SS-1189-002.pdf - 第4页

2 SS-1189 • The bank feeder change carts made it possible to reduce the feeder setup time. Fig. 2 • The tape splicing function is adopted to keep the machine running for continuous production. • The PCB Y position can be…

SS-1189

1. Scope

This machine is provided with a batch recognition system by which various

kinds of electronic components (simply called "Components" hereinafter) can

be recognized in batch and realizes highly accurate component placement on

the PCBs at high speed.

The machine is also equipped with four beams, four heads, and four

component recognition cameras, making it possible to handle many different

kinds of components in small lots or few different kinds of component in large

lots for diversified scales of production.

The machine introduces our latest technologies such as direct drive heads,

X/Y-axis linear motor driving, etc., that have been used in the past actual

production and is provided with various functions for reduction of OOS (out

of service) time. That is the reason why this high-speed mounter is called

"Direct Drive Modular Mounter with High Total Productivity for Next

Generation".

2. Features

Realization of High Productivity

• High productivity by the throughput of 95,000 CPH

• Each head has 12 nozzles and the shuttling frequency of the beams is

reduced, realizing high throughput.

• Linear motors are used to drive the X/Y axes, realizing the highly accurate

and reliable component placement at high speed.

• The nonstop batch recognition system realized the high-speed and highly

accurate recognition of components.

Collective Image Capture of 12 Components

(Example: 0603 to 4532)

Fig. 1

• Realization of "2.5 seconds or less" (PCB Transfer Speed with PCB Size

155 mm or less)

• The tape feeders are driven by the motors, realizing the high-speed and

reliable tape feeding performance.

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SS-1189

• The bank feeder change carts made it possible to reduce the feeder setup

time.

Fig. 2

• The tape splicing function is adopted to keep the machine running for

continuous production.

• The PCB Y position can be optimized to reduce the loss in cooperative

actions of the confronting beam.

PCB Flow Direction: From Left to Right

Fig. 3

• The PCB support pins can be exchanged collectively, improving the

internal setup performance.

• The internal optimization function made it possible to re-generate the

pattern program data according to the circumstantial changes for the

machine.

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Buffer

Input

Positioning

Output

Optimization of PCB Y Position

Bank Feeder Change Cart

SS-1189

Realization of High Reliability

• Component thickness measurement

Linear measure sensor by the Component thickness measurement

• P.C.B upper surface measurement

Measure the P.C.B upper surface by the P.C.B height feed back function

• Soft placement

Soft mount nozzle to place the component lightly

• Each nozzle is provided with an electromagnetic valve to realize the

optimum control of vacuum ON/OFF actions.

• The following effects can be expected by using the tape feeder provided

with a joint detection unit.

Preventing the mis-placement of spliced and replenished components

Eliminating pickup errors caused due to component shortage

Establishing traceability under component replenishment (tape splicing)

Correcting the count (the number of remaining components)

Operating Condition

Applicable Feeders : GD-18080, GD-18081, GD-18082

GD-12161, GD-24321, GD-44561

Operation Mode : "Enable" for "Component Remain Mode"

Component ID Lookup : Used together with the ACV system (option)

※ It is also possible to use the tape feeders for GXH-1 series

However the cycle time of component pick-up is longer than one for the

GXH-3 series tape feeders

Tape feeder provided

with a joint detection unit

Vacuum point

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