ISM6636A&B_Rev1.10解密.pdf - 第35页

35 Innovision Semiconductor Preliminary Datas heet ISM6636 A/B Rev1.10 01/2023 Package Dimen sion

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Innovision Semiconductor
Preliminary Datasheet
ISM6636A/B
Rev1.10 01/2023
PCB Layout Guidelines
Efficient PCB layout is crucial to the stable operation of the circuit. For best performance,
refer to the figure in the PCB layout column and follow the PCB layout recommendations
below.
1. The input (output) MLCC capacitor shall be as close as possible to the VIN and
PGND(VOUT and PGND) pins and the main MLCC capacitor shall be placed on the
same wiring layer as ISM6636X. The copper plane of VIN,PGND,VOUT can be
maximized to minimize the parasitic impedance.
2. VCC and VIN capacitor should be placed as close to the ISM6636X as possible.
Connect PGND .
3. Place as many PGND holes as possible nearest to the PGND pin to minimize parasitic
impedance and thermal resistance.
4. AGND is connected to the PGND shortest path.
5. The VOS pin is far away from the interference source and connected to the remote
Vout capacitor.
Recommended Land Pattern Recommended PCB layout
35
Innovision Semiconductor
Preliminary Datasheet
ISM6636A/B
Rev1.10 01/2023
Package Dimension
36
Innovision Semiconductor
Preliminary Datasheet
ISM6636A/B
Rev1.10 01/2023
Reflow Specification
Qualification Reflow: We do not recommend users to adopt a fixed reflow curve for
ISM6636X. Many factors affect the selection of an ideal reflow curve. Each PCB shall be
analyzed according to the recommendations of the solder paste manufacturer. The best
reflow curve depends on the overall layout and laminated structure of PCB. The following is
our successful reflow curve for reference.
The qualification preconditioning process specifies a sequence consisting of a bake cycle,
moisture soak cycle (in a temperature humidity oven), and three consecutive solder reflow
cycles, followed by functional device testing.
Production Reflow:
PROFILE FEATURE
Lead-free solder paste assembly
Peak package body temperature (TP)
245
Storage Specifications
The storage specification of the ISM6636X conforms to IPC/JEDEC J-STD-020D.01
Moisture Sensitivity Level (MSL) 3.
After opening moisture-sealed
bag
168 hours -- Storage conditions: ambient ≤30°C at
60%RH