操作手册.pdf - 第10页
CM602-L 操作手册 10 4.4 芯片识别示教 ..................................................................................................... 4-16 4.4.1 芯片识别 ...........................................................................…
CM602-L
操作手册
9
2.3
生产开始
...............................................................................................................2-6
2.3.1
本器的启动
..........................................................................................................................................2-6
2.3.2
开始操作
.............................................................................................................................................2-7
2.3.3
自我诊断中
..........................................................................................................................................2-8
2.3.4
原点复归
.............................................................................................................................................2-9
2.4
生产中
................................................................................................................2-12
2.4.1
生产中的信息与功能
.........................................................................................................................2-12
2.5
生产停止
.............................................................................................................2-13
2.5.1
停止操作
...........................................................................................................................................2-13
2.5.2
停止中的信息和功能
.........................................................................................................................2-15
2.5.3
自动运转维护
....................................................................................................................................2-17
2.6
生产结束
.............................................................................................................2-18
2.6.1
自动停止
...........................................................................................................................................2-18
2.6.2
机器的结束
........................................................................................................................................2-18
3. 生产材料的设置............................................... 3-1
3.1
智能供料器的设置
................................................................................................3-2
3.1.1
安装方法
.............................................................................................................................................3-2
3.1.2
取下方法
.............................................................................................................................................3-6
3.2
生产中的部品供给
................................................................................................3-7
3.3
整体交换台车的供料器整体交换
..........................................................................3-8
3.3.1
整体交换台车的拆卸顺序
....................................................................................................................3-8
3.3.2
离线准备
...........................................................................................................................................3-11
3.3.3
整体交换台车的安装顺序
..................................................................................................................3-12
4. 示教................................................................. 4-1
4.1
示教开始前
...........................................................................................................4-2
4.1.1
识别方法
.............................................................................................................................................4-2
4.1.2
照明值调整的设定
...............................................................................................................................4-3
4.1.3
陶瓷基板识别时的注意事项
................................................................................................................4-3
4.2
基板识别示教
.......................................................................................................4-4
4.2.1
基板识别
.............................................................................................................................................4-4
4.2.2
基板识别示教的流程
...........................................................................................................................4-4
4.2.3
示教步骤
.............................................................................................................................................4-5
4.3
不良标记识别示教
................................................................................................4-9
4.3.1
不良标记识别
......................................................................................................................................4-9
4.3.2
不良标记识别示教的流程
....................................................................................................................4-9
4.3.3
示教步骤
...........................................................................................................................................4-10
EJM8A-C-OMC00-A02-01
CM602-L
操作手册
10
4.4
芯片识别示教
..................................................................................................... 4-16
4.4.1
芯片识别
........................................................................................................................................... 4-16
4.4.2
芯片识别示教的流程
........................................................................................................................ 4-16
4.4.3
进行芯片识别示教前
........................................................................................................................ 4-18
4.4.4
示教步骤
(
区块匹配识别
)................................................................................................................. 4-21
4.4.5
示教步骤
(
部品厚度计测
) ................................................................................................................ 4-28
4.4.5
其他的操作
....................................................................................................................................... 4-31
4.5
实装坐标示教
..................................................................................................... 4-32
4.5.1
实装坐标示教
................................................................................................................................... 4-32
4.5.2
编制步骤
........................................................................................................................................... 4-33
4.6
吸着位置学习示教
.............................................................................................. 4-40
4.7
基板弯曲计测示教
(12
吸嘴用、
8
吸嘴用选购件
).............................................. 4-43
4.7.1
基板弯曲计测示教
............................................................................................................................ 4-43
4.7.2
基板弯曲计测示教的流程
................................................................................................................. 4-43
4.7.3
示教步骤
........................................................................................................................................... 4-44
4.8
通过
3D
传感器
(
选购件
)
进行的芯片识别示教
................................................. 4-50
4.8.1
关于
3D
传感器
................................................................................................................................ 4-50
4.8.2
通过
3D
传感器进行的识别示教之流程
............................................................................................ 4-50
4.8.3
通过
3D
传感器进行芯片识别示教前
................................................................................................ 4-52
4.8.4
通过
3D
传感器进行的芯片识别示教步骤
......................................................................................... 4-58
4.8.5 3D
调整示教步骤
............................................................................................................................... 4-61
4.8.6
识别装置维护
................................................................................................................................... 4-63
4.8.7
识别错误画面
................................................................................................................................... 4-64
5. 生产基板的变更............................................... 5-1
5.1
随生产基板变更的装置调整部位
.......................................................................... 5-2
5.2
生产数据的变更
.................................................................................................... 5-3
5.3
搬送导轨宽度的调整
............................................................................................ 5-5
5.4
支撑销的安装
....................................................................................................... 5-8
5.5
吸嘴的交换
......................................................................................................... 5-11
5.5.1
吸嘴配置的确认
................................................................................................................................ 5-11
5.5.2
吸嘴交换
........................................................................................................................................... 5-13
5.6
生产材料的设置及确认
....................................................................................... 5-19
5.7
基板搬送测试
..................................................................................................... 5-20
5.8
根据条件实装确认实装状态
................................................................................ 5-23
5.9
因反面实装变更动作设定
.................................................................................... 5-26
索引
EJM8A-C-OMC00-A02-01
CM602-L
操作手册
11
安全注意事项
请严格遵守
为了防止给使用者或者其他人员造成人身伤害及财产上的损失，防患于未然，请务必遵守以
下的说明。
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”
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”
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可预料仅会引起人身伤害或物质损失的可能性
”
内容
。
请各位遵守的内容种类用以下图案进行区分并加以说明。
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下述为图案的一例
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此类图案表示，希望各位小心的
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禁止
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强制
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EJM8A-C-XXC00-A03-00