00195987-03_VB_SWS_Software_3.0_DE_EN.pdf - 第33页
SIPLACE SWS Software 3. 0 / Versionsbeschreibung / Ve rsion Description Ausgabe 12/2014 Edition 33 14 SWS Software 3.0 Features The SWS software 3.0 includes all f unctions from the SWS softwar e 2.0 and 2.1 . The follow…
SIPLACE SWS Software 3.0 /
Versionsbeschreibung / Version Description Ausgabe 12/2014 Edition
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13.2 Simplified Navigation in Manual Setting Menu
The menu navigation at Manual setting => Parameter test camera and in the corresponding
Wafer camera and Inspection camera views has been simplified.
A few unnecessary functions, such as Pattern Teaching, have been removed.
13.3 LAN Connection to Station Software 708
In addition to the connection via CAN with the station software 605 SP5, the SWS software
supports a connection to machines via LAN with station software 708.
SIPLACE SWS Software 3.0 /
Versionsbeschreibung / Version Description Ausgabe 12/2014 Edition
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14 SWS Software 3.0 Features
The SWS software 3.0 includes all functions from the SWS software 2.0 and 2.1. The following
section describes the main new features in version 3.0 of the SWS software.
NOTE
For details about the individual functions, please refer to the software manual for
the "SIPLACE SWS Software 3.0 [item no.: 00195986-03].
14.1 New Main Functions – Messages
In the views toolbar, click on the Messages button.
The Messages => History view shows all information, warnings and error messages which
have been issued.
The Messages => Saved SIPLACE Vision dump files enables you to open and view the
saved SIPLACE Vision dump files. In earlier versions, this function could be found at Manual
Setting => Image viewer.
SIPLACE SWS Software 3.0 /
Versionsbeschreibung / Version Description Ausgabe 12/2014 Edition
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14.2 Manual Setting => Vacuum System
The Vacuum System view allows you to check the vacuum system for air-tightness.
Select Manual Setting and click on the Vacuum System button.
14.3 Improving Die Recognition Teaching
The teaching procedure at Process -> Die recognition -> tab: Die or Reference die has been
improved. The definition of the teaching and search areas has been simplified. The rotation
calibration is now performed automatically.
Automatic referencing is now also performed for the Plain Wafer.
14.4 Automatic Referencing for Plain Wafer
Automatic referencing is now also performed for the Plain Wafer.
Plain wafers can now also be referenced without specifying a start die in advance. This can also be
applied to partially processed wafers.