IPC-7526-2007 模板和误印板清洗指南.pdf - 第25页
ｗｗｗ．ｂｚｆｘｗ．ｃｏｍ ANSI/IPC-T -50 T erms and Definitions for Interconnecting and Packaging Electronic Circuits Definition Submission/Approval Sheet The purpose of this form is to keep current with terms routinely used in the in…
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Paste Flux: A flux formulated in the form of a paste for
joining area array components.
Pitch: Center-to-Center distance between two adjacent
conductors or lands.
Polyglycol: Any of several condensation polymers of eth-
ylene glycol.
Residue: Any visual or measurable form of process-
related contamination.
Rework: The act of reprocessing noncomplying articles,
through the use of original or alternate equivalent process-
ing, in a manner that assures compliance of the article with
applicable drawings or specifications.
Saponifier: An alkaline chemical designed to react with
organic fatty acids, such as rosin to form a water-soluble
soap.
Screen-Printing: The transferring of an image to a surface
by forcing a suitable media through an imaged-screen
mesh.
Screen and Stencil Cleaning: The process of removing
unused solder paste/flux from application tools to maintain
them in an acceptable condition for reuse.
Semiaqueous Cleaning: Organic solvent blends are used
for washing or dissolving the contaminant followed by
water rinsing.
Solderability: The ability of a metal to be wetted by mol-
ten solder, a function of the termination finish at the time
of soldering. Total soldering ability is a function of match-
ing the design, process, components and substrate to facili-
tate the formation of a robust solder joint.
Solder Ball: A small sphere of solder adhering to a lami-
nate, resist, or conductor surface.
Solder Paste: Finely divided particles of solder, with addi-
tives to promote wetting and to control viscosity, tackiness,
slumping, drying rate, etc, that are suspended in a cream
flux.
Solder Paste Considerations: Solder paste properties
such as particle size and shape, flux type, viscosity and
slump characteristics have a major impact on the printing
process. Excessive solder paste can result in solder balls or
bridging.
Solder Printing: The deposition of solder paste by repro-
ducing a pattern on the printed circuit board.
Solvent Cleaning: The removal of organic and inorganic
soils using a blend of polar and nonpolar organic solvents.
Squeegee: Both polyurethane and metal squeegees are
used to force solder paste through the apertures of a sten-
cil and onto the circuit board.
Squeegee Side/Board Side: Refers to the two sides of the
stencil when mounted in the frame. The squeegee side is
the side on which the squeegee travels to print the pattern;
the board side comes in contact with the substrate to trans-
fer the solder paste.
Stencil Border: Consists of a polyester fabric stretched on
the frame to hold the metal stencil and to permit uniform
contact with the board under squeegee pressure for a con-
trolled snap-off.
Stencil Frame: Typically made of aluminum, which is
cast or extruded. The cleaning agent must be compatible
with the alloy of construction.
Surfactant: An aqueous organic or inorganic wetting
agent designed to wet the surface of the product and dis-
place the contaminant.
Ultrasonic Cleaning: Immersion cleaning that is done by
passing high-frequency solund waves through a cleaning
medium to casue cavitation (microagitation).
IPC-7526 February 2007
18
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ANSI/IPC-T-50 Terms and Definitions for
Interconnecting and Packaging Electronic Circuits
Definition Submission/Approval Sheet
The purpose of this form is to keep
current with terms routinely used in
the industry and their definitions.
Individuals or companies are
invited to comment. Please
complete this form and return to:
IPC
3000 Lakeside Drive, Suite 309S
Bannockburn, IL 60015-1249
Fax: 847 615.7105
SUBMITTOR INFORMATION:
Name:
Company:
City:
State/Zip:
Telephone:
Date:
❑ This is a NEW term and definition being submitted.
❑ This is an ADDITION to an existing term and definition(s).
❑ This is a CHANGE to an existing definition.
Term Definition
If space not adequate, use reverse side or attach additional sheet(s).
Artwork: ❑ Not Applicable ❑ Required ❑ To be supplied
❑ Included: Electronic File Name:
Document(s) to which this term applies:
Committees affected by this term:
Office Use
IPC Office Committee 2-30
Date Received:
Comments Collated:
Returned for Action:
Revision Inclusion:
Date of Initial Review:
Comment Resolution:
Committee Action: ❑ Accepted ❑ Rejected
❑ Accept Modify
IEC Classification
Classification Code • Serial Number
Terms and Definition Committee Final Approval Authorization:
Committee 2-30 has approved the above term for release in the next revision.
Name:
Committee: Date:
IPC 2-30
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES
®
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