00197674-01-UM-E-Series-EN-02-2015.pdf - 第139页
User manual SIPLACE E 3 Technical data and assemblies From software version SC 708.0 12/2014 Edition 3.7 Vision system 139 3.7 Vision system 3.7.1 Structure A co mponent camera is integrat ed at each Collect&Place he…
3 Technical data and assemblies User manual SIPLACE E
3.6 PCB conveyor system From software version SC 708.0 12/2014 Edition
138
3.6.4.2 PCB warpage during placement
A warpage of 2 mm can lead to problems focussing on local fiducials and ink spots in the middle
of the PCB. The digital camera's focus is 2 mm. When all the tolerances are taken into account,
this value is reduced to 1.5 mm. Also note that the component height is reduced by the warpage.
3
3
PCB warpage down, max. 0.5 mm
3
Use magnetic pin supports to achieve this value.
Movable clamping device
Fixed clamped edge
Printed circuit board
Conveyor side wall
Printed circuit board
Magnetic pin
support
Movable clamping device
Fixed clamped edge
Conveyor side wall
0.5 mm
User manual SIPLACE E 3 Technical data and assemblies
From software version SC 708.0 12/2014 Edition 3.7 Vision system
139
3.7 Vision system
3.7.1 Structure
A component camera is integrated at each Collect&Place head (SIPLACE CP14/12/6). The com-
ponent camera, stationary, P&P type 33 GigE, type 36 GigE and type 25 GigE for the SIPLACE
TH/SIPLACE PP head is fixed to the machine frame.
The
component vision module
is used to determine:
– the precise position of the components at the nozzle and
– the geometry of the package form.
The
PCB vision module
uses fiducials on the PCBs to determine:
– the position of the PCB,
– its rotation angle
– and the PCB skew.
The PCB cameras are fixed to the bottom of the gantries. They use fiducials on the
feeder mod
-
ules
to determine the exact pick-up position of components, which is particularly important for
small components.
3 Technical data and assemblies User manual SIPLACE E
3.7 Vision system From software version SC 708.0 12/2014 Edition
140
3.7.2 Component camera, type 30 GigE
Item no. 03101672-xx Component camera, type 30 GigE
3
Fig. 3.7 - 1 Component camera, type 30 GigE
(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
3.7.2.1 Technical data
3
Component dimensions 0.3 mm x 0.3 mm to 27 mm x 27 mm
Component range 03015 to 27 mm x 27 mm
PLCC, SO, QFP, TSDP, SOT, MELF, CHIP, IC BGA
Min. lead pitch 0.3 mm
Min. lead width 0.15 mm
Min. ball pitch 0.25 mm for components < 18 mm x 18 mm
0.35 mm for components < ≥18 mm x 18 mm
Min. ball diameter 0.14 mm for components < 18 mm x 18 mm
0.2 mm for components < ≥18 mm x 18 mm
Field of vision 32 mm x 32 mm
Illumination type Front-illumination (5 levels, programmable as required)