This parameter specifies the angle through which the mounter head rotates to pick up a component

on the feeder. This setting determines the orientation of the component (recognition reference)

when it is recognized and displayed on the operation monitor. Normally, set this parameter to 0

deg for horizontally long components in the loading position on the feeder, and set to 90 deg for

vertically long components.

•When using a bulk cassette feeder, always set this parameter to 90°.

• The pickup angle for transistors must be specified so that their leads face the NS directions. Set

this parameter to 0 deg for vertically long components in the loading position on the feeder, and set

to 90 deg for horizontally long components. Select the correct pickup angle by referring to the

table below.

• The pickup angle for SOP components must be specified so that their leads face the EW directions.

Set this parameter to 0 deg for horizontally long components in the loading position, and set to 90

deg for vertically long components. Select the correct pickup angle by referring to the table below.

• The pickup angle of connectors must be specified so that their leads face the E direction. Select the

correct pickup angle according to the loading position of the component as shown in the table

below.

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Creating the PCB data

4. Creating the component information

Loading position

Pickup angle

Loading position

Pickup angle

Loading position

Pickup angle

Loading position

Pickup angle

Recognition

reference

Loading position

Pickup angle

Recognition

reference

Loading position

Pickup angle

Chip Melf

SOP

Mini-mold transistor

Connector E

QFP

0° 90° 0° 90°

0° 90°

0° 90° 0° 90°

0° 190° 90° -90°

0° 90°

Pick Angle (deg)

25405-5E-20

F: Pick Height (mm)

This is the Z-axis height offset value used when the head lowers to pick a component. Set this

parameter to "0.0" in normal operation.

If you want to lower the Z-axis height during component pickup, enter a plus value in the Pick

Height column. Conversely, if you want to raise the Z-axis height, enter a minus value.

This parameter setting is disabled when using a fixed tray feeder (TSF1).

G: Pick Timer

This parameter specifies the time duration (in seconds) for which the head stays in the lowered

position after detecting the reference pickup vacuum pressure when picking up a component. For

small components such as chip components, it is okay to set this parameter to "0.00".

H: Pick Speed (%)

This is the Z-axis speed when the head moves down to pick up a component. Set this parameter to

100 (%) in most cases. If you want to reduce the speed, enter a smaller value.

I: XY Speed (%)

This is the speed at which the head moves in the XY directions to pick up and mount a component.

Set this parameter to 100 (%) in most cases. If you want to reduce the speed, enter a smaller value.