Ch3_CEditor_Job_2.0_RenewalVersion_CHN.pdf - 第3页

3 K oh Y oung Technolog y Inc. Measure to Optimi ze: A Comp lete 3D Inspection So luti on 目录 1. CEditor™ 简介 ............................................................................... 6 2. CEditor™ 功能 ...............…

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Koh Young Technology Inc.
Measure to Optimize: A Complete 3D Inspection Solution
修订历史记
日期
修订
备注
28. Nov. 2008
1.0
Created
30. Aug. 2010
2.0
CEditor Ver. 1.1.343
11. Mar. 2014
3.0
CEditor Ver. 1.1.430 (Job Ver. 2.0)
24. Apr. 2015
3.1
CEditor Ver. 1.1.439 (Job Ver. 2.0)
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Koh Young Technology Inc.
Measure to Optimize: A Complete 3D Inspection Solution
目录
1. CEditor™ 简介 ............................................................................... 6
2. CEditor™ 功能 ............................................................................... 7
2.1. 菜单栏 .....................................................................................................................8
2.1.1. “File”(文件) ....................................................................................................... 8
2.1.2. “Tools”(工具) .................................................................................................. 10
2.1.2.1. 转换 Job 文件版本 ........................................................................................... 12
2.1.2.2. “Merge Pad”(合并焊盘) .............................................................................. 13
2.1.2.3. Manual Pin Assign(手动分配引脚) ..................................................... 16
2.1.2.4. “Library Editor(编辑库) .......................................................................... 17
2.1.2.5. “Size Library”(尺寸库) .............................................................................. 18
2.2. 工具 ...................................................................................................................23
2.2.1. 鼠标模式 ................................................................................................................ 23
2.2.2. 条件树 .................................................................................................................... 25
2.3. 工作空间 ...............................................................................................................30
2.3.1. 焊盘信息 ................................................................................................................ 31
2.3.2. 检测条件 ................................................................................................................ 31
2.3.3. ............................................................................................................................ 32
2.3.4. 元件编号 ................................................................................................................ 32
2.4. 状态栏 ...................................................................................................................32
2.5. 主视图 ...................................................................................................................33
2.5.1. 主视图中的弹出菜单 ............................................................................................ 34
2.5.1.1. “Pads”(焊盘) ................................................................................................... 34
2.5.1.2. 公差设置 ............................................................................................................ 35
2.5.1.3. 焊盘编辑 ............................................................................................................ 36
2.5.1.4. 检测条件 ............................................................................................................ 37
2.5.1.5. 扩展 ROI ........................................................................................................... 44
3. CEditor™ 实例 ............................................................................. 45
3.1. 基本步骤 ...............................................................................................................46
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Koh Young Technology Inc.
Measure to Optimize: A Complete 3D Inspection Solution
3.1.1. 载入 Pad 文件 ..................................................................................................... 47
3.1.2. 基准点设置 ............................................................................................................ 50
3.1.3. 更改焊盘检测条件 ................................................................................................ 51
3.1.4. 保存 Job 文件 ...................................................................................................... 52
3.2. 编译(增加)CAD 文件 .....................................................................................53
3.2.1. 载入 CAD Pin CAD 文件 ........................................................................... 54
3.2.2. 质心 ........................................................................................................................ 58
3.2.3. PCB 抄板(阵列板) .......................................................................................... 59
3.2.4. 保存 Job 文件 ...................................................................................................... 62
4. CEditor™ 高级功能 ...................................................................... 63
4.1. 检测条件 ...............................................................................................................63
4.1.1. “Volume”(体积) .............................................................................................. 64
4.1.2. “Position”(位置 ............................................................................................. 65
4.1.3. “Bridge”(连桥) ................................................................................................ 65
4.1.3.1. 4 向连桥检测..................................................................................................... 66
4.1.4. “Height”(高度)................................................................................................ 68
4.1.5. “Shape”(形状) ................................................................................................. 68
4.1.6. Area”(面积) .................................................................................................... 68
4.1.7. “Coplanarity” 翘起) ..................................................................................... 69
4.1.8. 其他设置 ................................................................................................................ 70
4.1.9. 应用焊盘 ................................................................................................................ 71
4.1.10. 应用改变选项 ........................................................................................................ 71
4.2. 增加/编辑焊盘 ......................................................................................................72
4.2.1. Add Pad”(增加焊盘) ..................................................................................... 72
4.2.2. 编辑焊盘 ................................................................................................................ 74
4.3. 修改元件编号 .......................................................................................................75
4.3.1. 案例 1 .................................................................................................................... 76
4.3.2. 案例 2 .................................................................................................................... 77
4.3.3. 案例 3 .................................................................................................................... 78
4.3.4. 案例 4 .................................................................................................................... 79
4.4. FOV 优化 .............................................................................................................80
5. 术语表 ............................................................................................ 82