User Manual E-by-SIPLACE 用户手册.pdf - 第142页
3 Technical data and assemblies User manual E by SIPLACE 3.7 Vision system From software version SC 712.1 Edition 05/2019 142 3.7 Vision system 3.7.1 Structure A compone nt camer a is integrated at each Collect&Place…
User manual E by SIPLACE 3 Technical data and assemblies
From software version SC 712.1 Edition 05/2019 3.6 PCB conveyor system
141
3.6.4.2 PCB warpage during placement
3
3
Changes in the surface position are automatically applied by the functions for learning the height.
3
3
PCB warpage up, max. 2 mm
PCB warpage down, max. 2 mm
0.5 mm
To avoid impairing the placement quality and speed, we recommend using a PCB support e.g. Smart Pin
Support so that the PCB warpage downwards does not exceed 0.5 mm.
3 Technical data and assemblies User manual E by SIPLACE
3.7 Vision system From software version SC 712.1 Edition 05/2019
142
3.7 Vision system
3.7.1 Structure
A component camera is integrated at each Collect&Place head (SIPLACE CP14/12/6). The com-
ponent camera, stationary, P&P type 33 GigE, type 36 GigE and type 25 GigE for the SIPLACE
TH/SIPLACE PP head is fixed to the machine frame.
The
component vision module
is used to determine:
– the precise position of the components at the nozzle and
– the geometry of the package form.
The
PCB vision module
uses fiducials on the PCBs to determine:
– the position of the PCB,
– its rotation angle
– and the PCB skew.
The PCB cameras are fixed to the bottom of the gantries. They use fiducials on the
feeder mod
-
ules
to determine the exact pick-up position of components, which is particularly important for
small components.
User manual E by SIPLACE 3 Technical data and assemblies
From software version SC 712.1 Edition 05/2019 3.7 Vision system
143
3.7.2 Component camera, type 30 GigE
Item no. 03101672-xx Component camera, type 30 GigE
3
Fig. 3.7 - 1 Component camera, type 30 GigE
(1) Component camera lens and illumination
(2) Camera amplifier
(3) Illumination control
3.7.2.1 Technical data
3
Component dimensions 0.18 mm x 0.18 mm to 27 mm x 27 mm
Component range 01005 to 27 mm x 27 mm
PLCC, SO, QFP, TSDP, SOT, MELF, CHIP, IC BGA
Min. lead pitch 0.3 mm
Min. lead width 0.15 mm
Min. ball pitch 0.25 mm for components < 18 mm x 18 mm
0.35 mm for components < ≥18 mm x 18 mm
Min. ball diameter 0.14 mm for components < 18 mm x 18 mm
0.2 mm for components < ≥18 mm x 18 mm
Field of vision 32 mm x 32 mm
Illumination type Front-illumination (5 levels, programmable as required)