SS-1189-002.pdf

SS-925 SS-1189-002 0707-002 GXH-3 Standard Specifications CHIP MOUNTER

SS-925

SS-1189-002

0707-002

GXH-3

Standard Specifications

CHIP MOUNTER

SS-1189

1. Scope ·······································································································1

2. Features ···································································································1

3. Specifications ···························································································6

3.1 Mechanical Specifications·································································6

3.1.1 Mechanical Construction ··························································6

3.1.2 Mechanical Specifications ························································6

3.2 Electrical Specifications ····································································10

3.2.1 Control Configuration ································································11

3.2.2 Electrical Specifications ····························································11

The contents described in this manual are subject to change without prior notice.

0707-002

Attention : Trademarks and Registered Trademarks

• Windows is a registered trademark of the Microsoft

Corporation in the United States and other countries.

• All other corporate and product names in this manual are

owned by and are the trademarks or registered trademarks

of their respective companies.

Neither (TM) nor (R) marks are described clearly in this

manual.

CONTENTS

Page

SS-1189

1. Scope

This machine is provided with a batch recognition system by which various

kinds of electronic components (simply called "Components" hereinafter) can

be recognized in batch and realizes highly accurate component placement on

the PCBs at high speed.

The machine is also equipped with four beams, four heads, and four

component recognition cameras, making it possible to handle many different

kinds of components in small lots or few different kinds of component in large

lots for diversified scales of production.

The machine introduces our latest technologies such as direct drive heads,

X/Y-axis linear motor driving, etc., that have been used in the past actual

production and is provided with various functions for reduction of OOS (out

of service) time. That is the reason why this high-speed mounter is called

"Direct Drive Modular Mounter with High Total Productivity for Next

Generation".

2. Features

Realization of High Productivity

• High productivity by the throughput of 95,000 CPH

• Each head has 12 nozzles and the shuttling frequency of the beams is

reduced, realizing high throughput.

• Linear motors are used to drive the X/Y axes, realizing the highly accurate

and reliable component placement at high speed.

• The nonstop batch recognition system realized the high-speed and highly

accurate recognition of components.

Collective Image Capture of 12 Components

(Example: 0603 to 4532)

Fig. 1

• Realization of "2.5 seconds or less" (PCB Transfer Speed with PCB Size

155 mm or less)

• The tape feeders are driven by the motors, realizing the high-speed and

reliable tape feeding performance.

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